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Fabrication and characterization of iron and iron carbide thin films by plasma enhanced pulsed chemical vapor deposition 被引量:1
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作者 Yulian HU Xu TIAN +4 位作者 Qipeng FAN Zhengduo WANG Bowen LIU Lizhen YANG Zhongwei LIU 《Plasma Science and Technology》 SCIE EI CAS CSCD 2019年第10期54-60,共7页
A new pulsed chemical vapor deposition(PCVD) process has been developed to fabricate iron(Fe) and iron carbide(Fe1-xCx) thin films at low temperature range from 150 ℃ to 230 ℃.The process employs bis(1,4-di-ter... A new pulsed chemical vapor deposition(PCVD) process has been developed to fabricate iron(Fe) and iron carbide(Fe1-xCx) thin films at low temperature range from 150 ℃ to 230 ℃.The process employs bis(1,4-di-tert-butyl-1,3-diazabutadienyl)iron(Ⅱ) as iron source and hydrogen gas or hydrogen plasma as the coreactant.The films deposited with hydrogen gas are demonstrated polycrystalline with body-centered cubic Fe.However,for the films deposited with hydrogen plasma,the amorphous phase of iron carbide is obtained.The influence of the deposition temperature on iron and iron carbide characteristics have been investigated. 展开更多
关键词 Fe and Fe1-xCx FILMS H2 plasma pulseD chemical vapor deposition
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Growth and characterization of AlN epilayers using pulsed metal organic chemical vapor deposition
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作者 吉泽生 汪连山 +5 位作者 赵桂娟 孟钰淋 李方政 李辉杰 杨少延 王占国 《Chinese Physics B》 SCIE EI CAS CSCD 2017年第7期420-425,共6页
We report the growth of Al N epilayers on c-plane sapphire substrates by pulsed metal organic chemical vapor deposition(MOCVD). The sources of trimethylaluminium(TMAl) and ammonia were pulse introduced into the re... We report the growth of Al N epilayers on c-plane sapphire substrates by pulsed metal organic chemical vapor deposition(MOCVD). The sources of trimethylaluminium(TMAl) and ammonia were pulse introduced into the reactor to avoid the occurrence of the parasitic reaction. Through adjusting the duty cycle ratio of TMAl to ammonia from 0.8 to 3.0, the growth rate of Al N epilayers could be controlled in the range of 0.24 m/h to 0.93 m/h. The high-resolution x-ray diffraction(HRXRD) measurement showed that the full width at half maximum(FWHM) of the(0002) and(10-12) reflections for a sample would be 194 arcsec and 421 arcsec, respectively. The step-flow growth mode was observed in the sample with the atomic level flat surface steps, in which a root-mean-square(RMS) roughness was lower to 0.2 nm as tested by atomic force microscope(AFM). The growth process of Al N epilayers was discussed in terms of crystalline quality, surface morphology,and residual stress. 展开更多
关键词 pulsed metal organic chemical vapor deposition growth mode MORPHOLOGY crystalline quality
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Superior material qualities and transport properties of InGaN channel heterostructure grown by pulsed metal organic chemical vapor deposition
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作者 张雅超 周小伟 +6 位作者 许晟瑞 陈大正 王之哲 汪星 张金风 张进成 郝跃 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第1期796-801,共6页
Pulsed metal organic chemical vapor deposition is introduced into the growth of InGaN channel heterostructure for improving material qualities and transport properties. High-resolution transmission electron microscopy... Pulsed metal organic chemical vapor deposition is introduced into the growth of InGaN channel heterostructure for improving material qualities and transport properties. High-resolution transmission electron microscopy imaging shows the phase separation free InGaN channel with smooth and abrupt interface. A very high two-dimensional electron gas density of approximately 1.85 x 10^13 cm-2 is obtained due to the superior carrier confinement. In addition, the Hall mobility reaches 967 cruZ/V-s, owing to the suppression of interface roughness scattering. Furthermore, temperature-dependent Hall measurement results show that InGaN channel heterostructure possesses a steady two-dimensional electron gas density over the tested temperature range, and has superior transport properties at elevated temperatures compared with the traditional GaN channel heterostructure. The gratifying results imply that InGaN channel heterostructure grown by pulsed metal organic chemical vapor deposition is a promising candidate for microwave power devices. 展开更多
关键词 HETEROSTRUCTURE InGaN channel pulsed metal organic chemical vapor deposition
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Fabrication of InAlGaN/GaN High Electron Mobility Transistors on Sapphire Substrates by Pulsed Metal Organic Chemical Vapor Deposition
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作者 全汝岱 张进成 +3 位作者 张雅超 张苇航 任泽阳 郝跃 《Chinese Physics Letters》 SCIE CAS CSCD 2016年第10期145-148,共4页
Nearly lattice-matched InAIGaN/GaN heterostructure is grown on sapphire substrates by pulsed metal organic chemical vapor deposition and excellent high electron mobility transistors are fabricated on this heterostruct... Nearly lattice-matched InAIGaN/GaN heterostructure is grown on sapphire substrates by pulsed metal organic chemical vapor deposition and excellent high electron mobility transistors are fabricated on this heterostructure. The electron mobility is 1668.08cm2/V.s together with a high two-dimensional-electron-gas density of 1.43 × 10^13 cm-2 for the InAlCaN/CaN heterostructure of 2Onto InAlCaN quaternary barrier. High electron mobility transistors with gate dimensions of 1 × 50 μm2 and 4μm source-drain distance exhibit the maximum drain current of 763.91 mA/mm, the maximum extrinsic transconductance of 163.13 mS/mm, and current gain and maximum oscillation cutoff frequencies of 11 GHz and 21 GHz, respectively. 展开更多
关键词 GAN IS in of Fabrication of InAlGaN/GaN High Electron Mobility Transistors on Sapphire Substrates by pulsed Metal Organic chemical Vapor deposition by on
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Pulsed Laser Deposition ZnS Buffer Layers for CIGS Solar Cells 被引量:4
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作者 Pai-feng Luo Guo-shun Jiang Chang-fei Zhu 《Chinese Journal of Chemical Physics》 SCIE CAS CSCD 2009年第1期97-101,共5页
Polycrystalline ZnS films were prepared by pulsed laser deposition (PLD) on quartz glass substrates under different growth conditions at different substrate temperatures of 20, 200, 400, and 600 ℃, which is a suita... Polycrystalline ZnS films were prepared by pulsed laser deposition (PLD) on quartz glass substrates under different growth conditions at different substrate temperatures of 20, 200, 400, and 600 ℃, which is a suitable alternative to chemical bath deposited (CBD) CdS as a buffer layer in Cu(In,Ga)Se2 (CIGS) solar cells. X-ray diffraction studies indicate the films are polycrystalline with zinc-blende structure and they exhibit preferential orientation along the cubic phase β-ZnS (111) direction, which conflicts with the conclusion of wurtzite structure by Murali that the ZnS films deposited by pulse plating technique was polycrystalline with wurtzite structure. The Raman spectra of grown films show Al mode at approximately 350 cm^-1, generally observed in the cubic phase β-ZnS compounds. The planar and the cross-sectional morphology were observed by scanning electron microscopic. The dense, smooth, uniform grains are formed on the quartz glass substrates through PLD technique. The grain size of ZnS deposited by PLD is much smaller than that of CdS by conventional CBD method, which is analyzed as the main reason of detrimental cell performance. The composition of the ZnS films was also measured by X-ray fluorescence. The typical ZnS films obtained in this work are near stoichiometric and only a small amount of S-rich. The energy band gaps at different temperatures were obtained by absorption spectroscopy measurement, which increases from 3.2 eV to 3.7 eV with the increasing of the deposition temperature. ZnS has a wider energy band gap than CdS (2.4 eV), which can enhance the blue response of the photovoltaic cells. These results show the high-quality of these substitute buffer layer materials are prepared through an all-dry technology, which can be used in the manufacture of CIGS thin film solar cells. 展开更多
关键词 ZnS thin films pulsed laser deposition chemical bath deposition Buffer layer
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XPS study of BZT thin film deposited on Pt/Ti/SiO_2/Si substrate by pulsed laser deposition
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作者 蒋艳平 唐新桂 +2 位作者 刘秋香 程铁栋 周益春 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期862-865,共4页
Ferroelectric materials were widely applied for actuators and sensors. Barium zirconate titanate Ba(Zr0.25Ti0.75)O3 thin film was grown on Pt/Ti/SiO2/Si(100) substrates by pulsed laser deposition. Structure and surfac... Ferroelectric materials were widely applied for actuators and sensors. Barium zirconate titanate Ba(Zr0.25Ti0.75)O3 thin film was grown on Pt/Ti/SiO2/Si(100) substrates by pulsed laser deposition. Structure and surface morphology of the thin film were studied by X-ray diffractometry(XRD) and scan electronic microscopy(SEM). The composition and chemical state near the film surface were obtained by X-ray photoelectron spectroscopy(XPS). On the sample surface,O 1s spectra can be assigned to those from the lattice and surface adsorbed oxygen ions,while C1s only result from surface contamination. The result shows that only one chemical state is found for each spectrum of Ba 3d,Zr 3d and Ti 2p photoelectron in the BZT thin film. 展开更多
关键词 BZT薄膜 脉冲激光沉积 化学状态 铂/钛/二氧化硅/硅基底
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Numerical Analysis of Nd:YAG Pulsed Laser Polishing CVD Self-standing Diamond Film 被引量:6
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作者 XU Feng HU Haifeng +3 位作者 ZUO Dunwen XU Chun QING Zhenghua WANG Min 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2013年第1期121-127,共7页
Chemical vapor deposited (CVD) diamond film has broad application foreground in high-tech fields. But polycrystalline CVD self-standing diamond thick film has rough surface and non-uniform thickness that adversely a... Chemical vapor deposited (CVD) diamond film has broad application foreground in high-tech fields. But polycrystalline CVD self-standing diamond thick film has rough surface and non-uniform thickness that adversely affect its extensive applications. Laser polishing is a useful method to smooth self-standing diamond film. At present, attentions have been focused on experimental research on laser polishing, but the revealing of theoretical model and the forecast of polishing process are vacant. The paper presents a finite element model to simulate and analyze the mechanism of laser polishing diamond based on laser thermal conduction theory. The experimental investigation is also carried out on Nd:YAG pulsed laser smoothing diamond thick film. The simulation results have good accordance with the results of experimental results. The temperature and thermal stress fields are investigated at different incidence angles and parameters of Nd:YAG pulsed laser. The pyramidal-like roughness of diamond thick film leads to the non-homogeneous temperature fields. The temperature at the peak of diamond film is much higher than that in the valley, which leads to the smoothing of diamond thick film. The effect of laser parameters on the surface roughness and thickness of graphite transition layer is also carried out. The results show that high power density laser makes the diamond surface rapid heating, evaporation and sublimation after its graphitization. It is also found that the good polish quality of diamond thick film can be obtained by a combination of large incident angle, moderate laser pulsed energy, large repetition rate and moderate laser pulse width. The results obtained here provide the theoretical basis for laser polishing diamond film with high efficiency and high quality. 展开更多
关键词 chemical vapor deposition self-standing diamond film POLISHING pulsed laser finite element surface roughness
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Mechanism of Silver Nanoparticles Deposition by Electrolysis and Electroless Methods on a Graphite Substrate
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作者 Mahmoud A. Rabah Nabil Nassif Girgis 《International Journal of Nonferrous Metallurgy》 CAS 2022年第1期1-14,共14页
This study shows a silver electrodeposition model (EDM) on a graphite substrate. The electrolyte was a 0.01 M solution of pure silver and chromium nitrate using an electrolyzing cell. EDC with current density up to 20... This study shows a silver electrodeposition model (EDM) on a graphite substrate. The electrolyte was a 0.01 M solution of pure silver and chromium nitrate using an electrolyzing cell. EDC with current density up to 20 mA/cm<sup>2</sup> and 15 mV and pulse current were studied. Results revealed that silver deposited at a rate of 0.515 mg/cm<sup>2</sup>/min with 12 mA/cm<sup>2</sup> that decreases to 0.21 and 0.16 mg/cm<sup>2</sup>&#183;min with the decrease of current density to 6 and 5 mA/cm<sup>2</sup> respectively. The model postulates that silver ions (a) were first hydrated before diffusing (b) from the solution bulk to the cathode vicinity, The next step (c) involved the chemical adsorption of these ions on certain accessible sites of the graphite substrate (anode), The discharged entities (d) adhere to the graphite surface by Van der Vales force. Silver ions are deposited because the discharge potential of silver is low (0.38 mV) as compared to other metal ions like chromium (0.82 mV). Pulse current controls silver deposition due to flexibility in controlling steps (a)-(c) of the deposition mechanisms. Parameters like current density, current on-time, current-off time, duty cycle (ratio of current on time and total pulse time) and pulse frequency influenced the shape and size of the deposits. Step (b) suggested that silver particles were deposited in a monolayer thickness. The silver layer turned multiple after fully satisfying the accessible sites with the monolayer. The activation energy &#916;E value amounts to 86.32 kJ/mol/K. At high temperature and current density, homogeneous diffusion occurs. 展开更多
关键词 Silver and Chromium Nanoparticles ELECTROLYSIS Electroless deposition chemical deposition and pulse Current Graphite Substrate
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高功率多结905nm垂直腔面发射激光器
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作者 赵飞云 任翱博 巫江 《人工晶体学报》 CAS 北大核心 2023年第5期818-824,共7页
本文针对激光雷达等中、远距离传感应用,设计并制备了3结905 nm垂直腔面发射激光器(VCSEL)。通过PICS3D软件对多结VCSEL相邻有源区间距和P型分布布拉格反射镜(DBR)对数进行仿真计算,设计了具有2λ的相邻有源区间距和14对P型DBR的3结VCSE... 本文针对激光雷达等中、远距离传感应用,设计并制备了3结905 nm垂直腔面发射激光器(VCSEL)。通过PICS3D软件对多结VCSEL相邻有源区间距和P型分布布拉格反射镜(DBR)对数进行仿真计算,设计了具有2λ的相邻有源区间距和14对P型DBR的3结VCSEL。在此基础上,外延生长和制备了100单元3结905 nm VCSEL阵列,单元氧化孔径为15μm。在窄脉冲条件下(脉冲宽度100 ns,占空比0.05%),该阵列的最大峰值功率达到24.7 W,峰值功率密度为182 W/mm^(2)。 展开更多
关键词 垂直腔面发射激光器 多结级联 金属有机物化学气相沉积 隧道结 驻波场 窄脉冲测试
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反应式脉冲激光溅射淀积AlN薄膜化学稳定性研究 被引量:7
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作者 汪洪海 郑启光 +1 位作者 魏学勤 丘军林 《激光杂志》 CAS CSCD 北大核心 1998年第6期28-31,46,共5页
就反应式脉冲激光溅射淀积制备氮化铝(AlN)薄膜的过程,讨论了激光脉冲能量密度及脉冲频率对所制备薄膜结构性能的影响,并对薄膜的化学稳定性作了比较详细的研究。结果表明,当薄膜中存在有未反应的单质铝时,薄膜的化学稳定性极... 就反应式脉冲激光溅射淀积制备氮化铝(AlN)薄膜的过程,讨论了激光脉冲能量密度及脉冲频率对所制备薄膜结构性能的影响,并对薄膜的化学稳定性作了比较详细的研究。结果表明,当薄膜中存在有未反应的单质铝时,薄膜的化学稳定性极差。比较而言,具有高取向性,择优生长的致密AIN微晶膜的化学稳定性优于结构相对疏松的非晶膜。实验测试得到,在75℃,85%的H3PO4溶液和20℃,05M的NaOH溶液中,AlN微晶膜的溶解速度分别为265nm·min-1和146nm·min-1,激活能为232KJ·mol-1和363KJ·mol-1;在同样条件AlN非晶膜的溶解速率分别为552nm·min-1和306nm·min-1,AlN非晶膜在H3PO4中的激活能为184KJ·mol-1。 展开更多
关键词 AIN薄膜 化学稳定性 反应式脉冲激光溅射淀积
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偏压对低气压等离子体增强化学气相沉积TiO_2薄膜的结构和性能的影响 被引量:4
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作者 刘伟 李岩 张菁 《东华大学学报(自然科学版)》 CAS CSCD 北大核心 2009年第1期103-107,共5页
使用等离子体增强化学气相沉积(PE-CVD)的方法,以TTIP(Ti(OC3H7)4)为单体,用氧气为载气,以脉冲偏压为辅助在室温的玻璃基片上沉积无定型TiO2薄膜,分析探讨在射频等离子体增强化学气相沉积TiO2薄膜的过程中,基片上施加脉冲偏压和远离脉... 使用等离子体增强化学气相沉积(PE-CVD)的方法,以TTIP(Ti(OC3H7)4)为单体,用氧气为载气,以脉冲偏压为辅助在室温的玻璃基片上沉积无定型TiO2薄膜,分析探讨在射频等离子体增强化学气相沉积TiO2薄膜的过程中,基片上施加脉冲偏压和远离脉冲偏压的情况下成膜的比较.在沉积的过程中,利用USB-2000型光纤光谱仪对等离子体的发射光谱进行测量,定性分析等离子体沉积过程中的成分组成.用UV-1901探讨薄膜的光学特性,发现紫外和近紫外区域有一定吸收;用扫描电镜分析薄膜表面形貌的变化,可以看到偏压下的薄膜致密无孔,而远离偏压下的薄膜形貌粗糙;用红外光谱分析薄膜的结构组成,可以看到明显的Ti—O吸收峰.脉冲偏压下得到的薄膜在化学、光学以及电学方面有很好应用前景. 展开更多
关键词 TiO2 等离子体 脉冲偏压 等离子体增强化学气相沉积(PE—CVD)
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带隙可调的宽禁带半导体Mg_xZn_(1-x)O薄膜研究进展 被引量:3
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作者 李春 方国家 赵兴中 《功能材料》 EI CAS CSCD 北大核心 2005年第2期177-180,共4页
MgxZn1 xO薄膜是一种新型宽禁带半导体薄膜,在兼顾ZnO、MgO材料性能的同时,具有带隙连续可调的特点,近年来逐渐成为半导体光电功能材料与器件的研究热点之一。本文从MgxZn1 xO薄膜的基本特性、制备方法、应用研究等方面进行了分析和评述... MgxZn1 xO薄膜是一种新型宽禁带半导体薄膜,在兼顾ZnO、MgO材料性能的同时,具有带隙连续可调的特点,近年来逐渐成为半导体光电功能材料与器件的研究热点之一。本文从MgxZn1 xO薄膜的基本特性、制备方法、应用研究等方面进行了分析和评述,并对其应用前景进行了展望。 展开更多
关键词 MgxZn1-xO薄膜 宽禁带 半导体 发展前景
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Nd:YAG脉冲激光诱导化学沉积银 被引量:1
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作者 孙克 赵岩 +1 位作者 张彩碚 李正林 《东北大学学报(自然科学版)》 EI CAS CSCD 北大核心 2002年第4期391-393,共3页
Nd :YAG脉冲激光扫描照射单晶Si基底表面AgNO3 薄膜 ,薄膜热分解产生的Ag沉积在Si基底表面形成沉积线· 在激光功率为 2 8W ,频率为 35Hz时 ,最高扫描速度为 9mm/s·SEM显示Ag颗粒均匀镶嵌在基底沉积线表面 ,AES研究沉积线表... Nd :YAG脉冲激光扫描照射单晶Si基底表面AgNO3 薄膜 ,薄膜热分解产生的Ag沉积在Si基底表面形成沉积线· 在激光功率为 2 8W ,频率为 35Hz时 ,最高扫描速度为 9mm/s·SEM显示Ag颗粒均匀镶嵌在基底沉积线表面 ,AES研究沉积线表面元素随深度分布情况·以Ag颗粒为催化中心 ,在沉积线表面选区化学镀铜 ,超声振动显示镀铜膜与基底有良好的结合力· 展开更多
关键词 Nd:YAG脉冲激光 激光诱导化学沉积 选区化学镀 Si基底 硅基底 大规模集成电路
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脉冲偏压对316L不锈钢表面类金刚石薄膜腐蚀行为影响 被引量:1
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作者 陈东旭 郭阳阳 +1 位作者 祁继隆 周艳文 《中国表面工程》 EI CAS CSCD 北大核心 2022年第5期272-278,共7页
为了提高不锈钢的耐局部腐蚀性能,采用等离子体增强化学气相沉积(Plasma-enhanced chemical vapor deposition,PECVD)技术,在316L不锈钢表面制备含氢类金刚石(Diamond-like carbon,DLC)薄膜,研究不同脉冲偏压对薄膜的杂化结构及腐蚀行... 为了提高不锈钢的耐局部腐蚀性能,采用等离子体增强化学气相沉积(Plasma-enhanced chemical vapor deposition,PECVD)技术,在316L不锈钢表面制备含氢类金刚石(Diamond-like carbon,DLC)薄膜,研究不同脉冲偏压对薄膜的杂化结构及腐蚀行为的影响,并对相关影响机制进行讨论。结果表明,脉冲偏压主要影响316L不锈钢表面DLC薄膜的杂化结构及微观形貌,并最终影响其腐蚀行为。随着脉冲偏压的增加,等离子体电离程度增大,沉积过程中的热峰效应和溅射效应增强,DLC薄膜中的氢含量减少,降低了薄膜局部腐蚀敏感性,薄膜点蚀坑数量减少。但同时薄膜中sp^(2)杂化结构的相对含量会随脉冲偏压升高而增加,导致薄膜腐蚀速率加快,点蚀坑半径增大。随着偏压从1.4 kV增加到2.6 kV,316L不锈钢的年腐蚀速率由9.33 nm/y增大到62.4 nm/y。脉冲偏压为1.4 kV时,虽然年腐蚀速率最低,但薄膜最易发生点蚀,其长期服役寿命较差;而偏压为2.6 kV时,等离子体能量过高,薄膜被过度刻蚀,导致其缺陷增多,耐蚀性变差。在研究范围内,脉冲偏压为2200 V时,DLC薄膜具有较高的耐点蚀能力和较低的年腐蚀速率,表现出最佳的综合耐蚀性能。 展开更多
关键词 等离子体 脉冲偏压 化学气相沉积 类金刚石薄膜 腐蚀行为
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指纹状碳薄膜在润滑油作用下的摩擦学性能 被引量:1
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作者 俞树荣 马巍 +1 位作者 龚珍彬 张俊彦 《兰州理工大学学报》 CAS 北大核心 2018年第6期69-73,共5页
利用高功率脉冲等离子体增强化学气相沉积(HIP-PECVD)技术,在硅基底表面制备指纹状的碳基薄膜(FPC∶H).通过Tecnai-G2F30型高分辨透射电镜(HRTEM)以及LABRAM HR 800型拉曼光谱仪对薄膜的结构进行表征;利用往复摩擦试验机、奥林巴斯STM6... 利用高功率脉冲等离子体增强化学气相沉积(HIP-PECVD)技术,在硅基底表面制备指纹状的碳基薄膜(FPC∶H).通过Tecnai-G2F30型高分辨透射电镜(HRTEM)以及LABRAM HR 800型拉曼光谱仪对薄膜的结构进行表征;利用往复摩擦试验机、奥林巴斯STM6测量显微镜和3D轮廓仪分析比较薄膜在润滑油作用下的摩擦性能.实验结果表明:所制备的碳基薄膜具有独特的指纹状类石墨烯结构;在三羟甲基丙烷油酸酯(TMPTO)作为润滑油的条件下,指纹状类石墨烯碳基薄膜在低载荷下表现出良好的减摩性能;在高载荷下表现出优异的抗磨性能,因此指纹状碳薄膜在润滑油作用下具有巨大的发展潜力和实用前景. 展开更多
关键词 高功率脉冲等离子体增强化学气相沉积 指纹状碳薄膜 润滑油 摩擦性能
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脉冲CLVD+PIP联用工艺制备C/SiC复合材料
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作者 何新波 梅敏 +3 位作者 曲选辉 胡海峰 张玉娣 陈思安 《粉末冶金技术》 CAS CSCD 北大核心 2013年第3期212-215,222,共5页
以液态聚碳硅烷(LPCS)为先驱体,采用脉冲化学液气相沉积(脉冲CLVD)与先驱体浸渍裂解(PIP)联用工艺制备了C/SiC复合材料。采用排煤油法测定了材料的密度,三点弯曲法测试材料的力学性能,采用扫描电子显微镜观察弯曲试样的断口形貌。结果表... 以液态聚碳硅烷(LPCS)为先驱体,采用脉冲化学液气相沉积(脉冲CLVD)与先驱体浸渍裂解(PIP)联用工艺制备了C/SiC复合材料。采用排煤油法测定了材料的密度,三点弯曲法测试材料的力学性能,采用扫描电子显微镜观察弯曲试样的断口形貌。结果表明:密度为1.76 g.cm-3的沉积试样在经过5轮PIP工艺处理后,材料的密度达到1.98 g.cm-3,抗弯强度达到321.9 MPa,和PIP工艺完全致密化的复合材料的密度及性能相当,但制备周期缩短到10天。材料中的PIP-SiC基体除了能填充纤维束间及层间的大孔隙,还能进一步填充纤维束内由于纤维束丝分布不均匀而在脉冲CLVD工艺过程中残留的大孔隙。 展开更多
关键词 脉冲化学液气相沉积 先驱体浸渍裂解 C SIC复合材料 力学性能 微观结构
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3D表面碳纳米管薄膜的生长及其强流脉冲发射的增强
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作者 麻华丽 曾凡光 +2 位作者 夏连胜 谌怡 张篁 《电子元件与材料》 CAS CSCD 2017年第2期40-44,共5页
本文采用气相化学沉积(CVD)法在具有镍层的三维硅基底上制备了碳纳米管薄膜(3D-CNTs),硅基底表面的三维微结构采用湿法刻蚀法制作,镍层采用化学镀的方法制备,碳纳米管生长均匀,列阵整齐,并垂直于基底表面。为了研究碳纳米管薄膜的强流... 本文采用气相化学沉积(CVD)法在具有镍层的三维硅基底上制备了碳纳米管薄膜(3D-CNTs),硅基底表面的三维微结构采用湿法刻蚀法制作,镍层采用化学镀的方法制备,碳纳米管生长均匀,列阵整齐,并垂直于基底表面。为了研究碳纳米管薄膜的强流脉冲发射特性,在相同的主Marx电压下采用二极结构(相同的二极管电压放电条件下)对碳纳米管薄膜进行重复脉冲发射实验。结果发现,在相同的脉冲电压下,3D-CNTs薄膜冷阴极相对平面基底上制备的碳纳米管薄膜(P-CNTs)冷阴极不仅有较高的强流脉冲发射电流和电流密度,还具有更好的强流脉冲发射稳定性。 展开更多
关键词 碳纳米管 强流脉冲发射 3D微结构 稳定性 气相化学沉积 湿法刻蚀
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高速工具钢W6Mo5Cr4V2表面不同DLC处理后的性能探讨
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作者 梁小伟 孔蕊弘 李浩源 《上海金属》 CAS 2009年第6期32-37,共6页
设计了过渡层和梯度膜结构,采用PVD磁控溅射工艺和PVD磁控溅射+PECVD(脉冲等离子增强化学气相沉积)复合工艺在高速工具钢W6Mo5Cr4V2表面制备不同的类金刚石(Diamond-like Carbon,DLC)膜:Ti过渡层+DLC膜以及CrN+CrNC+CrC+DLC(掺杂Cr)硬... 设计了过渡层和梯度膜结构,采用PVD磁控溅射工艺和PVD磁控溅射+PECVD(脉冲等离子增强化学气相沉积)复合工艺在高速工具钢W6Mo5Cr4V2表面制备不同的类金刚石(Diamond-like Carbon,DLC)膜:Ti过渡层+DLC膜以及CrN+CrNC+CrC+DLC(掺杂Cr)硬质膜。对这两种膜层的成分、结构、形貌和力学性能的对比分析发现,前者表面粗糙度小,但是后者的综合力学性能更好。 展开更多
关键词 类金刚石膜 磁控溅射 脉冲等离子增强化学气相沉积 高速工具钢
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温度与气压对脉冲PECVD沉积氧化铝薄膜的影响 被引量:4
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作者 胡蝶 陈强 《真空科学与技术学报》 EI CAS CSCD 北大核心 2020年第7期662-668,共7页
在有机基体表面等离子体增强化学气相沉积(PECVD)Al2O3薄膜是提高其阻隔性能的有效方法,而高品质的Al2O3薄膜是提高阻隔性的关键因素之一。脉冲射频等离子体增强化学气相沉积(RF-PECVD)可以实现比热化学气相沉积技术更宽的气体工作压力... 在有机基体表面等离子体增强化学气相沉积(PECVD)Al2O3薄膜是提高其阻隔性能的有效方法,而高品质的Al2O3薄膜是提高阻隔性的关键因素之一。脉冲射频等离子体增强化学气相沉积(RF-PECVD)可以实现比热化学气相沉积技术更宽的气体工作压力、更多的单体选择和更好的薄膜性能,适合于制备高质量的薄膜。本文报道采用脉冲RF-PECVD氧化铝薄膜,且对影响薄膜结构和性能的工艺参数进行研究。通过椭圆偏振仪测量Al2O3的生长速率和折射率;利用红外光谱、扫描电镜和原子力显微镜对沉积的Al2O3薄膜进行成分、结构、表面粗糙度和形貌分析、测量和表征;采用透湿仪测量在有机聚酯薄膜表面沉积Al2O3层的阻隔性能。结果表明:薄膜沉积过程中的工作气压和沉积温度对脉冲RF-PECVD薄膜性能影响较大,在一定的沉积温度范围内,沉积的Al2O3薄膜为无色、透明、表面结构平滑致密;在温度相同的条件下,工作气压越高,纳米膜生长速率越快;而在相同工作气压下,沉积温度越低,薄膜生长速率越快。 展开更多
关键词 脉冲等离子体辅助化学气相沉积 氧化铝 工作气压和沉积温度 水蒸汽透过率
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非晶含氢碳薄膜本征结构对退火行为的影响 被引量:3
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作者 贾倩 张斌 +1 位作者 赖振国 张俊彦 《表面技术》 EI CAS CSCD 北大核心 2022年第7期98-106,共9页
目的为在高温工况下服役的含氢碳(a–C:H)薄膜的制备提供新思路。方法首先利用DP–PECVD和BiP–PECVD两种方法分别在Si基底上制备了两种本征结构不同的a–C:H薄膜,分别在350、450、550、650℃下进行退火处理。通过纳米硬度、X射线光电... 目的为在高温工况下服役的含氢碳(a–C:H)薄膜的制备提供新思路。方法首先利用DP–PECVD和BiP–PECVD两种方法分别在Si基底上制备了两种本征结构不同的a–C:H薄膜,分别在350、450、550、650℃下进行退火处理。通过纳米硬度、X射线光电子能谱、傅里叶转变红外光谱、激光共聚焦拉曼光谱、场发射扫描电镜及CSM摩擦试验机等,分别评价了未退火和不同退火温度下两种不同结构a–C:H薄膜的结构、表面形貌、力学及摩擦学等性能。研究了不同本征结构a–C:H薄膜对退火行为的影响。结果DP–PECVD方法在制备a–C:H薄膜(A薄膜)的过程中具有更高的沉积速率,是BiP–PECVD法(B薄膜)的1.52倍。随着退火温度的增加,两种方法制备的a–C:H薄膜均发生H脱附,但是A薄膜的脱H转变点为450℃,B薄膜的脱H转变点为350℃。DP–PECVD法制备的a–C:H薄膜在H脱附过程中更容易形成sp^(3)–C,而BiP–PECVD法制备的a–C:H薄膜在此过程中形成sp^(3)–C和sp2–C杂化键的概率基本相同。BiP–PECVD法制备的a–C:H薄膜在退火过程中更容易失去H,且在450℃以上出现大面积剥离,摩擦失效。而DP–PECVD法制备的碳薄膜则表现出更好的热和摩擦学稳定性,在350~650℃均可保持薄膜的完整性,并且在350~550℃退火后保持低至约0.06的摩擦因数。结论DP–PECVD方法制备的a–C:H薄膜具有更好的热稳定性、力学稳定性及摩擦学稳定性。 展开更多
关键词 非晶含氢碳薄膜 退火 双极脉冲 直流脉冲 等离子体增强化学气相沉积
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