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Effects of reflowing temperature and time on alloy layer of tinplate and its electrochemical behavior in 3.5%NaCl solution 被引量:6
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作者 黄先球 郎丰军 +3 位作者 马颖 陈宇 张昭 张鉴清 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2014年第6期1978-1988,共11页
Effects of reflowing temperature and time on the alloy layer of tinplate and its electrochemical behavior in 3.5%NaCl solution were investigated by electrochemical measurements and surface characterization.It is found... Effects of reflowing temperature and time on the alloy layer of tinplate and its electrochemical behavior in 3.5%NaCl solution were investigated by electrochemical measurements and surface characterization.It is found that the amount of alloy layer increases with the increase of reflowing temperature and time.Then the corrosion potential of detinned tinplate shifts positively and the corrosion rate decreases.After being coupled with tin,the detinned tinplate acts as cathode and tin acts as anode initially.However,after being exposed for some time,the potential shifts of both detinned tinplate and tin reverse the polarity of the coupling system.The galvanic current density decreases with the increase of reflowing temperature and time. 展开更多
关键词 TINPLATE alloy layer reflowing process galvanic corrosion
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重症难治性休克发生机制之进展 被引量:1
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作者 赵克森 《中国病理生理杂志》 CAS CSCD 北大核心 2010年第A10期1964-1964,共1页
关键词 性休 脓毒性休克 REFLOW 病人治疗 嵌塞 钾通道阻断剂 血管反应性 HYPOTENSION 无复流 虎杖苷
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Effects of preinfarction angina on no-reflow phenomenon after percutaneous coronary intervention in patients with acute myocardial infarction
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作者 王荣英 《介入放射学杂志》 CSCD 2003年第S1期153-,共1页
Objective To evaluate effects of preinfarction angina(PA) on no reflow phenomenon after percutaneous coronary intervention(PCI) in patients with acute myocardial infarction(AMI).Methods one hundred patients with first... Objective To evaluate effects of preinfarction angina(PA) on no reflow phenomenon after percutaneous coronary intervention(PCI) in patients with acute myocardial infarction(AMI).Methods one hundred patients with first AMI were divided into no reflow group( n =15)and reflow group( n =85). All patients undervent PCI within 12h after onset of AMI.No reflow phenomenon,defined as TIMI grade 2 flow or less without apparent residual stenosis .Myocardial enzyme was continuously measured;Left ventricular function was assessed by radionuclideimaging; The incidence of ventricular aneurysm and in hospital mortality was observed. Results (1)Patients with no reflow had a significantly lower incidence of PA( 20% vs 61% , P <0.01 ), a higher incidence of anterior infarction (67%vs35%, P <0.05 ), and had significantly higher peak creatine MB fraction than those with reflow(403±132vs277±151, P <0.01 ).(2) Patients with no reflow had significantly larger myocardial infarction area (MIA) ( 27.6 ±9.1% vs 20.9 ±9.4% , P <0.01 ), significantly higer left ventricular ejection fraction (46±8% vs 53±9%, P <0.01 ),and had a higher incidence of ventricular aneurysm and mortality than those with reflow (20%vs4%,p<0.05;20% vs 2%, P <0.05 ). (3)Multivariate Logistic analysis showed that the absence of preinfarction angina was a major independent determinant of no reflow( OR = 6.12 , P =0.01 ).Conclusions The absence of preinfarction angina is a high dangerous factor of no reflow phenomenon; No reflow phenomenon is associated with a high incidence of heart failure and mortality. 展开更多
关键词 REFLOW ANGINA
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Effects of Zn addition on mechanical properties of eutectic Sn-58Bi solder during liquid-state aging 被引量:10
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作者 马东亮 吴萍 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2015年第4期1225-1233,共9页
Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermet... Interfacial reaction, tensile strength and creep resistance of Sn-58Bi-x Zn(x=0, 0.7, mass fraction, %) solder samples during liquid-state aging were investigated. The coarsening of Bi and the growth of Cu-Sn intermetallic compounds(IMCs) in Sn-58Bi-0.7Zn solder sample were both effectively suppressed. With the addition of 0.7% Zn, ultimate tensile strengths(UTSs) of the Sn-58 Bi solder slabs were respectively increased by 6.05% and 5.50% after reflow soldering and liquid-state aging, and those of the Cu/Sn-58Bi/Cu solder joints were also increased by 21.51% and 29.27%, respectively. The increase in strengthening effect of Cu/Sn-58Bi-x Zn/Cu solder joints could be attributed to the fracture surface which was changed from the Cu/IMC interface to the IMC/solder interface due to the finer Bi grain. Nanoindentation results revealed that the creep behavior of Sn-58Bi-0.7Zn solder was significantly improved compared with that of the eutectic Sn-58 Bi solder after reflow soldering and liquid-state aging. 展开更多
关键词 ZN Sn-Bi solder liquid-state aging reflow soldering creep
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加减生脉液抗衰老的药理研究——Ⅱ、对小鼠脑缺氧、缺血后再灌注损伤的影响 被引量:2
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作者 周敏 常福久 +1 位作者 宋春燕 陈晓光 《中药药理与临床》 CAS CSCD 1989年第5期27-30,共4页
心肾脾的气血虚衰是促进衰老的首要因素,随着年龄的增长,逐步地发展为老年性气虚综合征或老年性疾病,如脑动脉硬化症、脑梗塞、老年性痴呆等脑血管疾病。 机体重要器官对缺血的耐受性不等,脑对缺血最敏感,活体完全缺血缺氧仅4~6分钟脑... 心肾脾的气血虚衰是促进衰老的首要因素,随着年龄的增长,逐步地发展为老年性气虚综合征或老年性疾病,如脑动脉硬化症、脑梗塞、老年性痴呆等脑血管疾病。 机体重要器官对缺血的耐受性不等,脑对缺血最敏感,活体完全缺血缺氧仅4~6分钟脑就出现永久性损害。Ames等证明,脑缺血后出现“无再流”(no—reflow)现象;脑缺血后再灌注,脑血流量只及正常流量的20%,低于神经细胞存活所需水平。最近文献报道:“无再流’的机制是钙依赖性的。 展开更多
关键词 抗衰老 鼠脑 生脉 脑动脉硬化症 脑缺血 脑血流量 再灌注 血缺氧 动脉痉挛 REFLOW
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FORMATION AND CHANGE OF AuSn_4 COMPOUNDS AT INTERFACE BETWEEN PBGA SOLDER BALL AND Au/Ni/Cu METALLIZATION DURING LASER AND INFRA-RED REFLOW SOLDERING 被引量:3
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作者 Y.H.Tian C.Q.Wang State Key Laboratory of Advanced Welding Production Technology,Harbin Institute of Technology,Harbin 150001,China 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2004年第2期199-204,共6页
Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface... Interactions between 63Sn37Pb solder and PBGA metallization (Au/Ni/Cu) duringlaser and infrared reflow soldering were studied. During laser reflow soldering process,a thin layer of AuSn_4 was observed at the interface of the solder bumps, its morphologywas strongly dependent on the laser reflow power and heating time. The solder bumpsformed by the first laser reflow was reflowed again to form the solder joints. TheAuSn_4 compounds formed in the first laser reflow process dissolved into the bulk solderafter the secondary infrared reflow process. The needle-like AuSn_4 changed into rod-like, and distributed inside the solder near the solder/pad interface. 展开更多
关键词 laser reflow infrared reflow bump's microstructure solder joint
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Sodium nitroprusside injection immediately before balloon inflation during percutaneous coronary intervention 被引量:4
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作者 Yan Yu Bao-Ping Yang 《World Journal of Clinical Cases》 SCIE 2021年第36期11248-11254,共7页
BACKGROUND No reflow or slow flow frequently occurs during percutaneous coronary intervention(PCI)and it is associated with adverse outcomes.Strategies should be undertaken to prevent its occurrence.AIM To observe whe... BACKGROUND No reflow or slow flow frequently occurs during percutaneous coronary intervention(PCI)and it is associated with adverse outcomes.Strategies should be undertaken to prevent its occurrence.AIM To observe whether conventional target intracoronary administration of sodium nitroprusside immediately before balloon inflation can reduce the incidence of no reflow and slow flow,which are defined as thrombolysis in myocardial infarction flow grade≤II during PCI.METHODS A retrospective study was conducted in 740 patients with coronary artery disease admitted to Gansu Provincial Hospital of Traditional Chinese Medicine between January 2016 and October 2020.Among them,360 patients receiving sodium nitroprusside immediately before balloon inflation during PCI were enrolled in an experimental group between January 2019 and October 2020 and 380 patients receiving sodium nitroprusside after incident no reflow and slow flow during PCI were enrolled in a control group between January 2016 and January 2019.The occurrence of no reflow and slow flow was compared between the two groups and left ventricular end-diastolic diameter(LVEDD)and left ventricular ejection fraction(LVEF)were detected 1 mo after the operation.RESULTS After treatment,the proportion of patients with thrombolysis in myocardial infarction flow grades 0 to II was lower in the experimental group than in the control group(P<0.05).At 1 mo after treatment,LVEDD was lower and LVEF was higher in the experimental group than in the control group(P<0.05).In terms of incidence of adverse cardiovascular events within 1 mo after treatment,in the experimental group,malignant arrhythmia occurred in three patients,intractable myocardial ischemia in three,congestive heart failure in four,and recurrent myocardial infarction in five;one patient died.In the control group,malignant arrhythmia occurred in eight patients,intractable myocardial ischemia in five,congestive heart failure in seven,and recurrent myocardial infarction in 14;two patients died.The incidence of adverse cardiovascular events was 4.4%in experimental group which was lower than that of the control group at 1 mo after operation(9.5%;P<0.05).CONCLUSION Administration of sodium nitroprusside into target vessels immediately before balloon inflation can significantly reduce the incidence of no reflow and slow flow,improve LVEDD and LVEF,and reduce the incidence of adverse cardiovascular events in patients treated by PCI.It is worthy of clinical promotion. 展开更多
关键词 Sodium nitroprusside No reflow Slow blood flow Coronary artery disease Percutaneous coronary intervention
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Removal of the main inflorescence to induce reflowering of loquat 被引量:2
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作者 Jiangrong Peng Wenkun Li +7 位作者 Yuan Yuan Zhiqiang Han Yunpeng Cao Muhammad Qasim Shahid Zhike Zhang Yongshun Gao Shunquan Lin Yuanyuan Jiang 《Horticultural Plant Journal》 SCIE CSCD 2022年第1期35-43,共9页
Loquat(Eriobotrya japonica Lindl.)is an evergreen fruit tree species of the Rosaceae,and its unique flowering time greatly hinders its production.To explore the artificial regulation of loquat flowering time,we remove... Loquat(Eriobotrya japonica Lindl.)is an evergreen fruit tree species of the Rosaceae,and its unique flowering time greatly hinders its production.To explore the artificial regulation of loquat flowering time,we removed the main inflorescence(by cutting it)to induce reflowering.For different loquat tree cultivars with different stages,the inflorescence was removed by cutting the main floral axis at two alternative positions:the upper or the lower position beneath the inflorescence,and it was found that the proportion of reflowering resulting from removing the upper position of the main floral axis of yellow-flesh loquat cultivars during the full-bloom stage was the highest.In addition,compared with those of the normal-growing panicles,the number of flower buds and branch axes of the reflowering panicles decreased significantly after cutting.Importantly,these newly produced inflorescences flowered 2–4 months later than normal-growing inflorescences did,effectively prolonging both the flowering and fruiting time.In addition,qRT-PCR results showed that EjFT1,EjFT2,EjAP1–1 and EjAP1–2 were highly expressed in the floral axis.These findings highlighted a new method for extending the production cycle of loquat and provided a reference for the flowering regulation of loquat and other economically important fruit tree species. 展开更多
关键词 Eriobotrya japonica Reflowering Flowering time CUTTING Production cycle
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Evolution of AuSnx intermetallic compounds in laser reflowed micro-solder joints 被引量:2
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作者 刘威 安荣 +3 位作者 王春青 田艳红 杨磊 孙立宁 《China Welding》 EI CAS 2011年第1期7-11,共5页
To investigate the effect of Au thickness on evolution of AuSnx IMCs, pads with 0. 1, 0. 5 and 4. 0 μm thickness of Au surface finish were utilized. Laser reflowed solder joints were aged in 125℃ isothermal ovens. R... To investigate the effect of Au thickness on evolution of AuSnx IMCs, pads with 0. 1, 0. 5 and 4. 0 μm thickness of Au surface finish were utilized. Laser reflowed solder joints were aged in 125℃ isothermal ovens. Results indicated that little IMC formed at the interface of solder and pad with 0. 1 μm thickness of Au. Even in condition of 744 hours aging, thickness of lMCs did not increase obviously. As for the joints with 0. 5 μm thickness of Au, most of AuSn4 IMCs stayed at the inteornce and were in needle-like or dendritic morphology. With the increase of aging time, AuSn4 IMCs beeame flat and changed to a continuous layer. In the joints with 4. 0 μm thickness of Au on pads, AuSn, AuSn2, AuSn4 IMCs and Au2Sn phase formed at the interface. As aging time was increased, more Sn rich IMCs formed at the interface, and evolved to AuSn4 IMCs in condition of long time aging. Thickness of AuSn4 IMCs reached about 30μm. 展开更多
关键词 AU AuSnx intermetallic compounds laser reflowed micro-solder joints
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Value of Platelet to Lymphocytes Ratio in Predicting Angiographic Reflow after Primary Percutaneous Coronary Intervention in STEMI Patient 被引量:1
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作者 Ahmed Emara Neveen I. Samy +1 位作者 Walaa Farid Mohamed Elgendy 《World Journal of Cardiovascular Diseases》 2019年第4期300-308,共9页
Background: Acute myocardial infarction is a leading cause of death worldwide nowadays and treatment of choice is primary percutaneous coronary intervention (PCI). No reflow is a complication that increases mortality ... Background: Acute myocardial infarction is a leading cause of death worldwide nowadays and treatment of choice is primary percutaneous coronary intervention (PCI). No reflow is a complication that increases mortality and morbidity post intervention and one of its predictors is platelet lymphocyte ratio. Aim of Study: To assess relation between admission platelet to lymphocyte ratio (PLR) and angiographic reflow after primary PCI in acute ST elevation myocardial infarction (STEMI). Patients and Methods: This is a prospective study that was conducted from May 2017 to May 2018 at Cardiology Department, Menoufia University Hospital. Sixty patients presented with ST-elevation myocardial infarction who were eligible for primary PCI were enrolled in the study. According to TIMI flow post intervention, patients were arranged into 2 groups: Group 1 (Normal Reflow) included thirty patients with post intervention TIMI flow III and Group 2 (NO Reflow) included thirty patients with post intervention TIMI flow (0, I, II). Comparison between both groups was done regarding platelet lymphocyte ratio (PLR). Result: PLR was significantly higher in patients with coronary no reflow than in patients with normal reflow with a P-value of , timing interval between onset of chest pain to time of intervention and thrombus grading was significantly higher in patients with no reflow than in patients with normal reflow. Conclusion: Pre-intervention PLR is an independent predictor of slow flow/no reflow following PPCI in patient with acute STEMI. 展开更多
关键词 Acute Myocardial INFARCTION Primary Percutaneous Coronary Intervention No REFLOW PLATELET LYMPHOCYTE RATIO
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ZnO whiskers growth on the surface of Sn9Zn/Cu solder joints in concentrator silicon solar cells solder layer 被引量:1
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作者 张亮 Yang Fan Zhong Sujuan 《High Technology Letters》 EI CAS 2017年第3期337-341,共5页
ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported. In the experiment,SnZn/Cu samples are left in laboratory after reflow soldering for two ye... ZnO whiskers observation on the surface of SnZn/Cu solder joints in concentrator silicon solar cells solder layer is reported. In the experiment,SnZn/Cu samples are left in laboratory after reflow soldering for two years before an examination by SEM,then ZnO whiskers can be observed obviously,which grows out from the rich-Zn phase of the samples and causes electrical short circuit in the electronics appliances,which demonstrates that the SnZn solder shows a risk for the short circuiting failure of an electronic device. Moreover,the growth mechanism of ZnO whiskers is researched based on cracked oxide theory,which provides the reference support for SnZn solders application. 展开更多
关键词 ZnO whiskers reflow soldering short circuiting failure electronic device
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Study on detinning process of a reflow conductor roll
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作者 FU Hanguang DAI Mingshan FU Hanfeng 《Rare Metals》 SCIE EI CAS CSCD 2005年第4期325-329,共5页
Adhering tin is the main reason of a reflow conductor roll which works in an electroplating tin line (ETL). A det- inning agent whose main composition is NaOH and KOH and assistant composition is Na2PbO2 or K2PbO2 a... Adhering tin is the main reason of a reflow conductor roll which works in an electroplating tin line (ETL). A det- inning agent whose main composition is NaOH and KOH and assistant composition is Na2PbO2 or K2PbO2 and NaNO3 or NaNO2 has excellent detinning effects when the temperature of detinning solution is 40-80℃ and the temperature of the reflow conductor roll reaches 40-70℃. After the adhering tin layer of the reflow conductor roll is removed, the roughness of the reflow conductor roll can resume to 4.0 μm, its service life increases by 80%, and the repairing cost decreases by 90%. 展开更多
关键词 electroplating tin reflow conductor roll detinning agent ROUGHNESS
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Failure Mechanism of Reflow Conductor Roll of Electroplating Tinning Line
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作者 FU Han-guang ZHOU Qiang DAI Ming-shan 《Journal of Iron and Steel Research International》 SCIE EI CAS CSCD 2006年第2期33-36,共4页
The surface roughness of reflow conductor roll was checked on membrane sample. The surface morphology of conductor roll was observed by microscope, and the composition of adhered layer on conductor roll surface was an... The surface roughness of reflow conductor roll was checked on membrane sample. The surface morphology of conductor roll was observed by microscope, and the composition of adhered layer on conductor roll surface was analyzed by X-ray spectroscope. The results show that tin adhesion is the main reason for failure of conductor roll, and the failure of conductor roll is accelerated by wear. The measures to decrease tin adhesion and improve wear resistance were put forward. 展开更多
关键词 reflow conductor roll adhered tin WEAR failure
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Failure Modes of Lead Free Solder Bumps Formed by Induction Spontaneous Heating Reflow
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作者 Mingyu LI Hongbo XU +1 位作者 Jongmyung KIM Hongbae KIM 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2007年第1期61-67,共7页
The shear failure modes and respective failure mechanism of Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder bumping on Au/Ni/Cu metallization formed by induction spontaneous heating reflow process have been investigated thr... The shear failure modes and respective failure mechanism of Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder bumping on Au/Ni/Cu metallization formed by induction spontaneous heating reflow process have been investigated through the shear test after aging at 120℃ for 0, 1, 4, 9 and 16 d. Different typical shear failure behaviors have been found in the loading curves (shear force vs displacement). From the results of interracial morphology analysis of the fracture surfaces and cross-sections, two main typical failure modes have been identified. The probabilities of the failure modes occurrence are inconsistent when the joints were aged for different times. The evolution of the brittle NiaSn4 and Cu-Ni-Au-Sn layers and the grains coarsening of the solder bulk are the basic reasons for the change of shear failure modes. 展开更多
关键词 Induction spontaneous heating reflow Lead free solder Shear test Failure mode
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Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls
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作者 Yanhong TIAN Chunqing WANG Yarong CHEN 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2008年第2期220-226,共7页
ead-free Sn3.5Ag and Sn3.5Ag0.5Cu solder balls were reflowed by laser to form solder bumps. Shear test was performed on the solder bumps, and SEM/EDX (scanning electron microscopy/energy dispersive X-ray spectrometer... ead-free Sn3.5Ag and Sn3.5Ag0.5Cu solder balls were reflowed by laser to form solder bumps. Shear test was performed on the solder bumps, and SEM/EDX (scanning electron microscopy/energy dispersive X-ray spectrometer) was used to analyze the formation of intermetallic compounds (IMCs) at interface region. A finite element modeling on the temperature gradient and distribution at the interface of solder bump during laser reflow process was conducted to elucidate the mechanism of the IMCs growth direction. The results show that the parameters window for laser reflow bumping of Sn3.5Ag0.5Cu was wider than that of Sn3.5Ag. The shear strength of Sn3.5Ag0.5Cu solder bump was comparable to that of Sn3.5Ag solder bump, and was not affected obviously by laser power and irradiation time when appropriate parameters were used. Both laser power and heating time had a significant effect on the formation of IMCs. A continuous AuSn4 intermetallic compound layer and some needle-like AuSn4 were observed at the interface of solder and Au/Ni/Cu metallization layer when the laser power is small. The formation of needle-like AuSn4 was due to temperature gradient at the interface, and the direction of temperature gradient was the preferred growth direction of AuSn4. With increasing the laser power and heating time, the needle-like AuSn4 IMCs dissolved into the bulk solder, and precipitated out once again during solidification along the grain boundary of the solder bump. 展开更多
关键词 Lead-free bumping Laser reflow Intermetallic compound growth
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Related factors of coronary no-reflow phenomenon and progress of traditional Chinese medicine treatment
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作者 CI Dong-yue PANG Qian +1 位作者 WANG Zhen WANG Yong 《Journal of Hainan Medical University》 CAS 2023年第6期73-78,共6页
Coronary no-reflow phenomenon belongs to a type of coronary microcirculation disturbance,and its main pathogenic factors are vascular endothelial cell injury,microembolism and inflammatory reaction,which are correspon... Coronary no-reflow phenomenon belongs to a type of coronary microcirculation disturbance,and its main pathogenic factors are vascular endothelial cell injury,microembolism and inflammatory reaction,which are corresponding to the pathogenesis of choroid injury,blood stasis and heat toxin in traditional Chinese medicine,such as NO,ET-1,chemokine,IL and other cytokines.The degree of improvement of patients'symptoms and laboratory examination data provide a basis for traditional Chinese medicine compound prescription,monomer and traditional Chinese medicine characteristic therapy for the treatment of no-reflow phenomena(NRP).Combined with related factors,the author summarizes the research progress of traditional Chinese medicine treatment of NRP in recent years,in order to provide clinical reference. 展开更多
关键词 No reflow of coronary artery Endothelial cell injury CYTOKINE CHOROID Heat toxin Blood stasis Mechanism
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Study on laser and hot air reflow soldering of PBGA solder ball
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作者 田艳红 王春青 《China Welding》 EI CAS 2002年第2期156-160,共5页
Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot ai... Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bump reflowed by laser was superior than the solder bump by hot air, and the microstructure within the solder bump reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn 4 layer and remnant Au element. Needle like AuSn 4 grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni 3Sn 4 intermetallic compound was found at the interface of solder bump reflowed by hot air, and AuSn 4 particles distributed within the whole solder bump randomly. The combination effect of the continuous AuSn 4 layer and finer eutectic microstructure contributes to the higher shear strength of solder bump reflowed by laser. 展开更多
关键词 eutectic solder ball reflow soldering interfacial reaction
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Predictive Factors of No Reflow during Primary Angioplasty
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作者 Mouhaman-Inouwa Kpelafia Ikram Chamtouri +3 位作者 Abdou Razak Moukaila Ben Hamda Khaldoun Walid Jomaa Faouzi Maatouk 《World Journal of Cardiovascular Diseases》 CAS 2023年第1期32-45,共14页
Introduction: No reflow during primary angioplasty is associated with a poor prognosis despite the reopening of the culprit coronary. The aim of our work was to determine the predictive factors of no reflow. Methodolo... Introduction: No reflow during primary angioplasty is associated with a poor prognosis despite the reopening of the culprit coronary. The aim of our work was to determine the predictive factors of no reflow. Methodology: Single-center retrospective analytical study from June 2000 to December 2016 that included patients presenting with STEMI took care of by primary angioplasty. No reflow was defined according to angiographic criteria: a TIMI flow Results: The prevalence of no reflow was 24%. In univariate analysis mean age, diabetes,hypertension, tachycardia, hypotension, killip stage 4 left ventricular failure, hyperglycemia > 11, renal failure, left ventricular dysfunction, tritruncal status, common trunk involvement, initial TIMI flow at 0, significant thrombotic load, delay to angioplasty > 6 hours, and predilation were all correlated with no reflow with a p 75 years [OR = 6.02, 95% CI 1.4 - 27, p = 0.014], tachycardia [OR = 4.3, 95% CI 1.6 - 7.4, p = 0.037], delay to angioplasty > 6 hours [OR = 1.3, 95% CI 1.1 - 2.1, p = 0.003] and high thrombotic load [OR = 1.5, 95% CI 1.3 - 3.2, p = 0.02] were independent predictors of no reflow. Conclusion: No reflow is associated with a poor short-term prognosis. Its care requires knowledge of predictive factors, prevention and treatment. 展开更多
关键词 No Reflow Primary Angioplasty STEMI THROMBUS
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Effect of intracoronary sodium nitroprusside and tirofiban injection on myocardial injury in patients with no reflow in PCI
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作者 Xiang-Yang Xia 《Journal of Hainan Medical University》 2018年第4期18-21,共4页
Objective: To study the effect of intracoronary sodium nitroprusside and tirofiban injection on myocardial injury in patients with no reflow in PCI. Methods: Patients with acute coronary syndrome who underwent PCI and... Objective: To study the effect of intracoronary sodium nitroprusside and tirofiban injection on myocardial injury in patients with no reflow in PCI. Methods: Patients with acute coronary syndrome who underwent PCI and had no reflow in Gong'an County People's Hospital in Hubei Province between August 2014 and July 2017 were selected as the research subjects and randomly divided into two groups, combined group accepted intracoronary sodium nitroprusside and tirofiban injection during PCI, and control group accepted intracoronary tirofiban injection during PCI. The serum levels of myocardial injury indexes, oxidative stress indexes and inflammatory mediators of the two groups were measured before treatment and 1 d after treatment. Results: 1 d after treatment, serum CK-MB, H-FABP, sFas, cMyBP-C, MPO, MDA, Caspase-3, MCP-1, IL-1β, IL-18, MMP2 and MMP9 levels of both groups were significantly lower than those before treatment whereas SOD and NQO-1 levels were higher than those before treatment, and serum CK-MB, H-FABP, sFas, cMyBP-C, MPO, MDA, Caspase-3, MCP-1, IL-1β, IL-18, MMP2 and MMP9 levels of combined group were significantly lower than those of control group whereas SOD and NQO-1 levels were higher than those control group. Conclusion: Intracoronary sodium nitroprusside and tirofiban injection can reduce the myocardial injury in patients with no reflow in PCI. 展开更多
关键词 PERCUTANEOUS coronary intervention Sodium NITROPRUSSIDE Tirofiban No REFLOW MYOCARDIAL injury
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PLASTIC SURGERY AND BURNS
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《外科研究与新技术》 1996年第1期60-65,共6页
The pathological changes in pulmonarymicrovasculature in fats inflicted withoverpressure blast, 15% third degree burns andcombined bum-blast injury, respectively, werestudied with electron microscopy andultrastructura... The pathological changes in pulmonarymicrovasculature in fats inflicted withoverpressure blast, 15% third degree burns andcombined bum-blast injury, respectively, werestudied with electron microscopy andultrastructural morphomery. Results 展开更多
关键词 TBSA blast GUINEA ENDOTOXIN ENDOTHELIUM reflow metabolism Chongqing dehydrogenase STIMULATOR
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