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NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER 被引量:3
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作者 C. Q. Wang M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology, H. I. T., Harbin 150001, China) 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2000年第1期168-172,共5页
The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat sour... The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball. 展开更多
关键词 pulse modulated continuous wave laser finite element analysis forced vibration
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