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Synthesis and microwave characterization of Co-SiC core-shell powders by electroless plating 被引量:1
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作者 ZHANG Haijun WU Xiangwei JIA Quanli JIA Xiaolin 《Rare Metals》 SCIE EI CAS CSCD 2006年第3期216-220,共5页
Co-SiC core-shell powders were prepared by electroless plating. Scanning electron microscopy (SEM) revealed that Co-SiC core-shell powders were of nearly sphere-like shape and were about 0.3 pan. X-ray powder diffra... Co-SiC core-shell powders were prepared by electroless plating. Scanning electron microscopy (SEM) revealed that Co-SiC core-shell powders were of nearly sphere-like shape and were about 0.3 pan. X-ray powder diffraction (XRD) patterns showed that the cobalt powder was hexagonal crystallite. The complex dielectric constant and the complex permeability of Co-SiC core-shell powders-paraffin wax composite were measured by the rectangle wavegnide method. It showed that the dielectric loss was less than 0.1 and the magnetic loss was about 0.2 in 8.2-12.4 GHz for prepared Co-SiC core-shell comoosite oowders. 展开更多
关键词 Co-SiC CORE-SHELL powderS electroless plating dielectric constant PERMEABILITY
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Development of copper coatings on molybdenum powders by electroless plating technique 被引量:3
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作者 王光君 王德志 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期803-807,共5页
Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was s... Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was studied. The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD. The results indicate that the Mo powders are coated with copper,at the same time,Mo-Cu composite powders with Cu content ranging from 15% to 85%(mass fraction) can be obtained. The optimal values of pH,HCHO concentration and temperature are in the ranges of 12-13,22-26 ml/L and 60-65 ℃,respectively. The diffusion-shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface. 展开更多
关键词 化学镀铜 生长机制
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Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique 被引量:3
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作者 WANG Guangjun WANG Dezhi 《Rare Metals》 SCIE EI CAS CSCD 2008年第4期434-438,共5页
Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper ... Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope (SEM) and the phases were analyzed using X-my diffrction (XRD). An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface. 展开更多
关键词 copper coatings electroless plating copper molybdenum powders composite materials growth model
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Preparation of Core-shell Cu-Ag Bimetallic Powder via Electroless Coating
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作者 徐锐 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2009年第4期637-639,共3页
A novel method of electroless silver coating on copper powders was reported, in which hydrazine was used as the reducing agent, and had some advantages such was used as inhibiting the substitution reaction and reducin... A novel method of electroless silver coating on copper powders was reported, in which hydrazine was used as the reducing agent, and had some advantages such was used as inhibiting the substitution reaction and reducing consumption of copper powders. In the processes of sensitization and activation, AgNO3 replaces the conventional PdCl2, which solves the impurity of bath. Oxide film on the surface of copper powders was tested by chemical analysis. Ag element tested by XRD and XRF is in the form of Ago and exists on the surface of copper powders, which acts as catalyzer in reduction reaction. Morphology and composition of the coating were characterized by SEM and XRD respectively. 展开更多
关键词 CORE-SHELL bimetallic powders electroless coating
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Preparation of Ni/C core-shell composite powders by electroless plating method
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作者 张海军 刘云 +1 位作者 贾全利 贾晓林 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期1144-1147,共4页
Ni/C core-shell composite powders were prepared by electroless nickel-plating. The effects of concentration of NiSO4,bathing temperature,ratio of hydrazine hydrate to NiSO4,pH of the solution,amounts of complexing rea... Ni/C core-shell composite powders were prepared by electroless nickel-plating. The effects of concentration of NiSO4,bathing temperature,ratio of hydrazine hydrate to NiSO4,pH of the solution,amounts of complexing reagent and surfactant,bath load of activated carbon and reaction time,and so on,on the preparation of Ni/C core-shell composite powders were studied. The results show that the principal factors for Ni/C composite powders preparation are bathing temperature,ratio of hydrazine hydrate to NiSO4 and pH of the solution. The optimum conditions are plating at 90 ℃ with pH10.7 and molar ratio of N2H4·H2O to Ni2+of 3.0. The plated nickel powders are observed to be sphere-like in morphology with size about 100 nm. The maximum dielectric loss of Ni/C core-shell composite powders is about 0.35,and its magnetic loss was low with value about 0 in 2-16 GHz. 展开更多
关键词 镍/碳复合粉末 制备方法 化学镀 金属表面防护
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Fabrication of W@Cu Composite Powders by Direct Electroless Plating Using a Dripping Method
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作者 刘树龙 YU Kan +4 位作者 沈强 LI Meijuan CHEN Wenshu LUO Guoqiang ZHANG Lianmeng 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2013年第4期829-833,共5页
A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C2H203) as a reducing agent was reported. The effects of copper sul... A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C2H203) as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions (flow rate of C2H203 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35℃) by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu~. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed. 展开更多
关键词 dripping method electroless plating W@Cu composite powders characterization
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化学镀温度对镀银镍粉的微观结构及其性能的影响
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作者 苏晓磊 张聪聪 +2 位作者 刘毅 贾艳 卢琳琳 《西安工程大学学报》 CAS 2024年第3期52-60,共9页
为探究在镀银镍粉制备过程中温度对其性能的影响,以硝酸银为银源,Ni颗粒为基材,采用置换-还原化学复合镀法制备镀银镍粉。以粉体为填料,不饱和聚酯树脂为基体,制备导电涂层,并对其导电性和电磁屏蔽性进行测试分析。利用扫描电子显微镜... 为探究在镀银镍粉制备过程中温度对其性能的影响,以硝酸银为银源,Ni颗粒为基材,采用置换-还原化学复合镀法制备镀银镍粉。以粉体为填料,不饱和聚酯树脂为基体,制备导电涂层,并对其导电性和电磁屏蔽性进行测试分析。利用扫描电子显微镜、能谱仪、X射线衍射仪、松装密度测试仪、振实密度测试仪、直流低电阻测试仪等对镀银镍粉微观形貌和宏观特征进行表征与测试分析。结果表明:当化学镀温度为40℃,所制镀银镍粉的Ag层包覆完整、均匀、致密,银的质量分数可达75.01%,粉体的压实电阻可低至293.15 mΩ。粉体松装密度为5.417 g·cm^(-3),振实密度为5.778 g·cm^(-3)。所制导电涂层的电阻率为4.30 mΩ·cm,电磁屏蔽效能为45.27 dB,具有良好的电磁屏蔽性能。 展开更多
关键词 银包镍粉 化学镀 压实电阻率 导电涂层 电磁屏蔽
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Fabrication and characterization copper/diamond composites for heat sink application using powder metallurgy 被引量:3
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作者 Zeinab Abdel Hamid Sayed F. Moustafa +2 位作者 Fatma A. Morsy Nevien Abdel Atty khalifa Fatma Abdel Mouez 《Natural Science》 2011年第11期936-947,共12页
Copper composites reinforced with diamond particles were fabricated by the powder metallurgical technique. Copper matrix and diamond powders were mixed mechanically, cold com- pacted at 100 bar then sintered at 900?C.... Copper composites reinforced with diamond particles were fabricated by the powder metallurgical technique. Copper matrix and diamond powders were mixed mechanically, cold com- pacted at 100 bar then sintered at 900?C. The prepared powders and sintered copper/diamond composites were investigated using X-ray diffraction (XRD) and scanning electron microscope equipped with an energy dispersive X-ray analysis (SEM/EDS). The effect of diamond contents in the Cu/diamond composite on the different properties of the composite was studied. On fracture surfaces of the Cu/uncoated diamond composites, it was found that there is a very weak bonding between diamonds and pure copper matrix. In order to improve the bonding strength between copper and the reinforcement, diamond particles were electroless coated with NiWB alloy. The results show that coated diamond particles distribute uniformly in copper composite and the interface between diamond particles and Cu matrix is clear and well bonded due to the formation of a thin layer from WB2, Ni3B, and BC2 between Cu and diamond interfaces. The properties of the composites materials using coated powder, such as hardness, transverse rupture strength, thermal conductivity, and coefficient of thermal expansion (CTE) were exhibit greater values than that of the composites using uncoated diamond powder. Additionally, the results reveals that the maximum diamond incorporation was attained at 20 Vf%. Actually, Cu/20 Vf% coated diamond com- posite yields a high thermal conductivity of 430 W/mK along with a low coefficient of thermal expansion (CTE) 6 × 10–6/K. 展开更多
关键词 powder METALLURGY Ceramic-Matrix COMPOSITES (CMCs) Ceramics Coating electroless
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Production of Ni-W-P Powder by the Combined Use of Hypophoshorous Acid Reduction and Ultrasonic Reduction
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作者 Atsushi Chiba Kenta Goto 《材料科学与工程(中英文版)》 2010年第8期85-91,共7页
关键词 超声波频率 电镀生产 催化还原法 可湿性粉剂 应用 镍粉 金属微粒 静止状态
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铜包覆Ti_(2)AlC增强铜基复合材料的制备及性能
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作者 朱雁风 《材料热处理学报》 CAS CSCD 北大核心 2023年第10期51-58,共8页
通过化学镀技术在Ti_(2)AlC粉体表面镀上一层金属铜,然后以铜粉、镀铜Ti_(2)AlC粉为原料,采用烧结法制备了10%Ti_(2)AlC/Cu复合材料。结果表明:化学镀铜溶液pH为11~12时,Ti_(2)AlC粉体表面的铜镀层光滑致密、不易脱落。10%Ti_(2)AlC/Cu... 通过化学镀技术在Ti_(2)AlC粉体表面镀上一层金属铜,然后以铜粉、镀铜Ti_(2)AlC粉为原料,采用烧结法制备了10%Ti_(2)AlC/Cu复合材料。结果表明:化学镀铜溶液pH为11~12时,Ti_(2)AlC粉体表面的铜镀层光滑致密、不易脱落。10%Ti_(2)AlC/Cu复合材料的组织分布均匀,镀铜Ti_(2)AlC颗粒与铜基体结合紧密;复合材料相对密度为94.31%,导电性能和硬度相对于纯铜稍有下降;复合材料的平均摩擦系数随着载荷的增加稍微下降,从10 N时的0.4862到30 N时的0.3858,相对于纯铜有明显降低;复合材料的磨损率随着载荷增加逐渐下降,从10 N时的0.208 g·N^(-1)·m^(-1)变为30 N时的0.147 g·N^(-1)·m^(-1)。表明复合材料具有较好的耐磨性。 展开更多
关键词 铜基复合材料 摩擦系数 Ti_(2)AlC粉体 化学镀铜
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WC-12Ni@Ni-MoS_(2)核壳结构复合粉体工艺改进
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作者 王晋枝 刘新宇 何文斌 《煤炭与化工》 CAS 2023年第7期131-133,149,共4页
为了解决WC-12Ni@Ni-MoS_(2)自润滑核壳结构复合粉体壳层疏松、厚度不均、元素分布不均的问题,研究了化学镀制备工艺中粉体固含量、表面活性剂类型、搅拌方式、粉体粒径大小对复合粉体的影响。结果表明,在75 g/L WC-12Ni待镀粉体粒径分... 为了解决WC-12Ni@Ni-MoS_(2)自润滑核壳结构复合粉体壳层疏松、厚度不均、元素分布不均的问题,研究了化学镀制备工艺中粉体固含量、表面活性剂类型、搅拌方式、粉体粒径大小对复合粉体的影响。结果表明,在75 g/L WC-12Ni待镀粉体粒径分布均匀且范围小的情况下添加HPB阳离子型表面活性剂、7.5 g/L MoS_(2)自润滑粉体,NiCl_(2)·6H_(2)O作主盐,DMAB作还原剂持续均匀定量加入,1200 r/min机械搅拌,85℃化学镀20 min制备的WC-12Ni@Ni-MoS_(2)核壳结构复合粉体壳层致密,厚度均匀,元素分布均匀,且试验可重复率高。 展开更多
关键词 化学镀 二硫化钼 硬质合金粉体 核壳结构 自润滑 复合粉体
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自组装膜吸附钯的化学镀前活化研究 被引量:16
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作者 徐丽娜 徐鸿飞 +6 位作者 周凯常 徐爱群 岳增全 顾宁 张海黔 刘举正 陈坤基 《物理化学学报》 SCIE CAS CSCD 北大核心 2002年第3期284-288,共5页
提出了一种无需氯化亚锡敏化、基于分子自组装膜(SAMs)吸附钯的活化方法,成功地引发了在氧化铝粉末表面的化学镀铜.用XPS、AES、FTIR研究了钯的吸附机理,认为是由于氯化钯与SAMs上向外突出的氨基形成了化学键,并提出了相应的活化机理.... 提出了一种无需氯化亚锡敏化、基于分子自组装膜(SAMs)吸附钯的活化方法,成功地引发了在氧化铝粉末表面的化学镀铜.用XPS、AES、FTIR研究了钯的吸附机理,认为是由于氯化钯与SAMs上向外突出的氨基形成了化学键,并提出了相应的活化机理.金属化产物经XRD、FTIR、剖面金相显微表征分析与压片电阻率测定,示为金属铜完全包覆氧化铝的复合材料.该活化工艺具有活性引发层厚度薄、寿命长和与基底结合力强等优点,也可应用于其它表面富羟基的基底材料. 展开更多
关键词 自组装膜 吸附 活化方法 氧化铝粉末 化学镀 镀前活化 金属/陶瓷复合粉末材料
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NiB、NiB/MgO非晶态合金催化剂的制备、表征及其加氢性能 被引量:13
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作者 王来军 张明慧 +2 位作者 李伟 王鹏飞 陶克毅 《石油化工》 CAS CSCD 北大核心 2004年第1期14-19,共6页
以KBH4为还原剂、NiSO4为被还原盐、PdCl2为诱导剂,采用诱导化学沉积法制备了系列NiB非晶态合金催化剂。将微量PdCl2负载于MgO载体上,通过化学镀法制备了NiB/MgO负载型非晶态合金催化剂。用XRD,ICP,SEM,TEM技术对催化剂的物性进行了表征... 以KBH4为还原剂、NiSO4为被还原盐、PdCl2为诱导剂,采用诱导化学沉积法制备了系列NiB非晶态合金催化剂。将微量PdCl2负载于MgO载体上,通过化学镀法制备了NiB/MgO负载型非晶态合金催化剂。用XRD,ICP,SEM,TEM技术对催化剂的物性进行了表征,并将其用于环丁烯砜加氢反应。研究了制备条件(B/Ni摩尔比、NH3/Ni摩尔比及诱导剂的用量)对非晶态合金催化剂物化性能的影响。确定了制备NiB非晶态合金催化剂的最佳条件:硼镍摩尔比为2/1及NH3/Ni摩尔比为19/1。对于NiB/MgO负载型非晶态合金催化剂,镍的实际负载量为13 55%时,NiB/MgO催化剂与NiB催化剂的环丁烯砜加氢催化活性相当。 展开更多
关键词 非晶态合金 催化剂 诱导化学沉积 化学镀 环丁烯砜 加氢
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粉末化学镀法制备负载型NiB非晶态合金催化剂(英文) 被引量:12
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作者 王来军 张明慧 +1 位作者 李伟 陶克毅 《催化学报》 SCIE EI CAS CSCD 北大核心 2005年第2期91-92,共2页
将Ag2 O/MgO分别加入到NiSO4 NH3 和NiSO4 乙二胺两种不同的镀液体系中 ,通过粉末化学镀法制备了NiB/MgO负载型非晶态合金催化剂 ,并与化学还原法制备的纯态NiB催化剂进行对比 .用XRD ,ICP和TEM对催化剂进行了表征 ,并将它们用于环丁烯... 将Ag2 O/MgO分别加入到NiSO4 NH3 和NiSO4 乙二胺两种不同的镀液体系中 ,通过粉末化学镀法制备了NiB/MgO负载型非晶态合金催化剂 ,并与化学还原法制备的纯态NiB催化剂进行对比 .用XRD ,ICP和TEM对催化剂进行了表征 ,并将它们用于环丁烯砜加氢反应 .TEM结果表明 ,纯态NiB为团聚严重的纳米颗粒 ,而NiB/MgO催化剂上纳米NiB得到了很好的分散 .环丁烯砜加氢反应结果表明 ,NiB/MgO的催化活性远高于纯态NiB ,尤其是用NiSO4 乙二胺体系制备的NiB/MgO 2的活性高于环丁烯砜加氢工业用RaneyNi催化剂 ,因而NiB/MgO具有良好的工业应用前景 . 展开更多
关键词 非晶态合金 粉末化学镀法 环丁烯砜 加氢
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粉体上的化学镀镍 被引量:31
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作者 黎德育 李宁 李柏松 《材料科学与工艺》 EI CAS CSCD 2003年第4期414-418,共5页
综述了国内外粉体上化学镀镍技术的最新成果与进展.介绍了粉体化学镀镍5种处理方法:活化敏化两步法、活化敏化一步法、离子钯活化法、环氧树脂处理法、离子交换法.叙述了化学镀溶液的组成与工艺特点,以及SiC、Al2O3、石墨、金刚石等化... 综述了国内外粉体上化学镀镍技术的最新成果与进展.介绍了粉体化学镀镍5种处理方法:活化敏化两步法、活化敏化一步法、离子钯活化法、环氧树脂处理法、离子交换法.叙述了化学镀溶液的组成与工艺特点,以及SiC、Al2O3、石墨、金刚石等化学镀复合粉体的性能及应用. 展开更多
关键词 化学镀镍技术 复合粉体 活化敏化两步法 活化敏化一步法 离子钯活化法 环氧树脂处理法 离子交换法
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Ni-B合金化学镀包覆TiB_2粉的研究 被引量:7
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作者 程汉池 栗卓新 +2 位作者 夏志东 杨伟华 史耀武 《材料热处理学报》 EI CAS CSCD 北大核心 2006年第6期34-36,共3页
为改善TiB2粉末物性,采用化学镀工艺对其进行包覆Ni—B合金处理。经Hall流动仪检测,包覆后粉末松装密度由1.15~1.17g/cm^3增加到1.38~1.39g/cm^3,粉末流动性由包覆前粉末堵塞霍尔流动性测量仪喷嘴变为94~97s/50g;SEM形貌... 为改善TiB2粉末物性,采用化学镀工艺对其进行包覆Ni—B合金处理。经Hall流动仪检测,包覆后粉末松装密度由1.15~1.17g/cm^3增加到1.38~1.39g/cm^3,粉末流动性由包覆前粉末堵塞霍尔流动性测量仪喷嘴变为94~97s/50g;SEM形貌扫描分析表明包覆效果较好,包覆率大于90%;补加镀液包覆效果更好,镀层更致密,包覆率大于95%。 展开更多
关键词 TiB2粉 化学镀 包覆 Ni—B合金 粉末物性
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粉末化学镀法制备的NiB/TiO_2非晶态合金催化剂对环丁烯砜加氢反应的催化性能 被引量:13
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作者 王来军 李伟 +1 位作者 张明慧 陶克毅 《催化学报》 SCIE EI CAS CSCD 北大核心 2003年第11期816-820,共5页
采用诱导沉积法及粉末化学镀法分别制备了纯态NiB及负载型NiB/TiO2 非晶态合金催化剂 .用XRD ,ICP ,SEM ,TEM和DSC等手段对催化剂的物性及TiO2 载体与NiB非晶态合金之间的相互作用进行了表征 ,考察了非晶态合金的结构、组成、形貌和热... 采用诱导沉积法及粉末化学镀法分别制备了纯态NiB及负载型NiB/TiO2 非晶态合金催化剂 .用XRD ,ICP ,SEM ,TEM和DSC等手段对催化剂的物性及TiO2 载体与NiB非晶态合金之间的相互作用进行了表征 ,考察了非晶态合金的结构、组成、形貌和热稳定性 ,并将其用于环丁烯砜加氢反应中 .结果表明 ,相对于NiB而言 ,NiB/TiO2 催化剂具有优良的热稳定性和催化活性 ,这缘于NiB和TiO2 载体之间的相互作用及载体的分散作用 . 展开更多
关键词 非晶态合金 氧化钛 负载型催化剂 诱导化学沉积法 粉末化学镀法 环丁烯砜 加氢 环丁砜
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石墨颗粒表面化学镀铜研究 被引量:26
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作者 王贵青 陈敬超 孙加林 《表面技术》 EI CAS CSCD 北大核心 2003年第1期36-40,共5页
为了充分利用Cu的导电性能,碳石墨的润滑性能,改善Cu/C的润湿性,用化学镀铜的方法成功地对石墨颗粒表面进行镀覆,详细地研究了镀铜液组分及工艺与石墨颗粒表面镀铜层厚度、沉积速度的关系,并得出较好的组分工艺方案,采用优化工艺可以得... 为了充分利用Cu的导电性能,碳石墨的润滑性能,改善Cu/C的润湿性,用化学镀铜的方法成功地对石墨颗粒表面进行镀覆,详细地研究了镀铜液组分及工艺与石墨颗粒表面镀铜层厚度、沉积速度的关系,并得出较好的组分工艺方案,采用优化工艺可以得到平均厚度约7.1μm的镀铜层。同时应用x射线、金相显微镜、扫描电镜及电子探针对镀铜层的厚度、表面形貌、镀铜层与基体的界面进行了全面观察。分析表明,cu/c界面存在过渡层,界面成锯齿状,机械冶金结合的特征十分明显,改善了铜碳界面的相溶性。 展开更多
关键词 石墨颗粒粉末 化学镀铜 镀铜层厚度 沉积速率
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微米级铜粉化学镀银及抗氧化性分析 被引量:10
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作者 梅冰 乔学亮 +2 位作者 王洪水 陈建国 邱小林 《材料保护》 CAS CSCD 北大核心 2006年第9期28-30,共3页
采用化学镀的方法在微米级铜粉表面镀银。用X射线衍射法(XRD)和热重分析法(TG)测定了铜-银粉的物相和抗氧化性,比较了由镀前有无活化的铜粉所制备的两种金属粉体的性能,最后用X射线荧光光谱仪对两种粉体的表面元素和含量进行测定。结果... 采用化学镀的方法在微米级铜粉表面镀银。用X射线衍射法(XRD)和热重分析法(TG)测定了铜-银粉的物相和抗氧化性,比较了由镀前有无活化的铜粉所制备的两种金属粉体的性能,最后用X射线荧光光谱仪对两种粉体的表面元素和含量进行测定。结果表明镀银能明显提高铜粉抗氧化性,而镀前经活化的铜粉具有更好的活性,银在铜粉表面含量达到93.27%。 展开更多
关键词 微米级铜粉 化学镀银 抗氧化性
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纳米粉体在化学复合镀中的应用 被引量:8
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作者 胡会利 李宁 +1 位作者 于元春 程瑾宁 《电镀与涂饰》 CAS CSCD 2005年第2期36-39,共4页
向化学镀液中加入纳米粉体,使纳米粉体与金属共沉积,可得到性能各畀的纳米化学复合镀层。对Ni-P 基化学复合镀的沉积机理进行了推测。从高硬度耐磨性、自润滑性、抗高温氧化性、耐腐蚀性等方面,介绍了各种纳米化 学复合镀层的研究进展... 向化学镀液中加入纳米粉体,使纳米粉体与金属共沉积,可得到性能各畀的纳米化学复合镀层。对Ni-P 基化学复合镀的沉积机理进行了推测。从高硬度耐磨性、自润滑性、抗高温氧化性、耐腐蚀性等方面,介绍了各种纳米化 学复合镀层的研究进展。对纳米粉体的分散性问题进行了探讨,并对纳米化学复合镀层的前景提出了展望。 展开更多
关键词 纳米粉体 化学镀 复合镀
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