One of the major advantages of utilizing atmospheric pressure plasma processing （APPP） technology to fabricate ultra-precision optics is that there is no subsurface damage during the process. In APPP, the removal fo...One of the major advantages of utilizing atmospheric pressure plasma processing （APPP） technology to fabricate ultra-precision optics is that there is no subsurface damage during the process. In APPP, the removal footprint and removal rate are critical to the capability and efficiency of the figuring of the optical surface. In this paper, an atmospheric plasma torch, which can work in both remote mode and contact mode, is presented. The footprints and the removal rates of both modes are compared by profilometer measurements. The influences of process recipes and substrate thickness for both modes are investigated through a series of experiments. When the substrate is thinner than 12 mm, the removal rate in contact mode is higher. However, the removal rate and width of the footprint decrease dramatically as the substrate thickness increases in contact mode.展开更多
基金supported by National Natural Science Foundation of China(Nos.51175123 and 51105112)National Science and Technology Major Project of China(No.2013ZX04006011-205)
文摘One of the major advantages of utilizing atmospheric pressure plasma processing （APPP） technology to fabricate ultra-precision optics is that there is no subsurface damage during the process. In APPP, the removal footprint and removal rate are critical to the capability and efficiency of the figuring of the optical surface. In this paper, an atmospheric plasma torch, which can work in both remote mode and contact mode, is presented. The footprints and the removal rates of both modes are compared by profilometer measurements. The influences of process recipes and substrate thickness for both modes are investigated through a series of experiments. When the substrate is thinner than 12 mm, the removal rate in contact mode is higher. However, the removal rate and width of the footprint decrease dramatically as the substrate thickness increases in contact mode.
