Mechanism of primary Si and Fe-segregation for a hypereutectic 90 wt.%Si-Ti alloy melt in directional solidification via electromagnetism

The electromagnetic directional solidification(DS)phase separation experiments of high silicon 90 wt.%Si–Ti alloy were performed under various pulling-down speeds.The results showed that Si enriched layer,Si+TiSi_(2)-rich layer and Si–Ti–Fe alloy layer appeared successively in axial direction of ingot after electromagnetic DS of 90 wt.%Si–Ti alloy melt at different pulling-down speeds.Separation of primary Si and segregation mechanism of metal impurities(Fe)during the electromagnetic DS process were controlled by pulling-down speed of ingot and electromagnetic stirring.When pulling-down speed was 5μm/s,minimum thickness of the Si enriched layer was 29.4 mm,and the highest content of primary Si in this layer was 92.46 wt.%;meanwhile,the highest removal rate of Fe as metal impurity was 92.90%.The type of inclusions in the Si enriched layer is determined by Fe content of segregated Si enriched layer.When the pulling-down speed was 5μm/s,the inclusions in the Si enriched layer were TiSi_(2).Finally,when the pulling-down speed reached greater than 5μm/s,the inclusions in the Si enriched layer evolved into TiSi_(2)+τ_(5).

Microstructure and brazing mechanism of porous Si_3N_4/Invar joint brazed with Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler

Porous Si3N4 was brazed to Invar alloy in this study, and Ag-Cu-Ti/Cu/Ag-Cu multi-layered filler was designed to inhibit the formation of Fe2Ti and Ni3Ti intermetallic compounds. The effects of the brazing temperature and the thickness of Cu interlayer on the microstructure and mechanical properties of brazed joints were investigated. The typical microstructure of the joint brazed with multi-layered filler was porous Si3N4/TiN ＋ Ti5Si3/Ag-Cu eutectic[Cu[Ag-Cu eutectic/Cu-rich layer ＋ diffusion layer/Invar. When the brazing temperature increased, the reaction layer at the ceramic/filler interface grew thicker and the Cu interlayer turned thinner. As the thickness of Cu interlayer increased from 50 to 150 μm, the joint strength first increased and then decreased. In this research, the maximum shear strength （73 MPa） was obtained when being brazed at 1173 K with a 100 μm Cu interlayer applied in the filler, which was 55% higher than that brazed with single Ag-Cu-Ti brazing alloy and had reached 86% of the ceramic. The release of residual stress and the barrier effect of Cu interlayer to inhibit the formation of Fe2Ti and Ni3Ti intermetallics played the major role in the improvement of joint strength.