Growth of a-Plane GaN Films on r-Plane Sapphire by Combining Metal Organic Vapor Phase Epitaxy with the Hydride Vapor Phase Epitaxy

Hydride vapor phase epitaxy （HVPE） is utilized to grow nonpolar a-plane GaN layers on r-plane sapphire templates prepared by metal organic vapor phase epitaxy （MOVPE）. The surface morphology and microstructures of the samples are characterized by atomic force microscopy. The full width at half maximum （FWHM） of the HVPE sample shows a W-shape and that of the MOVPE sample shows an M-shape plane with the degree of 0 in the high-resolution x-ray diffraction （HRXRD） results. The surface morphology attributes to this significant anisotropic. HRXRD reveals that there is a significant reduction in the FWHM, both on-axis and off-axis for HVPE GaN are compared with the MOVPE template. The decrease of the FWHM of E2 （high） Raman scat tering spectra further indicates the improvement of crystal quality after HVPE. By comparing the results of secondary- ion-mass spectroscope and photoluminescence spectrum of the samples grown by HVPE and MOVPE, we propose that C-involved defects are originally responsible for the yellow luminescence.

Effects of the V/III Ratio of a Low-Temperature GaN Buffer Layer on the Structural and Optical Properties of a-GaN Films Grown on r-Plane Sapphire Substrates by MOCVD

We investigate the effects of the V/III ratio of a low-temperature GaN buffer layer on the growth of the overlaying nonpolar-plane GaN film grown on-plane sapphire by metal-organic chemical-vapor deposition(MOCVD).With other experimental conditions keeping fixed,the low-temperature GaN buffer layers are grown under various V/III ratios of 1000,3000,6000 and 9000,respectively.The characteristics of the-plane GaN films are analyzed by scanning electron microscopy,high resolution x-ray diffraction,Raman spectrum,and low temperature photoluminescence.The results show that the V/III ratio of the buffer layer has significant effects on the crystal quality of the a-plane GaN film,and a V/III ratio of 6000 is found to be the most suitable condition to achieve pit-free flat GaN surface.

High performance micromachining of sapphire by laser induced plasma assisted ablation(LIPAA)using GHz burst mode femtosecond pulses

GHz burst-mode femtosecond(fs)laser,which emits a series of pulse trains with extremely short intervals of several hundred picoseconds,provides distinct characteristics in materials processing as compared with the conventional irradiation scheme of fs laser(single-pulse mode).In this paper,we take advantage of the moderate pulse interval of 205 ps(4.88 GHz)in the burst pulse for high-quality and high-efficiency micromachining of single crystalline sapphire by laser induced plasma assisted ablation(LIPAA).Specifically,the preceding pulses in the burst generate plasma by ablation of copper placed behind the sapphire substrate,which interacts with the subsequent pulses to induce ablation at the rear surface of sapphire substrates.As a result,not only the ablation quality but also the ablation efficiency and the fabrication resolution are greatly improved compared to the other schemes including single-pulse mode fs laser direct ablation,single-pulse mode fs-LIPAA,and nanosecond-LIPAA.

Transporting Cold Atoms towards a GaN-on-Sapphire Chip via an Optical Conveyor Belt

Trapped atoms on photonic structures inspire many novel quantum devices for quantum information processing and quantum sensing.Here,we demonstrate a hybrid photonic-atom chip platform based on a Ga N-onsapphire chip and the transport of an ensemble of atoms from free space towards the chip with an optical conveyor belts.Due to our platform’s complete optical accessibility and careful control of atomic motion near the chip with a conveyor belt,successful atomic transport towards the chip is made possible.The maximum transport efficiency of atoms is about 50%with a transport distance of 500μm.Our results open up a new route toward the efficient loading of cold atoms into the evanescent-field trap formed by the photonic integrated circuits,which promises strong and controllable interactions between single atoms and single photons.

Evolution of microstructure, stress and dislocation of AlN thick film on nanopatterned sapphire substrates by hydride vapor phase epitaxy

A crack-free AlN film with 4.5 μm thickness was grown on a 2-inch hole-type nano-patterned sapphire substrates(NPSSs) by hydride vapor phase epitaxy(HVPE). The coalescence, stress evolution, and dislocation annihilation mechanisms in the AlN layer have been investigated. The large voids located on the pattern region were caused by the undesirable parasitic crystallites grown on the sidewalls of the nano-pattern in the early growth stage. The coalescence of the c-plane AlN was hindered by these three-fold crystallites and the special triangle void appeared. The cross-sectional Raman line scan was used to characterize the change of stress with film thickness, which corresponds to the characteristics of different growth stages of AlN. Threading dislocations(TDs) mainly originate from the boundary between misaligned crystallites and the c-plane AlN and the coalescence of two adjacent c-plane AlN crystals, rather than the interface between sapphire and AlN.

Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model

In this paper, the modified slip/fracture activation model has been used in order to understand the mechanism of ductile-brittle transition on the R-plane of sapphire during ultra-precision machining by reflecting direction of resultant force. Anisotropic characteristics of crack morphology and ductility of machining depending on cutting direction were explained in detail with modified fracture cleavage and plastic deformation parameters. Through the analysis, it was concluded that crack morphologies were mainly determined by the interaction of multiple fracture systems activated while, critical depth of cut was determined by the dominant plastic deformation parameter. In addition to this, by using proportionality relationship between magnitude of resultant force and depth of cut in the ductile region, an empirical model for critical depth of cut was developed.

Thermal Stresses and Cracks During the Growth of Large-sized Sapphire with SAPMAC Method

The finite-element method has been used to study the thermal stress distribution in large-sized sapphire crystals grown with the sapphire growth technique with micro-pulling and shoulder-expanding at cooled center （SAPMAC） method. A critical defect model has been established to explain the growth and propagation of cracks during the sapphire growing process. It is demonstrated that the stress field depends on the growth rate, the ambient temperature and the crystallizing direction. High stresses always exist near the growth interfaces, at the shoulder-expanding locations, the tailing locations and the sites where the diameters undergo sharp changes. The maximum stresses always occur at the interface of seeds and crystals. Cracks often form in the critical defect region and spread in the m-planes and a-planes under applied tensile stresses during crystal growth. The experimental results have verified that with the improved system of crystal growth and well-controlled techniques, the large-sized sapphire crystals of high quality can be grown due to absence of cracks.

0.25μm Gate-Length AlGaN/GaN Power HEMTs on Sapphire with f_T of 77GHz

MOCVD-grown 0.25μm gate-length AlGaN/GaN high electron mobility transistors （HEMTs） are fabricated on sapphire substrates. A peak extrinsic transconductance of 250mS/mm and a unity current gain cutoff frequency （fT） of 77GHz are obtained for a 0.25μm gate-length single finger device. These power devices exhibit a maximum drain current density as high as 1.07A/mm. On-chip testing yielded a continuous-wave output power of 27. 04dBm at 8GHz with an associated power-added efficiency of 26. 5% for an 80 × 10μm device.

CELL-DYN Sapphire血液分析仪的CD61免疫学法、光学法、电阻抗法在低值血小板计数中的比较与应用

目的评价和比较CELL-DYN Sapphire血液分析仪的3种检测方法在低值血小板（PLT）检测方面的优劣性。方法选择基础血液病或肿瘤化疗后引起的PLT低于50×10^9/L 100例,分别使用电阻抗法、光学法和CD61免疫学法3种方法进行PLT计数,并与显微镜手工法（MPLT）作比较。运用SPSS 19.0和Med Calc V12.7.2.0分析软件对数据进行方差分析、Passing-Bablok回归分析和Bland-Altman偏倚分析。结果 ANOVA分析显示,电阻抗法、光学法PLT计数与MPLT比较,差异有统计学意义（分别为P=0.00,P=0.002）,CD61免疫学法与MPLT差异无统计学意义（P=0.915）;OPLT和CD61免疫学法与MPLT的相关性较好（分别为slope1.0,95%CI为0.95-1.06,r=0.946和slope 1.0,95%CI为0.99-1.01,r=0.998）,电阻抗法与MPLT的相关性较差（slope 1.27,95%CI为1.10-1.44,r=0.845）。通过偏差分析,电阻抗法、光学法PLT计数比MPLT检测的数值更高（差异均值分别为6.3、1.3）,CD61免疫学法与MPLT检测的数值差异无统计学意义（差异均值=-0.02）。结论在低值PLT的检测中,电阻抗法与MPLT存在明显的统计学差异,相关性差,且结果有明显偏差（偏高）;光学法与MPLT存在统计学差异,结果仍存在少量偏差（偏高）,但相关性较好;而CD61免疫学法与MPLT均值无明显差异,相关性好,结果无明显偏差。所以,当临床出现低值病例时,推荐使用CD61免疫学法PLT进行计数。

Decarbonization and Decolorization of Large Sapphire Crystals Grown by the Temperature Gradient Technique

A crystalline sapphire （Al2O3） boule （Ф10 × 80mm^3） grown by the temperature gradient technique （TGT） is a bit colored due to carbon volatilization from the graphite heater at high temperatures and the absorption of transitional metal inclusions in the raw material. The sapphire becomes colorless and transparent after decolorization and decarbonization in successive annealings in air and hydrogen at high temperatures. The quality, optical transmissivity,and homogeneity of the sapphire are remarkably improved.

AlGaN/GaN High Electron Mobility Transistors on Sapphires with f_(max) of 100GHz

AIGaN/GaN high electron mobility transistors grown on sapphire substrates with a 0.3μm gate length and 100μm gate width are fabricated. The device reveals a drain current saturation density of 0.85A/mm at a gate voltage of 0V and a peak transconductance of 225mS/mm. The unity current gain cutoff frequency and maximum frequency of oscillation are obtained as 45 and 100GHz,respectively. The output power density and gain are 1.8W/mm and 9.5dB at 4GHz,and 1.12W/mm and 11.5dB at 8GHz.

Cascode Connected AlGaN/GaN Microwave HEMTs on Sapphire Substrates

Fabrication and characteristics of cascade connected AlGaN/GaN HEMTs grown on sapphire substrates are reported.The circuit employs a common source device,which has a gate length of 0.8μm cascode connected to a 1μm common gate device.The second gate bias will not only remarkably affect saturated current and transconductance,but also realize power gain control.Cascode device exhibits a slight lower of f T,a less feedback,a largely greater of maximum available gain and a higher impedance compare to that of common source device.

LASER LIFT-OFF OF GaN THIN FILMS FROM SAPPHIRE SUBSTRATES

Gallium Nitride film was successfully separated from sapphire substrate by laser radiation. The absorption of the 248 nm radiation by the GaN at the interface results in rapid thermal decomposition of interfacial layer, yielding metallic Ga and N2 gas. The substrate can be easily removed by heating above the Ga melting point (29°C). X-ray diffraction, atomic force microscopy and photoluminescence of GaN before and after lift-off process have been performed, which demonstrated that the separation and transfer process do not alter the structural quality of the GaN films. And further discussions on the threshold energy and crack-free strategies of laser lift-off process have also been presented.

β-Ga_2O_3 thin film grown on sapphire substrate by plasmaassisted molecular beam epitaxy

Monoclinic gallium oxide(Ga_2O_3) has been grown on(0001) sapphire(Al_2O_3) substrate by plasma-assisted molecular beam epitaxy(PA-MBE). The epitaxial relationship has been confirmed to be [010]( 2ˉ01) β-Ga_2O_3||[ 011ˉ0](0001)Al_2O_3 via in-situ reflection high energy electron diffraction(RHEED) monitoring and ex-situ X-ray diffraction(XRD) measurement. Crystalline quality is improved and surface becomes flatter with increasing growth temperature, with a best full width at half maximum(FWHM) of XRD ω-rocking curve of( 2ˉ01) plane and root mean square(RMS) roughness of 0.68° and 2.04 nm for the sample grown at 730 °C,respectively. Room temperature cathodoluminescence measurement shows an emission at ～417 nm, which is most likely originated from recombination of donor–acceptor pair(DAP).

Anisotropic brittle-ductile transition of monocrystalline sapphire during orthogonal cutting and nanoindentation experiments

Single-crystal sapphire is utilized as a high-performance engineering material,especially in extreme and harsh environments.However,due to its extreme hardness and brittleness,the machinability of sapphire is still a challenge.By means of nanoindentation and plunge-cut experiments,the anisotropic brittle-ductile transition of the prismatic M-plane and rhombohedral R-plane is examined by analyzing crack morphologies and the critical depth-of-cut(CDC).The experimental results of the nanoindentation tests are correlated to the plunge-cut experiment.Both the prism plane and the rhombohedral crystal plane exhibit a two-fold symmetry of ductility with various crack patterns along the machined grooves.The direction-dependent plasticity of the hexagonal sapphire crystal is mainly connected to a twinning process accompanied by slip dislocation.

Improving InGaN-LED performance by optimizing the patterned sapphire substrate shape

The epitaxial growths of GaN films and GaN-based LEDs on various patterned sapphire substrates （PSSes） with different values of fill factor （f） and slanted angle （0） are investigated in detail. The threading dislocation （TD） density is lower in the film grown on the PSS with a smaller fill factor, resulting in a higher internal quantum efficiency （IQE）. Also the ability of the LED to withstand the electrostatic discharge （ESD） increases as the fill factor decreases. The illumination output power of the LED is affected by both 0 and f. It is found that the illumination output power of the LED grown on the PSS with a lower production of tan 0 and f is higher than that with a higher production of tan 0 and f.

Preparation of Non-spherical Colloidal Silica Nanoparticle and Its Application on Chemical Mechanical Polishing of Sapphire

Non-spherical colloidal silica nanoparticle was prepared by a simple new method, and its particle size distribution and shape morphology were characterized by dynamic light scattering(DLS) and the Focus Ion Beam(FIB) system. This kind of novel colloidal silica particles can be well used in chemical mechanical polishing(CMP) of sapphire wafer surface. And the polishing test proves that non-spherical colloidal silica slurry shows much higher material removal rate(MRR) with higher coefficient of friction(COF) when compared to traditional large spherical colloidal silica slurry with particle size 80 nm by DLS. Besides, sapphire wafer polished by non-spherical abrasive also has a good surface roughness of 0.460 6 nm. Therefore, non-spherical colloidal silica has shown great potential in the CMP field because of its higher MRR and better surface roughness.

Study on Inclusions in Large Sapphire Optical Crystal Grown by SAPMAC Method

The sapphire （Al2O3） single crystal is a kind of excellent infrared transmission window materials. A large-sized sapphire （Ф225 mm×205 mm, 27.5 kg） was grown by SAPMAC method （sapphire growth technique with micro-pulling and shoulder-expanding at cooled center）. Several kinds of inclusion in the large sapphire crystal were investigated by means of an optical microscopy （OM）, scanning electron microscopy （SEM） and electron probe microanalysis （EPMA）. The experimental results show that most inclusions are consisted of solid metallic and non-metallic particles as well as gas pores caused by the impurity of alumina as the raw material, the thermal dissociation of aluminum oxide melt and the reaction of the melt to the crucible material （Mo） at high temperatures. It is also found that in different crystal regions the inclusions are of varied sizes, morphology and chemical compositions. Finally, the measures to reduce and eliminate the inclusions are proposed to improve the crystal quality.

Dislocation Analysis for Large-sized Sapphire Single Crystal Grown by SAPMAC Method

In this paper, large-sized sapphire （Φ230×210 mm, 27.5 kg） was grown by SAPMAC method （sapphire growth technique with micro-pulling and shoulder-expanding at the cooled center）. Dislocation peculiarity in large sapphire boule （0001） basal plane was investigated by chemical etchiing, scanning electron microscopy and X-ray topography method. The triangular dislocation etch pit measured is 7.6× 10^1-8.0×10^2 cm^2, in which relative high-density dislocations were generated at both initial and final stages of crystal growth. The analysis of single-crystal X-ray topography shows that there are no apparent sub-grain boundaries; the dislocation lines are isolated and straight. Finally, the origins of low-density dislocation in sapphire crystal are discussed by numerical analysis method.

Deposition and properties of highly c-oriented of InN films on sapphire substrates with ECR-plasma-enhanced MOCVD

InN films with highly c-axis preferred orientation were deposited on sapphire substrate by low-temperature electron cyclotron resonance plasma-enhanced metal organic chemical vapor deposition (ECR-PEMOCVD). Trimethyl indium (TMIn) and N 2 were applied as precursors of In and N, respectively. The quality of as-grown InN films were systematically investigated as a function of TMIn fluxes by means of reflection high-energy electron diffraction (RHEED), X-ray diffraction analysis (XRD), and atomic force microscopy (AFM). The results show that the dense and uniform InN films with highly c-axis preferred orientation are successfully achieved on sapphire substrates under optimized TMIn flux of 0.8 ml min 1 . The InN films reported here will provide various opportunities for the development of high efficiency and high-performance semiconductor devices based on InN material.