Preparation and Optimization of High-Purity Silicon Carbide Magnetic Abrasives for the Magnetic Induction-Wire Sawing Process

In this study,magnetic abrasives were obtained by crushing and sieving sintered iron-silicon carbide(Fe-SiC)composites.Fe and SiC powders with different mesh numbers were pre-compacted using different pressures and then sintered at various temperatures and with different holding times.The dispersion uniformity of the SiC powder was improved through surface modification using polyethylene glycol(PEG)300.The resulting magnetic abrasives were characterized in terms of phase composition,density,relative permeability,and microstructure;this was followed by a comprehensive analysis to reveal the optimal processing parameters.The ideal combination of process parameters for preparing SiC magnetic-abrasive grains for the magnetic induction-wire sawing process was obtained,which are preparation load of 60 kN,a SiC mesh number of 1,500,a sintering temperature of 1100℃,and a holding time of 4 h.

Experimental study of free abrasive wire sawing by using multi-strands wire

Grains in the slurry can be brought into cutting zone by steel wire with a certain speed to achieve the purpose of removing the workpiece material in the free abrasive wire sawing machining. Because its own of multi- strands characteristics, we use it to replace the steel wire to do slicing experiment. In this paper, multi-strands wire is made by seven metal wires and has many grooves on its surface. Compared with steel wire, it can carry more grains into cutting zone which is conducive to improving the slicing efficiency. We do some comparative slic- ing experimcnts by applying multi-strands wire （~b0.25 mm） and steel wire （~b0.25 mm） to cut optical glass （K9）. The results show that slicing efficiency and the surface roughness of the workpiece sliced by using multi-strands wire are better than that by using steel wire. but the kerf width of the former is wider than that of the latter in the same experimental conditions.

Research on Cutting Force of Ultrasonic Diamond Wire Saw

Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.

Force Modeling for Ultrasonic-assisted Wire Saw Cutting SiC Monocryatal Wafers

The advantages, such as a small cutting force, narrow kerf and little material waste make wire saw cut- ting suitable for machining precious materials like SiC, Si monocrystal and a variety of gem. As regards wire saw cutting fo wafer, however, in traditional wire saw cutting process, the cutting efficiency is low, the wear of wire saw is badly, the surface roughness of wafer is poor etc, which have a seriously impact on the cutting process stability and the use of wafers. Ultrasonic-assisted machining method is very suitable for processing a variety of non-conduc- tive hard and brittle materials, glass, ceramics, quartz, silicon, precious stones and diamonds, etc. In this paper, the force model of ultrusonic-assisted wire saw cutting of SiC monocrystal wafer, based on the kinematic and experi- mental analysis were established. The single factor and orthogonal experimental scheme for different processing pa- rameters such as wire saw speed, part rotation speed of and part feed rate, were carried out in traditional wire saw and ultrasonic-assisted wire saw cutting process. The multiple linear regression method is used to establish the static model among the cutting force, processing parameters and ultrasonic vibration parameters, and the model signifi- cance is verified. The results show, as regards ultrasonic-assisted wire saw cutting of SiC monicrystal wafer, both the tangential and normal cutting forces can reduce about 24. 5%-36% and 36. 6%-40%.

Research on Cutting Trajectory of Electroplated Diamond Wire Saw

The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters.

An Analysis of the Formation Mechanisms of Abrasive Particles and Their Effects on Cutting Efficiency

Magnetic induction-free abrasive wire sawing(MIFAWS)is a method that combines magnetic fields with traditional free abrasive wire sawing technologies.Magnetic abrasive particles(MAPs)are attracted on a magnetized wire,thus leading to an increase in their number into the cutting zone.The number of instantaneous-effective abrasive particles(IEAPs)adsorbed on the wire surface has a great influence on the cutting efficiency of the saw wire.In this study,a mathematic model of the movement of the MAP is presented,and the factors influencing the IEAPs number,including slurry-supply speed and slurry dynamic viscosity,are investigated both by means of simulation analysis and experiments.The results indicate that the number of IEAPs decreases with an increase in the slurry supply speed.The cutting efficiency increases gradually with the increase of slurry supply speed,but the growth rate of wire saw cutting efficiency slows down when the slurry supply speed exceeds a given threshold.The number of IEAPs adsorbed by saw wire increases with a decrease in the dynamic viscosity of the cutting fluid,while the cutting efficiency first increases and then decreases.The cutting efficiency attains its highest value when the dynamic viscosity of the cutting fluid is 0.0047 Pa⋅s.The experimental results agree with the simulation results,and provide some guidance for the practical application of the MIFAWS process.