Titanium aluminum nitride （TiAlN） film, as a possible substitute for the conventional tantalum nitride （TAN） or tantalum-aluminum （TaAl） heater resistor in inkjet printheads, was deposited on a Si（100） substra...Titanium aluminum nitride （TiAlN） film, as a possible substitute for the conventional tantalum nitride （TAN） or tantalum-aluminum （TaAl） heater resistor in inkjet printheads, was deposited on a Si（100） substrate at 400 ℃ by radio frequency （RF） magnetron co-sputtering using titanium nitride （TIN） and aluminum nitride （AlN） as ceramic targets. The temperature coefficient of resistivity （TCR） and oxidation resistance, which are the most important properties of a heat resistor, were studied depending on the plasma power density applied during sputtering. With the increasing plasma power density, the crystallinity, grain size and surface roughness of the applied film increased, resulting in less grain boundaries with large grains. The Ti, Al and N binding energies obtained from X-ray photoelectron spectroscopy analysis disclosed the nitrogen deficit in the TiAlN stoichiometry that makes the films more electrically resistive. The highest oxidation resistance and the lowest TCR of-765.43×10^-6 K-l were obtained by applying the highest plasma power density.展开更多
Electrohydrodynamic(EHD)printing technique,which deposits micro/nanostructures through high electric force,has recently attracted significant research interest owing to their fascinating characteristics in high resolu...Electrohydrodynamic(EHD)printing technique,which deposits micro/nanostructures through high electric force,has recently attracted significant research interest owing to their fascinating characteristics in high resolution(<1μm),wide material applicability(ink viscosity 1–10000 cps),tunable printing modes(electrospray,electrospinning,and EHD jet printing),and compatibility with flexible/wearable applications.Since the laboratory level of the EHD printed electronics'resolution and efficiency is gradually approaching the commercial application level,an urgent need for developing EHD technique from laboratory into industrialization have been put forward.Herein,we first discuss the EHD printing technique,including the ink design,droplet formation,and key technologies for promoting printing efficiency/accuracy.Then we summarize the recent progress of EHD printing in fabrication of displays,organic field-effect transistors(OFETs),transparent electrodes,and sensors and actuators.Finally,a brief summary and the outlook for future research effort are presented.展开更多
基金Project (M-2009-01-0029) supported by Fundamental R&D Program for Core Technology of Materials, Korea
文摘Titanium aluminum nitride （TiAlN） film, as a possible substitute for the conventional tantalum nitride （TAN） or tantalum-aluminum （TaAl） heater resistor in inkjet printheads, was deposited on a Si（100） substrate at 400 ℃ by radio frequency （RF） magnetron co-sputtering using titanium nitride （TIN） and aluminum nitride （AlN） as ceramic targets. The temperature coefficient of resistivity （TCR） and oxidation resistance, which are the most important properties of a heat resistor, were studied depending on the plasma power density applied during sputtering. With the increasing plasma power density, the crystallinity, grain size and surface roughness of the applied film increased, resulting in less grain boundaries with large grains. The Ti, Al and N binding energies obtained from X-ray photoelectron spectroscopy analysis disclosed the nitrogen deficit in the TiAlN stoichiometry that makes the films more electrically resistive. The highest oxidation resistance and the lowest TCR of-765.43×10^-6 K-l were obtained by applying the highest plasma power density.
基金National Key Research and Development Program of China,Grant/Award Number:2018YFA0703200National Natural Science Foundation of China,Grant/Award Number:52075209+1 种基金Innovation Project of Optics Valley Laboratory,Grant/Award Number:OVL2021BG007Natural Science Foundation for Distinguished Young Scholars of Hubei province of China,Grant/Award Number:2022CFA066。
文摘Electrohydrodynamic(EHD)printing technique,which deposits micro/nanostructures through high electric force,has recently attracted significant research interest owing to their fascinating characteristics in high resolution(<1μm),wide material applicability(ink viscosity 1–10000 cps),tunable printing modes(electrospray,electrospinning,and EHD jet printing),and compatibility with flexible/wearable applications.Since the laboratory level of the EHD printed electronics'resolution and efficiency is gradually approaching the commercial application level,an urgent need for developing EHD technique from laboratory into industrialization have been put forward.Herein,we first discuss the EHD printing technique,including the ink design,droplet formation,and key technologies for promoting printing efficiency/accuracy.Then we summarize the recent progress of EHD printing in fabrication of displays,organic field-effect transistors(OFETs),transparent electrodes,and sensors and actuators.Finally,a brief summary and the outlook for future research effort are presented.
