Deviation of threshold voltage and effective mobility due to random dopant fluctuation is proposed.An improved 65 nm average drain current MOS model calledαlaw is utilized after fitting HSPICE simulating data and ext...Deviation of threshold voltage and effective mobility due to random dopant fluctuation is proposed.An improved 65 nm average drain current MOS model calledαlaw is utilized after fitting HSPICE simulating data and extracting process parameters.Then,a current mismatch model of nanoscale MOSFETs induced by random dopant fluctuation is presented based on propagation of variation theory.In test conditions,the calculated standard deviation applying this model,compared to 100 times Monte-Carlo simulation data with HSPICE,indicates that the average relative error and relative standard deviation is 0.24%and 0.22%,respectively.The results show that this mismatch model is effective to illustrate the physical mechanism,as well as being simple and accurate.展开更多
We propose a unique approach for realizing dopingless impact ionization MOS （DL-IMOS） based on the charge plasma concept as a remedy for complex process flow. It uses work-function engineering of electrodes to form ...We propose a unique approach for realizing dopingless impact ionization MOS （DL-IMOS） based on the charge plasma concept as a remedy for complex process flow. It uses work-function engineering of electrodes to form charge plasma as surrogate doping. This charge plasma induces a uniform p-region in the source side and an n-region in the drain side on intrinsic silicon film with a thickness less than the intrinsic Debye length. DL-IMOS offers a simple fabrication process flow as it avoids the need of ion implantation, photo masking and complicated thermal budget via annealing devices. The lower thermal budget is required for DL-IMOS fabrication enables its fabrication on single crystal silicon-on-glass substrate realized by wafer scale epitaxial transfer. It is highly immune to process variations, doping control issues and random dopant fluctuations, while retaining the inherent advantages of conventional IMOS. To epitomize the fabrication process flow for the proposed device a virtual fabrication flow is also proposed here. Extensive device simulation of the major device performance metrics such as subthreshold slope, threshold voltage, drain induced current enhancement, and breakdown voltage have been done for a wide range of electrodes work-function. To evaluate the potential applications of the proposed device at circuit level, its mixed mode simulations are also carried out.展开更多
文摘Deviation of threshold voltage and effective mobility due to random dopant fluctuation is proposed.An improved 65 nm average drain current MOS model calledαlaw is utilized after fitting HSPICE simulating data and extracting process parameters.Then,a current mismatch model of nanoscale MOSFETs induced by random dopant fluctuation is presented based on propagation of variation theory.In test conditions,the calculated standard deviation applying this model,compared to 100 times Monte-Carlo simulation data with HSPICE,indicates that the average relative error and relative standard deviation is 0.24%and 0.22%,respectively.The results show that this mismatch model is effective to illustrate the physical mechanism,as well as being simple and accurate.
文摘We propose a unique approach for realizing dopingless impact ionization MOS （DL-IMOS） based on the charge plasma concept as a remedy for complex process flow. It uses work-function engineering of electrodes to form charge plasma as surrogate doping. This charge plasma induces a uniform p-region in the source side and an n-region in the drain side on intrinsic silicon film with a thickness less than the intrinsic Debye length. DL-IMOS offers a simple fabrication process flow as it avoids the need of ion implantation, photo masking and complicated thermal budget via annealing devices. The lower thermal budget is required for DL-IMOS fabrication enables its fabrication on single crystal silicon-on-glass substrate realized by wafer scale epitaxial transfer. It is highly immune to process variations, doping control issues and random dopant fluctuations, while retaining the inherent advantages of conventional IMOS. To epitomize the fabrication process flow for the proposed device a virtual fabrication flow is also proposed here. Extensive device simulation of the major device performance metrics such as subthreshold slope, threshold voltage, drain induced current enhancement, and breakdown voltage have been done for a wide range of electrodes work-function. To evaluate the potential applications of the proposed device at circuit level, its mixed mode simulations are also carried out.
