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矿物掺合料对水泥砂浆TSA侵蚀的影响 被引量:17
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作者 马保国 高小建 罗忠涛 《材料科学与工程学报》 CAS CSCD 北大核心 2006年第2期230-234,共5页
研究了硅灰、粉煤灰、矿渣对水泥砂浆TSA侵蚀的影响,采用掺30%石灰石填料的砂浆件,测试各砂浆在5±1℃的2%MgSO4溶液中浸泡1年后的外观、强度及矿物成分变化。结果表明:掺石灰石粉使水泥砂浆受侵蚀后表面呈软泥状,主要腐蚀产物为硅... 研究了硅灰、粉煤灰、矿渣对水泥砂浆TSA侵蚀的影响,采用掺30%石灰石填料的砂浆件,测试各砂浆在5±1℃的2%MgSO4溶液中浸泡1年后的外观、强度及矿物成分变化。结果表明:掺石灰石粉使水泥砂浆受侵蚀后表面呈软泥状,主要腐蚀产物为硅灰石膏和石膏,表现为典型的TSA破坏特征,其强度损失率大于纯水泥砂浆。矿物掺合料的加入降低了水泥石中CH晶体含量,从而在一定程度上提高了水泥砂浆的抗TSA侵蚀能力。矿物掺合料对水泥石中CH晶体的减少与对抗TSA侵蚀性的改善效果具有相同的规律,其优劣次序为:60%矿渣粉>5%硅灰+25%矿渣粉>8%硅灰>30%矿渣粉>20%粉煤灰>无掺合料。 展开更多
关键词 水泥砂浆 石灰石填料 硫酸盐 TSA侵蚀 矿物掺合料
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APF中数字低通滤波器的设计及仿真实现
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作者 贾红芳 占志峰 《变频器世界》 2009年第6期53-56,共4页
本文介绍了基于瞬时无功功率理论的i_p-i_q谐波检测方法及对低通滤波器的要求,分析了数字低通滤波器的类型、阶数及截止频率对有源电力滤波器谐波检测效果的影响。利用MATLAB仿真软件设计了二阶巴特沃思(Butterworth)数字低通滤波器,对i... 本文介绍了基于瞬时无功功率理论的i_p-i_q谐波检测方法及对低通滤波器的要求,分析了数字低通滤波器的类型、阶数及截止频率对有源电力滤波器谐波检测效果的影响。利用MATLAB仿真软件设计了二阶巴特沃思(Butterworth)数字低通滤波器,对i_p-i_q谐波检测算法进行了仿真研究,仿真结果证明所选择的数字低通滤波器正确性。 展开更多
关键词 有源电力滤波器 瞬时无功功率理论 巴特沃思数字低通滤波器
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Microstructural Evolution of a Ni-base Alloy DZ468 Joint Bonded with a New Co-base Filler 被引量:3
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作者 Yanhong Jing Zhi Zheng +1 位作者 Enze Liu Yi Guo 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2014年第5期480-486,共7页
Ni-base alloy DZ468 has been joined by transient liquid phase bonding technique with a newly developed Co-based filler. The microstructures of the Co-base filler and the joint, the effects of heat treatment on microst... Ni-base alloy DZ468 has been joined by transient liquid phase bonding technique with a newly developed Co-based filler. The microstructures of the Co-base filler and the joint, the effects of heat treatment on microstructure and hardness of the joint have been investigated by various experimental methods. Results show that the Co-base filler consists of γ, M2B, M5B3 and M23B6 phases. Because of the interdiffusion between the base metal and the filler, γ, MC, M5B3 and M23B6 phases are formed in the bonding zone. And localized liquidation of substrate occurs in the diffusion affected zone, with MC and M3B2 precipitating in this area. During heat treatment, the volume of the intermetallic phases in the bonding zone resulting from incomplete isothermal solidification decreases obviously. On the contrary, the width of the diffusion affected zone increases at the solution stage and subsequently decreases at the aging stages. 展开更多
关键词 Transient liquid phase (TLP) bonding Microstructure evolution Ni-base alloy Co-base rifler
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