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THE DESIGN OF AN INTEGRATED SYSTEM FOR PREDICTING AND ANALYZING SOLDER JOINT SHAPE AND RELIABILITY INSMT 被引量:1
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作者 C. Q. Wang X. J. Zha +2 位作者 C. Q. Zhang S. Q. Yang C. Z. Wang( 1)National Lab of Advanced Welding Technology, HIT, Harbin 150001, China 2)Shanghai Institute of Metallurgy, Chinese Academy of Science, Shanghai 200050, China) 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2000年第1期69-74,共6页
Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ... Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ways to improve SMT solder joint reliability.In this paper. based on the theorem of minimum potential energy, an energy model of 3 - D solder joint shape is established,and the forma- tion of solder joint is numerically simulated by Surface Ecolver program. On the basis of the prediction of SMT solder joint shape,the mechanical model of analyzing solder joint reliability is established. An elasto - plasto - creep mateial model and its mechanical constitutive equaton are established for SnPb solder alloy, and the stress/strain response of SMT solder joint under thermal cyclical loabing is ana- lyzed with nonlinear 3 - D FEM. The fatigue life of solder joint is predicted according to Coffin- Manson fatigue life model. An integrated system for Predicting and analyzing SMT solder joint shape and reliability(PSAR) is developed.The system can analyze efficiently SMT solder joint reliability with the variation of structural parameters in the joint and give the optimal structure. 展开更多
关键词 SMT solder joiot relnddity solder joint shape optimization
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