Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi...Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.展开更多
基于试验数据,利用扩展有限元方法(extended finite element method,XFEM)和内聚力模型(cohesive zone model,CZM),对20Cr2Ni3钢顶头表面氧化膜的断裂行为进行了数值分析,研究了氧化膜受力方向和孔洞对裂纹生长行为的影响。结果表明:氧...基于试验数据,利用扩展有限元方法(extended finite element method,XFEM)和内聚力模型(cohesive zone model,CZM),对20Cr2Ni3钢顶头表面氧化膜的断裂行为进行了数值分析,研究了氧化膜受力方向和孔洞对裂纹生长行为的影响。结果表明:氧化膜受力方向影响裂纹扩展路径,外层氧化膜裂纹尖端的J积分和应力强度因子K_I随着θ角(受力方向与氧化膜的夹角)的增大而减小,当θ角增大到90°时裂纹停止生长;外层氧化膜上孔洞使得裂纹尖端的J积分和应力强度因子K_I减小。同时,孔洞的存在使得外力传递到内层氧化膜时产生应力集中和偏移,导致内层裂纹受力不均,减小了受力方向对内层裂纹生长的影响。展开更多
基金financial support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216)the Sichuan Province Science and Technology Support Program(grant number 2022YFG0086)。
文摘Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.
文摘基于试验数据,利用扩展有限元方法(extended finite element method,XFEM)和内聚力模型(cohesive zone model,CZM),对20Cr2Ni3钢顶头表面氧化膜的断裂行为进行了数值分析,研究了氧化膜受力方向和孔洞对裂纹生长行为的影响。结果表明:氧化膜受力方向影响裂纹扩展路径,外层氧化膜裂纹尖端的J积分和应力强度因子K_I随着θ角(受力方向与氧化膜的夹角)的增大而减小,当θ角增大到90°时裂纹停止生长;外层氧化膜上孔洞使得裂纹尖端的J积分和应力强度因子K_I减小。同时,孔洞的存在使得外力传递到内层氧化膜时产生应力集中和偏移,导致内层裂纹受力不均,减小了受力方向对内层裂纹生长的影响。
