Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious e...Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects.Adding conductive fillers is a traditional method for highly conductive adhesive tapes.However,the content of conductive fillers is needed to reach the percolation threshold,which is usually as high as tens of percent.High-content fillers result in significant loss of adhesive property and high fabrication cost.Herein,we introduce a rational architecture of conductive microsphere monolayer(CMM)in the PSA layer.The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction.Importantly,low contents of conductive microspheres(≤5%(mass fraction,w))can achieve the target of conductivity improvement,but not result in the serious loss of the adhesive property.Therefore,the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes.Finally,we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes,indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.展开更多
为了探索不干胶类包装废弃物的热解特性,采用热重分析手段分析了不同升温速率条件下不干胶类废弃物的失重特点,并且采用Ozawa法和KAS法比较分析不同转化率条件下的表观活化能分布。热重分析结果表明,不干胶类废弃物的热解主要分为3个阶...为了探索不干胶类包装废弃物的热解特性,采用热重分析手段分析了不同升温速率条件下不干胶类废弃物的失重特点,并且采用Ozawa法和KAS法比较分析不同转化率条件下的表观活化能分布。热重分析结果表明,不干胶类废弃物的热解主要分为3个阶段:第1阶段(室温~200℃)为不干胶类废弃物的干燥阶段,第2阶段(200~590℃)为热解的主要阶段,第3阶段(590~800℃)为热解半焦的深度热解阶段。升温速率对热解失重率有重要影响,Ozawa法和KAS法计算结果表明,2种方法计算的热解活化能比较接近,Ozawa法得到的活化能为349.9 k J/mol,KAS法得到的活化能为336.9k J/mol;并且不干胶类废弃物的热解表观活化能呈现出阶段性分布。展开更多
基金the financial support from the National Natural Science Foundation of China(Grant No.62074154)Shenzhen Science and Technology Program(Grant Nos.JSGG20210802153000002,JCYJ20210324102208023).
文摘Conductive adhesive tape is one kind of electromagnetic interference(EMI)shielding materials for electronic packaging.However,the inferior conductivity of the pressure-sensitive adhesive(PSA)layer results in serious electromagnetic leakage at the conjunctions between the conductive tapes and target objects.Adding conductive fillers is a traditional method for highly conductive adhesive tapes.However,the content of conductive fillers is needed to reach the percolation threshold,which is usually as high as tens of percent.High-content fillers result in significant loss of adhesive property and high fabrication cost.Herein,we introduce a rational architecture of conductive microsphere monolayer(CMM)in the PSA layer.The CMM connects the top and bottom surfaces of the PSA layer and improves its conductivity in the z-direction.Importantly,low contents of conductive microspheres(≤5%(mass fraction,w))can achieve the target of conductivity improvement,but not result in the serious loss of the adhesive property.Therefore,the strategy of CMMs can balance the tradeoff between the conductivity and the adhesive property of conductive PSA tapes.Finally,we demonstrate the superior EMI shielding performance of as-made conductive adhesive tapes,indicating their potential applications as the advanced EMI shielding materials in the electronic packaging.
文摘为了探索不干胶类包装废弃物的热解特性,采用热重分析手段分析了不同升温速率条件下不干胶类废弃物的失重特点,并且采用Ozawa法和KAS法比较分析不同转化率条件下的表观活化能分布。热重分析结果表明,不干胶类废弃物的热解主要分为3个阶段:第1阶段(室温~200℃)为不干胶类废弃物的干燥阶段,第2阶段(200~590℃)为热解的主要阶段,第3阶段(590~800℃)为热解半焦的深度热解阶段。升温速率对热解失重率有重要影响,Ozawa法和KAS法计算结果表明,2种方法计算的热解活化能比较接近,Ozawa法得到的活化能为349.9 k J/mol,KAS法得到的活化能为336.9k J/mol;并且不干胶类废弃物的热解表观活化能呈现出阶段性分布。
