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Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method
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作者 郑小虎 阮浩 +2 位作者 陈宏博 刘骁佳 刘正好 《Journal of Donghua University(English Edition)》 CAS 2023年第5期525-530,共6页
The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole process... The quality of printed circuit board(PCB)micro-hole processing directly determines the stability of the inner and outer circuit connections.Micro-hole drilling technology is a typical method for PCB micro-hole processing.The problem of optimal control of its drilling force is one of the main factors affecting the quality of micro-hole machining.To address this problem,the thrust forces and torques in PCB drilling were first modeled and analyzed,and the corresponding prediction models were established.The drilling force analysis was carried out through the micro-hole drilling experiment,the specific cutting energy under different feed rates was calculated,the influence of the size effect was clarified,and the accuracy of the prediction model was verified.The result shows that during the drilling of glass fiber cloth,changes in the material removal mechanism are induced as the feed per revolution is varied.When the feed per revolution is less than the tool edge radius,the glass fiber is not cut by the main cutting edge,but is crushed and broken.When the feed per revolution is greater than the radius of the tool edge,the glass fiber is cut by the main cutting edge.At the same time,the established analytical model can accurately reflect the influence of the size effect on the drilling torque in PCB micro-hole drilling,and the error is within 10%.This method has certain practical application value in controlling PCB micro hole processing quality. 展开更多
关键词 printed circuit board(pcb) micro-hole drilling predictive model size effect multi-layer material
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Detection Algorithm of Surface Defect Word on Printed Circuit Board
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作者 Min Zhang Haixu Xi 《Computer Systems Science & Engineering》 SCIE EI 2023年第9期3911-3923,共13页
For Printed Circuit Board(PCB)surface defect detection,traditional detection methods mostly focus on template matching-based reference method and manual detections,which have the disadvantages of low defect detection ... For Printed Circuit Board(PCB)surface defect detection,traditional detection methods mostly focus on template matching-based reference method and manual detections,which have the disadvantages of low defect detection efficiency,large errors in defect identification and localization,and low versatility of detectionmethods.In order to furthermeet the requirements of high detection accuracy,real-time and interactivity required by the PCB industry in actual production life.In the current work,we improve the Youonly-look-once(YOLOv4)defect detection method to train and detect six types of PCB small target defects.Firstly,the original Cross Stage Partial Darknet53(CSPDarknet53)backbone network is preserved for PCB defect feature information extraction,and secondly,the original multi-layer cascade fusion method is changed to a single-layer feature layer structure to greatly avoid the problem of uneven distribution of priori anchor boxes size in PCB defect detection process.Then,the K-means++clustering method is used to accurately cluster the anchor boxes to obtain the required size requirements for the defect detection,which further improves the recognition and localization of small PCB defects.Finally,the improved YOLOv4 defect detection model is compared and analyzed on PCB dataset with multi-class algorithms.The experimental results show that the average detection accuracy value of the improved defect detection model reaches 99.34%,which has better detection capability,lower leakage rate and false detection rate for PCB defects in comparison with similar defect detection algorithms. 展开更多
关键词 printed circuit board defect detection small target
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PCB中耐高温有机可焊保护剂成膜机理及性能研究
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作者 王跃峰 姜其畅 +3 位作者 马紫微 贾明理 苏振 孙慧霞 《电子科技大学学报》 EI CAS CSCD 北大核心 2024年第4期487-494,共8页
印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比... 印制电路板铜焊盘表面生成耐高温有机可焊保护剂(HT-OSP)膜是克服无铅高温回流焊工艺并获得良好焊点的关键。选用2-[(2,4-二氯苯基)甲基]-1H-苯并咪唑(C_(14)H_(10)Cl_(2)N_(2))作为成膜剂,在铜层表面生成了HT-OSP膜。理论计算结合对比实验,研究C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子反应生成HT-OSP膜机理。基于量子化学密度泛函理论,模拟C_(14)H_(10)Cl_(2)N_(2)分子与Cu^(+)之间的络合反应;利用红外光谱对HT-OSP膜中的特征官能团进行表征;借助X射线光电子能谱测试HT-OSP膜中Cu元素的化合价;设计对比实验分析Cu^(2+)对生成HT-OSP膜的影响。结果表明:HT-OSP膜生成机理是C_(14)H_(10)Cl_(2)N_(2)分子与Cu原子发生反应生成HT-OSP膜并沉积在铜层表面,Cu^(2+)通过络合反应促进HT-OSP膜生长。另外,HT-OSP膜的分解温度高达531℃,HT-OSP膜保护的铜层放置在自然环境中180天没有被氧化,证明HT-OSP膜具有优异的耐热性和抗氧化性。 展开更多
关键词 表面处理技术 耐高温有机可焊保护剂 成膜机理 密度泛函理论 印制电路板
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基于298/77 K循环处理回收PCB中非金属组分
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作者 李蓬勃 张林楠 +3 位作者 张啸 李宣延 李赫 高彤 《环境工程技术学报》 CAS CSCD 北大核心 2024年第1期204-209,共6页
为解决废印制电路板(PCB)中非金属组分回收难且二次污染率大的问题,引入298/77 K循环处理技术,首先分析温度改变对PCB内部结构所造成的影响及PCB内部力学性能的变化,测试静电分选和离心分选对PCB非金属组分回收率的实际影响,之后引入CaF... 为解决废印制电路板(PCB)中非金属组分回收难且二次污染率大的问题,引入298/77 K循环处理技术,首先分析温度改变对PCB内部结构所造成的影响及PCB内部力学性能的变化,测试静电分选和离心分选对PCB非金属组分回收率的实际影响,之后引入CaF_(2)作为精炼过程中的强氧化剂,测试PCB内部结构发生改变后的硅组分回收率,最后测定回收后硅元素的实际纯度。结果表明:PCB在经过298/77 K循环处理后,内部结构受温度循环影响发生明显变化;各项力学性能均实现明显下降;PCB非金属组分实际产出量和硅组分回收率,相比于传统处理方式实现了明显提升,且对原PCB中各项杂质有较好的去除效果,硅元素占比在97%以上。 展开更多
关键词 废印制电路板 内部结构 非金属组分 循环处理 回收率 硅元素
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ViT和注意力融合的类别不均衡PCB缺陷检测方法
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作者 陈俊英 李朝阳 +1 位作者 席月芸 刘冲 《仪器仪表学报》 EI CAS CSCD 北大核心 2024年第4期294-306,共13页
针对实际环境下印刷电路板(PCB)缺陷样本难以收集造成的数据长尾分布和检测精度低以及ViT用于检测时计算复杂度高等问题,提出多尺度ViT特征提取和注意力特征融合的端到端PCB缺陷检测算法。首先结合ViT和部分卷积构建多尺度特征提取网络... 针对实际环境下印刷电路板(PCB)缺陷样本难以收集造成的数据长尾分布和检测精度低以及ViT用于检测时计算复杂度高等问题,提出多尺度ViT特征提取和注意力特征融合的端到端PCB缺陷检测算法。首先结合ViT和部分卷积构建多尺度特征提取网络,利用层级多头注意力对不同尺度的特征图执行自适应的注意力操作,使网络能够更好地捕捉局部和全局信息进而增强其特征提取能力,部分卷积可以降低计算开销。其次,基于能量空域抑制的无参数注意力机制将多尺度特征有效融合,提升网络融合特征图的表达能力。最后,引入对类别不均衡敏感的分类函数对网络的损失函数进行改进,增强网络对类别不平衡数据的拟合程度,提高网络的泛化能力。在3种不同类型的公开PCB数据集上的实验结果表明,所提出的检测算法在PCB表面缺陷数据集的平均精度均值(mAP)均有提升,分别为99.13%、98.67%,99.82%;在类别不均衡的PCB缺陷检测任务上,相较于改进前方法,mAP提升了11.94%,网络检测速度达到25 FPS,为PCB缺陷的检测提供了一种快速、有效的方法。 展开更多
关键词 缺陷检测 印刷电路板 Vision Transformer 注意力机制 多尺度特征提取
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基于FPCB绕组的导管泵用电动机设计及损耗分析
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作者 王芳群 钱锋 +2 位作者 高宇 李子健 王少俊 《江苏大学学报(自然科学版)》 CAS 北大核心 2024年第3期337-345,共9页
基于无槽无刷直流电动机具有体积小、功率密度高、无齿槽转矩的特点,采用柔性印刷电路板(FPCB)技术设计了一种导管泵用无槽无刷微型直流电动机,提出了基于3D多物理场耦合模型分析方法,对导管泵用无槽无刷微型直流电动机进行了损耗分析... 基于无槽无刷直流电动机具有体积小、功率密度高、无齿槽转矩的特点,采用柔性印刷电路板(FPCB)技术设计了一种导管泵用无槽无刷微型直流电动机,提出了基于3D多物理场耦合模型分析方法,对导管泵用无槽无刷微型直流电动机进行了损耗分析和优化设计.结果表明:导管泵用无槽无刷微型直流电动机的铜损占整个电动机损耗的88%左右,是导致电动机发热的主要原因;在温度场仿真中,温度变化会改变电动机损耗,影响电动机输出转矩;在流场仿真模型中,电动机温度会使人体血液温度升高,影响血液相容性;流动的血液会带走部分热量,降低电动机温度;绕组优化后的导管泵用电动机输出转矩得到提高,损耗得以降低. 展开更多
关键词 无槽无刷直流电动机 导管泵 柔性印刷电路板 多物理场 血液相容性
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PCB可靠性测试评估方法简述
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作者 刘立国 高蕊 张永华 《印制电路信息》 2024年第1期30-33,共4页
印制电路板(PCB)技术向高密度、高集成化等方向发展,导致PCB可靠性问题日益凸显。针对PCB失效机理,并结合现有PCB标准及实践应用情况,详细介绍了3种PCB可靠性测试评估的方法——失效率预计法、加速试验预计法和试验鉴定法,以期为从业者... 印制电路板(PCB)技术向高密度、高集成化等方向发展,导致PCB可靠性问题日益凸显。针对PCB失效机理,并结合现有PCB标准及实践应用情况,详细介绍了3种PCB可靠性测试评估的方法——失效率预计法、加速试验预计法和试验鉴定法,以期为从业者开展PCB可靠性测试评估提供一定的帮助。 展开更多
关键词 印制电路板(pcb) 失效机理 可靠性测试 可靠性评估
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基于故障树分析法的舰载武器装备电子元器件及PCB的失效研究 被引量:1
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作者 吴尽哲 马知远 +2 位作者 郭月婷 雷増垚 吴文全 《装备环境工程》 CAS 2024年第1期19-25,共7页
目的 对极端海洋环境下某型舰声呐装置中的多功能信号发生器进行失效研究。方法 使用故障树分析法作为失效分析基本方法。首先通过微焦点CT检测技术对样品进行准确的失效定位,并通过扫描电子显微镜和能谱分析样品的失效机理。然后结合... 目的 对极端海洋环境下某型舰声呐装置中的多功能信号发生器进行失效研究。方法 使用故障树分析法作为失效分析基本方法。首先通过微焦点CT检测技术对样品进行准确的失效定位,并通过扫描电子显微镜和能谱分析样品的失效机理。然后结合应用背景,分析归纳样品失效的机理因子和影响因素。最后,针对每种失效形式提出具体的改善方案。结果 由电阻本身表面形貌、额定温度及外部环境(高温、高湿、高盐)等原因,导致含有盐雾的水汽进入电阻内部,致使电阻内部出现电化学迁移现象,电阻阻值因此明显降低,最终导致多功能信号发生器出现失效。结论 舰艇中的电子设备,如多功能信号发生器的失效往往是由设计制造及各种海洋环境因素综合作用所造成的。这就要求舰载电子设备的研制方、使用方都应重视海洋环境适应性问题,并采取一定的改善措施。 展开更多
关键词 舰载武器装备 故障树分析法 失效分析 环境适应性 电子元器件 印刷电路板
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Optimization of low-temperature alkaline smelting process of crushed metal enrichment originated from waste printed circuit boards 被引量:5
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作者 郭学益 刘静欣 《Journal of Central South University》 SCIE EI CAS CSCD 2015年第5期1643-1650,共8页
A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used t... A novel low-temperature alkaline smelting process is proposed to convert and separate amphoteric metals in crushed metal enrichment originated from waste printed circuit boards. The central composite design was used to optimize the operating parameters,in which mass ratio of Na OH-to-CME, smelting temperature and smelting time were chosen as the variables, and the conversions of amphoteric metals tin, lead, aluminum and zinc were response parameters. Second-order polynomial models of high significance and3 D response surface plots were constructed to show the relationship between the responses and the variables. Optimum area of80%-85% Pb conversion and over 95% Sn conversion was obtained by the overlaid contours at mass ratio of Na OH-to-CME of4.5-5.0, smelting temperature of 653-723 K, smelting time of 90-120 min. The models were validated experimentally in the optimum area, and the results demonstrate that these models are reliable and accurate in predicting the smelting process. 展开更多
关键词 low-temperature alkaline smelting waste printed circuit board amphoteric metals central composite design conversion
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Crushing performance and resource characteristicof printed circuit board scrap 被引量:7
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作者 王晖 顾帼华 戚云峰 《Journal of Central South University of Technology》 EI 2005年第5期552-555,共4页
The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especial... The crushing performance of printed circuit board (PCB) was studied on several crushers. The results show that PCB is a material which is difficult to crush. The crushing performance of PCB with disk crusher, especially vibration grinding, which has cut or impact action, excels that of jaw crusher or roller crusher. The PCB scrap is worthwhile to recycle using variety of modern characterization methods. When compared with natural resources, this material stream remains a rich precious metal and nonferrous metals. In PCB scrap, metals account for 47% of the total material composition, in which there exists 19.66% copper, 11.47% iron, 3.93% lead, 300 g/t gold and 510 kg/t silver, etc. In addition, the PCB scrap contains 27% of plastics and 26% of refractory oxides. 展开更多
关键词 electronic scrap printed circuit board CRUSHING RECYCLING
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融合浅层特征和注意力机制的PCB缺陷检测方法
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作者 廖鑫婷 张洁 吕盛坪 《计算机集成制造系统》 EI CSCD 北大核心 2024年第3期1092-1104,共13页
缺陷检测是印制电路板(PCB)生产过程中质量控制的重要环节。由于PCB表面缺陷尺寸微小,导线布局复杂多样,现有的检测算法难以充分利用微小缺陷的特征信息,其检测准确率难以满足生产需求。为解决上述问题,提出针对PCB微小缺陷检测的YOLOv5... 缺陷检测是印制电路板(PCB)生产过程中质量控制的重要环节。由于PCB表面缺陷尺寸微小,导线布局复杂多样,现有的检测算法难以充分利用微小缺陷的特征信息,其检测准确率难以满足生产需求。为解决上述问题,提出针对PCB微小缺陷检测的YOLOv5-TDD算法。该算法在YOLOv5基础上,首先在颈部网络中增加浅层特征融合分支,提升微小缺陷特征信息流通效率;其次引入SE-SiLU注意力机制模块,以对特征信息分配权重的方式,提高网络对浅层特征的微小缺陷信息关注度。实验结果表明,YOLOv5-TDD在PCB_DATASET缺陷数据集测试中,其检测精度mAP为99.12%,相较于YOLOv5提高了3.54%,检测精度优于其他算法。 展开更多
关键词 印制电路板 微小缺陷 YOLOv5 注意力机制 特征融合
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Pyrolysis kinetics and TG-FTIR analysis of waste epoxy printed circuit boards 被引量:4
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作者 湛志华 丘克强 《Journal of Central South University》 SCIE EI CAS 2011年第2期331-336,共6页
Thermal decomposition of waste epoxy PCBs was performed in different atmospheres (nitrogen, argon, air and vacuum) at a heating rate of 10 ℃/rain by DSC-TGA, and the pyrolysis characteristic was analyzed. The gases... Thermal decomposition of waste epoxy PCBs was performed in different atmospheres (nitrogen, argon, air and vacuum) at a heating rate of 10 ℃/rain by DSC-TGA, and the pyrolysis characteristic was analyzed. The gases volatilized from the experiment were qualitatively analyzed by TG-FTIR. Kinetics study shows that pyrolysis reaction takes place between 300 and 400℃, and the activation energies are 256, 212 and 186.2 kJ/mol in nitrogen, argon and vacuum, respectively. There are two mass-loss processes in the decomposition under air atmosphere. In the first mass-loss process, the decomposition is the main reaction, and in the second process, the oxidation is the main reaction. The activation energy of the second mass-loss process is 99.6 kJ/mol by isothermal heat-treatments. TG-FTIR analysis shows carbon dioxide, carbon monoxide, hydrogen bromide, phenol and substituent phenol are given off during the pyrolysis of waste epoxy PCBs. 展开更多
关键词 PYROLYSIS KINETICS WASTE printed circuit boards
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Study on High-power LED Heat Dissipation Based on Printed Circuit Board 被引量:2
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作者 WANG Yiwei ZHANG Jianxin +1 位作者 NIU Pingjuan LI Jingyi 《Semiconductor Photonics and Technology》 CAS 2010年第2期121-125,共5页
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi... In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp. 展开更多
关键词 high-power LED printed circuit board(pcb) substrate of heat dissipation thermal resistance junction temperature
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Efficient recovery of valuable metals from waste printed circuit boards by microwave pyrolysis 被引量:4
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作者 Yubo Liu Jialiang Zhang +3 位作者 Xu Yang Wenguang Yang Yongqiang Chen Chengyan Wang 《Chinese Journal of Chemical Engineering》 SCIE EI CAS CSCD 2021年第12期262-268,共7页
The recycling of waste printed circuit board(WPCBs) is of great significance for saving resources and protecting the environment. In this study, the WPCBs were pyrolyzed by microwave and the contained valuable metals ... The recycling of waste printed circuit board(WPCBs) is of great significance for saving resources and protecting the environment. In this study, the WPCBs were pyrolyzed by microwave and the contained valuable metals Cu, Sn and Pb were recovered from the pyrolyzed WPCBs. The effect of pyrolysis temperature and time on the recovery efficiency of valuable metals was investigated. Additionally, the characterization for morphology and surface elemental distribution of pyrolysis residues was carried out to investigate the pyrolysis mechanism. The plastic fiber boards turned into black carbides, and they can be easily separated from the metals by manual. The results indicate that 91.2%, 96.1% and 94.4% of Cu, Sn and Pb can be recovered after microwave pyrolysis at 700 °C for 60 minutes. After pyrolysis, about 79.8%(mass)solid products, 11.9%(mass) oil and 8.3%(mass) gas were produced. These gas and oil can be used as fuel and raw materials of organic chemicals, respectively. This process provides an efficient and energy-saving technology for recovering valuable metals from WPCBs. 展开更多
关键词 RECOVERY Waste printed circuit boards(Wpcbs) Microwave pyrolysis Valuable metals Waste treatment
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A micro-chip exploding foil initiator based on printed circuit board technology 被引量:3
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作者 Zhi Yang Peng Zhu +4 位作者 Qing-yun Chu Qiu Zhang Ke Wang Hao-tian Jian Rui-qi Shen 《Defence Technology(防务技术)》 SCIE EI CAS CSCD 2022年第8期1435-1444,共10页
Conventional exploding foil initiator (EFI) in ignition or detonation applications hosts many performance advantages, but was hindered by the bulky, inaccurate, inefficient and expensive shortcomings. We highlight a n... Conventional exploding foil initiator (EFI) in ignition or detonation applications hosts many performance advantages, but was hindered by the bulky, inaccurate, inefficient and expensive shortcomings. We highlight a novel micro-chip exploding foil initiator (McEFI) using printed circuit board (PCB) technology. The structural parameters were determined based on energy coupling relationship at the component interfaces. Next, the prototype McEFI has been batch-fabricated using PCB technology, with a monolithic structure of 7.0 mm (l) × 4.5 mm (w) × 4.0 mm (δ). As expected, this PCB-McEFI illustrated the successful firing validations for explosives pellets. This paper has addressed the cost problem in both military munitions and civil markets wherever reliable, insensitive and timing-dependent ignition or detonation are involved. 展开更多
关键词 Exploding foil initiator printed circuit board Monolithic structure Firing validations
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Pyrolysis behaviour and combustion kinetics of waste printed circuit boards 被引量:2
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作者 Kang Yan Chongwei Liu +6 位作者 Liping Liu Min Xiong Jiongtong Chen Zhongtang Zhang Shuiping Zhong Zhifeng Xu Jindi Huang 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2022年第9期1722-1732,共11页
The effective recycling of waste printed circuit boards(WPCBs)can conserve resources and reduce environmental pollution.This study explores the pyrolysis and combustion characteristics of WPCBs in various atmospheres ... The effective recycling of waste printed circuit boards(WPCBs)can conserve resources and reduce environmental pollution.This study explores the pyrolysis and combustion characteristics of WPCBs in various atmospheres through thermogravimetric and Gaussian fitting analyses.Furthermore,this study analyses the pyrolysis products and combustion processes of WPCBs through thermogravimetric and Fourier transform infrared analyses(TG-FTIR)and thermogravimetry-mass spectrometry(TG-MS).Results show that the pyrolysis and combustion processes of WPCBs do not constitute a single reaction,but rather an overlap of multiple reactions.The pyrolysis and combustion process of WPCBs is divided into multiple reactions by Gaussian peak fitting.The kinetic parameters of each reaction are obtained by the Coats-Redfern method.In an argon atmosphere,pyrolysis consists of the overlap of the preliminary pyrolysis of epoxy resin,pyrolysis of small organic molecules,and pyrolysis of brominated flame retardants.The thermal decomposition process in the O_(2) atmosphere is mainly divided into two reactions:brominated flame retardant combustion and epoxy combustion.This study provided the theoretical basis for pollution control,process optimization,and reactor design of WPCBs pyrolysis. 展开更多
关键词 waste printed circuit board pyrolysis mechanism COMBUSTION GAUSS peak fitting
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基于YOLOv8的PCB表面缺陷检测轻量化研究
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作者 徐淼 涂福泉 +2 位作者 吴淇 唐良彪 吴维崧 《包装工程》 CAS 北大核心 2024年第17期172-179,共8页
目的针对印制电路板(PCB)表面缺陷检测模型较大和速度慢的问题,提出一种基于YOLOv8的PCB轻量化表面缺陷检测框架EYOLOv8。方法该框架以YOLOv8网络结构为基础,使用RevCol网络特征融合思想重构网络主干,引入Slim-neck设计思想重构颈部结构... 目的针对印制电路板(PCB)表面缺陷检测模型较大和速度慢的问题,提出一种基于YOLOv8的PCB轻量化表面缺陷检测框架EYOLOv8。方法该框架以YOLOv8网络结构为基础,使用RevCol网络特征融合思想重构网络主干,引入Slim-neck设计思想重构颈部结构,使用卷积权重参数共享的机制重构检测头结构,在保持精度基本不变的同时,对整体网络结构进行了轻量优化设计,最终使用WIoU损失函数对轻量化模型训练过程进行优化。结果在公共数据集上的实验结果表明,EYOLOv8较YOLOv8模型大小减少了46%,检测精度mAP50值达97.7%,检测速度达256帧/s,模型大小为3.3 MB。结论相比其他算法,EYOLOv8在PCB表面缺陷检测设备上部署更有竞争力。 展开更多
关键词 RevCol YOLOv8 pcb 表面缺陷检测 深度学习 轻量化
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Recovery of Gold, Silver, Copper and Niobium from Printed Circuit Boards Using Leaching Column Technique 被引量:3
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作者 Ricardo Montero Alicia Guevara Ernesto de la Torre 《Journal of Earth Science and Engineering》 2012年第10期590-595,共6页
Nowadays, over 300 tons of Au are used in electronic equipment each year with other precious and strategic metals such as Ag, Pt, Pd, Cu, Nb, Ta, etc.. After the use-phase, the electronic devices become electronic was... Nowadays, over 300 tons of Au are used in electronic equipment each year with other precious and strategic metals such as Ag, Pt, Pd, Cu, Nb, Ta, etc.. After the use-phase, the electronic devices become electronic waste (e-waste); consequently it is important to consider e-waste as a secondary supply for the recovery of these metals. This paper presents the recovery ofAu, Ag, Cu and Nb from PCBs (printed circuit boards) of discarded computers using leaching column technique. The PCBs were crushed with a hammer mill until reaching a particle size between 3.33 mm to 0.43 mm, Then, it was leached with a sodium cyanide solution in a glass column using the following conditions: sodium cyanide concentration 4 g/L, flux 20 L/d kg PCBs day, pH between 10.5 to 11 and leaching time 15 days. Every day, after leaching, the pregnant solutions passed through a column with activated carbon to complete the closed loop system. The following recoveries were obtained: Au 46.6%, Ag 51.3%, Nb 47.2% and Cu 62.3%. A preliminary technical-economic study shows the feasibility to create a small-scale PCBs recycling plant. The initial investment is on the order of USS155,639, considering the recovered metals from the loaded carbon. The internal rate of return for a 10 years period IRR (internal rate of return) and NPV (net present value) estimated are 27% and US$105,926 respectively. 展开更多
关键词 printed circuit boards RECOVERY precious metals niobium.
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Study on Metals Recovery from -0.074 mm Printed Circuit Boards by Enhanced Gravity Separation 被引量:9
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作者 赵跃民 温雪峰 +2 位作者 施红霞 焦红光 陶有俊 《过程工程学报》 EI CAS CSCD 北大核心 2006年第2期201-204,共4页
Nowadays study on reutilization of discarded printed circuit boards (PCBs) has great significance for achieving secondary resources recycling and preventing environmental pollution. Physical methods show great potenti... Nowadays study on reutilization of discarded printed circuit boards (PCBs) has great significance for achieving secondary resources recycling and preventing environmental pollution. Physical methods show great potential and advantages on discarded PCBs reutilization, compared with chemical and biological methods. However for the particles of 0.074 mm PCBs, little work has been done in the past because of lower separation efficiency and recovery. In this work, the conundrum of 0.074 mm PCBs reutilization was resolved successfully with the help of Falcon concentrator. Separation mechanism for fine particles with different mass densities in a Falcon centrifugal concentrator was analyzed. The main factors such as magnitude of rotation frequency (centrifugal acceleration), anti-charge water pressure and feeding concentration were studied, and interaction of different factors was analyzed using DesignExpert software. The experimental results show that metals grade of 0.074 mm PCBs and integration efficiency were obtained as 76.89% and 80.77% respectively when feeding concentration was 40 g/L with water pressure of 0.01 MPa and rotation frequency of 50 Hz. 展开更多
关键词 印刷电路板 重力分离 选矿 综合利用
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Supergravity separation of Pb and Sn from waste printed circuit boards at different temperatures 被引量:4
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作者 Long Meng Zhe Wang +2 位作者 Yi-wei Zhong Kui-yuan Chen Zhan-cheng Guo 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2018年第2期173-180,共8页
Printed circuit boards(PCBs) contain many toxic substances as well as valuable metals, e.g., lead(Pb) and tin(Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratio... Printed circuit boards(PCBs) contain many toxic substances as well as valuable metals, e.g., lead(Pb) and tin(Sn). In this study, a novel technology, named supergravity, was used to separate different mass ratios of Pb and Sn from Pb–Sn alloys in PCBs. In a supergravity field, the liquid metal phase can permeate from solid particles. Hence, temperatures of 200, 280, and 400°C were chosen to separate Pb and Sn from PCBs. The results depicted that gravity coefficient only affected the recovery rates of Pb and Sn, whereas it had little effect on the mass ratios of Pb and Sn in the obtained alloys. With an increase in gravity coefficient, the recovery values of Pb and Sn in each step of the separation process increased. In the single-step separation process, the mass ratios of Pb and Sn in Pb–Sn alloys were 0.55, 0.40, and 0.64 at 200, 280, and 400°C, respectively. In the two-step separation process, the mass ratios were 0.12 and 0.55 at 280 and 400°C, respectively. Further, the mass ratio was observed to be 0.76 at 400°C in the three-step separation process. This process provides an innovative approach to the recycling mechanism of Pb and Sn from PCBs. 展开更多
关键词 printed circuit boards supergravity separation recovery Pb–Sn alloy gravity coefficient
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