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Investigation of Liquid Cooling Plate for Server CPUs Based on Topology Optimization
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作者 Guijun Ai Yingying Luo Wei Su 《Journal of Electronics Cooling and Thermal Control》 2024年第1期1-34,共34页
In this study, a microchannel liquid cooling plate (LCP) is proposed for Intel Xeon 52.5 mm * 45 mm packaged architecture processors based on topology optimization (TO). Firstly, a mathematical model for topology opti... In this study, a microchannel liquid cooling plate (LCP) is proposed for Intel Xeon 52.5 mm * 45 mm packaged architecture processors based on topology optimization (TO). Firstly, a mathematical model for topology optimization design of the LCP is established based on heat dissipation and pressure drop objectives. We obtain a series of two-dimensional (2D) topology optimization configurations with different weighting factors for two objectives. It is found that the biomimetic phenomenon of the topologically optimized flow channel structure is more pronounced at low Reynolds numbers. Secondly, the topology configuration is stretched into a three-dimensional (3D) model to perform CFD simulations under actual operating conditions. The results show that the thermal resistance and pressure drop of the LCP based on topology optimization achieve a reduction of approximately 20% - 50% compared to traditional serpentine and microchannel straight flow channel structures. The Nusselt number can be improved by up to 76.1% compared to microchannel straight designs. Moreover, it is observed that under high flow rates, straight microchannel LCPs exhibit significant backflow, vortex phenomena, and topology optimization structures LCPs also tend to lead to loss of effectiveness in the form of tree root-shaped branch flows. Suitable flow rate ranges for LCPs are provided. Furthermore, the temperature and pressure drop of experimental results are consistent with the numerical ones, which verifies the effectiveness of performance for topology optimization flow channel LCP. 展开更多
关键词 CPU SEVER Data Center Topology Optimization liquid Cooling Plate
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Immersing Treatment of Steel Plate Surface in Steel-Aluminum Solid to Liquid Bonding 被引量:2
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作者 Peng Zhang Yunhui Du +4 位作者 Xueping Ren Yonglin Kang Hanwu Liu Jianzhong Cui Limin Ba (Material Science and Engineering School, University of Science and Technique Beijing, Beijing 100083, China)(Metal Forming Department Northeastern University, Shenyang 1 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 1999年第1期57-60,共4页
The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and... The interfacial status of the steel-aluminum solid to liquid bonding plates (their steel plate surfaces were or were not immersed in flux aqueous solution) were measured by using SEM (Scanning Electron Microscope) and X-ray diffraction . The results showed that the layer of flux (the minimum thickness was 15 μm on the steel plate surface) could protect the steel plate surface from oxidizing effectively at high temperature in solid to liquid bonding. The melt temperatUre of the flux should be lower than 580 ℃ so that it could be melted and removed completely. No. 1 flux (patent product made by the author) made up of halogeindes could also force liquid aluminum to infiltrate into steel plate surface and thus the interfacial shear strength of the bonding plate was rather large. 展开更多
关键词 steel-aluminum solid to liquid bonding plate steel plate surface immerse flux melt temperature interfacial shear shrength
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The Bonding Properties of Solid Steel to Liquid Aluminum
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作者 张鹏 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2005年第1期25-29,共5页
The bonding of solid steel plate to liquid al uminum was studied using rapid solidification. The relationship models of interf acial shear strength and thickness of interfacial layer of bonding plate vs bond ing para... The bonding of solid steel plate to liquid al uminum was studied using rapid solidification. The relationship models of interf acial shear strength and thickness of interfacial layer of bonding plate vs bond ing parameters (such as preheat temperature of steel plate, temperature of alumi num liquid and bonding time) were respectively established by artificial neural networks perfectly.The bonding parameters for the largest interfacial shear stre ngth were optimized with genetic algorithm successfully. They are 226℃ for preh eating temperature of steel plate, 723℃ for temperature of aluminum liquid and 15.8s for bonding time, and the largest interfacial shear strength of bonding pl ate is 71.6 MPa . Under these conditions, the corresponding reasonable thickne ss of interfacial layer (10.8μm) is gotten using the relationship model establi shed by artificial neural networks. 展开更多
关键词 bonding of steel plate to liquid aluminum rapid solidification artificial neural networks genetic algorithm
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Thickness of compound layer in steel-aluminum solid to liquid bonding
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作者 PengZhang YunhuiDu +4 位作者 HanwuLiu ShumingXing DabenZeng JianzhongCui LiminBa 《Journal of University of Science and Technology Beijing》 CSCD 2003年第5期48-52,共5页
The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to d... The bonding of solid steel plate to liquid aluminum was studied using rapidsolidification. The surface of solid steel plate was defatted, descaled, immersed (in K_2ZrF_6 fluxaqueous solution) and stoved. In order to determine the thickness of Fe-Al compound layer at theinterface of steel-aluminum solid to liquid bonding under rapid solidification, the interface ofbonding plate was investigated by SEM (Scanning Electron Microscope) experiment. The relationshipbetween bonding parameters (such as preheat temperature of steel plate, temperature of aluminumliquid and bonding time) and thickness of Fe-Al compound layer at the interface was established byartificial neural networks (ANN) perfectly. The maximum of relative error between the output and thedesired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacialshear strength of bonding plate (226℃ for preheat temperature of steel plate, 723℃ for temperatureof aluminum liquid and 15.8 s for bonding time), the reasonable thickness of Fe-Al compound layer10.8 μm was got. 展开更多
关键词 bonding of steel plate to liquid aluminum rapid solidification thickness ofFe-Al compound layer artificial neural networks
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Thermal Management Optimization of a Lithium-Ion Battery Module with Graphite Sheet Fins and Liquid Cold Plates 被引量:1
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作者 Guohua Wang Qing Gao +1 位作者 Yuying Yan Yongzhen Wang 《Automotive Innovation》 CSCD 2020年第4期336-346,共11页
Temperature uniformity of lithium-ion batteries and maintaining the temperature within the range for efficient operation are addressed.First,Liquid cold plates are placed on the sides of a prismatic battery,and fins m... Temperature uniformity of lithium-ion batteries and maintaining the temperature within the range for efficient operation are addressed.First,Liquid cold plates are placed on the sides of a prismatic battery,and fins made of aluminum alloy or graphite sheets are applied between battery cells to improve the heat transfer performance.Then a simulation model is built with 70 battery cells and 6 liquid cold plates,and the performance is analyzed according to the flow rate,liquid temperature,and discharge rate.Finally,the results show that temperature differences are mainly caused by the liquid cold plates.The fin surface determines the equivalent thermal conductivity of the battery.The graphite sheets have heterogeneous thermal conductivity,which help improve temperature uniformity and reduce the temperature gradient.With lower density than the aluminum alloy,they offer a lower gravimetric power density for the same heat transfer capacity.In addition to the equivalent thermal conductivity,the temperature difference between the cooling liquid and battery surface is an important parameter for temperature uniformity.Optimizing the fin thickness is found to be an effective way to reduce the temperature difference between the liquid and battery during cooling and improve the temperature uniformity. 展开更多
关键词 Thermal management Lithium-ion battery liquid cold plate Temperature uniformity
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High Azimuthal Index Doughnut Beam Generated by Liquid Crystal Spiral Phase Plates
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作者 Ping Shum 《光学学报》 EI CAS CSCD 北大核心 2003年第S1期859-860,共2页
A novel technique of producing azimuthal index 1>1 doughnut beam of good quality by use of multi-liquid crystal cells is presented, it has the advantages of high conversion efficiency and flexibility.
关键词 by as In HIGH be THAN High Azimuthal Index Doughnut Beam Generated by liquid Crystal Spiral Phase Plates in that LG of
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The propagation of Lamb waves in an anisotropic plate bordered with liquid layers
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作者 YAN Ping, ZHU Zhemin, DU Gonghuan (State Keg Lab of Modern Acoustics & Institute of Acoustics, Nanjing University Nanjing 210093) 《Chinese Journal of Acoustics》 2002年第2期161-168,共8页
Based on elastic wave propagation theory, the dispersion equation for a thin anisotropic plate (such as commonly used Zinc okide in micro-transducers) bordered with liquid layers is derived. Higher symmetry crystals, ... Based on elastic wave propagation theory, the dispersion equation for a thin anisotropic plate (such as commonly used Zinc okide in micro-transducers) bordered with liquid layers is derived. Higher symmetry crystals, such as orthorhombic, tetragonal, cubic, isotropic, are included in this analysis as well. For the case of one liquid layer loading, numerical calcu- lations show that the phase velocity changes periodically with the thickness of the liquld layer. When the thickness 2d of the anisotropic plate is very small, mass sensing application of Ao mode Lamb wave is also discussed. 展开更多
关键词 MODE The propagation of Lamb waves in an anisotropic plate bordered with liquid layers
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