By using LPCVD SiO 2 and poly silicon as sacrificial layer and cantilever respectively,a poly silicon micromachined RF MEMS(radio frequency microelectronic mechanical system) switch is fabricated.During the fabrica...By using LPCVD SiO 2 and poly silicon as sacrificial layer and cantilever respectively,a poly silicon micromachined RF MEMS(radio frequency microelectronic mechanical system) switch is fabricated.During the fabrication process,the stress of poly silicon is released to prevent poly silicon membrane from bending,and the issue of compatibility between RF switch and IC process technology is also resolved.The low residual tensile stress poly silicon cantilever is obtained by the optimization.The switch is tested,and the preliminary test results show:the pull down voltage is 89V,and the switch speed is about 5μs.The switch provides the potential to build a new fully monolithic integrated RF MEMS for radar and communications applications.展开更多
A novel low temperature poly\|Si(LTPS) ultra\|thin channel thin film transistor (UTC\|TFT) technology is proposed. The UTC\|TFT has an ultra\|thin channel region (30nm) and a thick drain/source region (300nm). The ult...A novel low temperature poly\|Si(LTPS) ultra\|thin channel thin film transistor (UTC\|TFT) technology is proposed. The UTC\|TFT has an ultra\|thin channel region (30nm) and a thick drain/source region (300nm). The ultra\|thin channel region that can result in a lower grain\|boundary trap density in the channel is connected to the heavily\|doped thick drain/source region through a lightly\|doped overlapped region. The overlapped lightly\|doped region provides an effective way for the electric field to spread in the channel near the drain at high drain biases, thereby reducing the electric field there significantly. Simulation results show the UTC\|TFT experiences a 50% reduction in peak lateral electric field compared to that of the conventional TFT. With the low grain\|boundary trap density and low drain electric field, excellent current saturation characteristics and high drain breakdown voltage are achieved in the UTC\|TFT. Moreover, this technology provides the complementary LTPS\|TFTs with more than 2 times increase in on\|current, 3.5 times reduction in off\|current compared to the conventional thick channel LTPS TFTs.展开更多
文摘By using LPCVD SiO 2 and poly silicon as sacrificial layer and cantilever respectively,a poly silicon micromachined RF MEMS(radio frequency microelectronic mechanical system) switch is fabricated.During the fabrication process,the stress of poly silicon is released to prevent poly silicon membrane from bending,and the issue of compatibility between RF switch and IC process technology is also resolved.The low residual tensile stress poly silicon cantilever is obtained by the optimization.The switch is tested,and the preliminary test results show:the pull down voltage is 89V,and the switch speed is about 5μs.The switch provides the potential to build a new fully monolithic integrated RF MEMS for radar and communications applications.
文摘A novel low temperature poly\|Si(LTPS) ultra\|thin channel thin film transistor (UTC\|TFT) technology is proposed. The UTC\|TFT has an ultra\|thin channel region (30nm) and a thick drain/source region (300nm). The ultra\|thin channel region that can result in a lower grain\|boundary trap density in the channel is connected to the heavily\|doped thick drain/source region through a lightly\|doped overlapped region. The overlapped lightly\|doped region provides an effective way for the electric field to spread in the channel near the drain at high drain biases, thereby reducing the electric field there significantly. Simulation results show the UTC\|TFT experiences a 50% reduction in peak lateral electric field compared to that of the conventional TFT. With the low grain\|boundary trap density and low drain electric field, excellent current saturation characteristics and high drain breakdown voltage are achieved in the UTC\|TFT. Moreover, this technology provides the complementary LTPS\|TFTs with more than 2 times increase in on\|current, 3.5 times reduction in off\|current compared to the conventional thick channel LTPS TFTs.
