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Surface lurking and interfacial ion release strategy for fabricating a superhydrophobic coating with scaling inhibition
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作者 Ming-Liang Zhu Hui-Juan Qian +4 位作者 Wei-Hao Fan Chi-Jia Wang Rui-Xia Yuan Qing-He Gao Huai-Yuan Wang 《Petroleum Science》 SCIE CAS CSCD 2022年第6期3068-3079,共12页
The design and manufacture of anti-scaling surface is a prospective way to prevent scaling in oil field.In this work,a novel superhydrophobic Cu^(2+)-loaded and DTPMPA-modified anodized copper oxide(S-Cu^(2+)/D-ACO)co... The design and manufacture of anti-scaling surface is a prospective way to prevent scaling in oil field.In this work,a novel superhydrophobic Cu^(2+)-loaded and DTPMPA-modified anodized copper oxide(S-Cu^(2+)/D-ACO)coating was fabricated by modification of 1H,1H,2H,2H-perfluorodecyltriethoxysilane.The valid storing of scale inhibitors at the coating surface and the interfacial release of Cu^(2+)ions contribute to enhancing the anti-scaling of the S-Cu^(2+)/D-ACO coating.The water contact angle of the S-Cu^(2+)/D-ACO coating is 163.03°and exhibits superhydrophobicity,which makes it difficult for CaCO_(3)to deposit at the surface of the coating.DTPMPA will steadily lurk into the inner space,and Cu^(2+)will be loaded at the interface in the form of the DTPMPA:Cu^(2+)chelate.During the deposition of CaCO_(3),the dynamic release of DTPMPA can be realized by transferring DTPMPA:Cu^(2+)to DTPMPA:Ca^(2+).Interestingly,the released Cu^(2+)hinders the active growth of CaCO_(3).After 48 h of scaling,the mass of CaCO_(3)scale at the S-Cu^(2+)/D-ACO coating surface is only 44.1%that of the anodized copper oxide coating.The excellent anti-scaling performance of the S-Cu^(2+)/D-ACO coating is determined by the synergistic effect of the DTPMPA lurking and dynamic release,as well as the Cu^(2+)inhibition at the interface of superhydrophobic coating and against CaCO_(3)deposition.This research provides a new exploration for designing and fabricating anti-scaling superhydrophobic surface for oil field development. 展开更多
关键词 Copper alloy DTPMPA lurking And dynamic release Cu^(2+)loading and chelating CaCO3 deposition scale inhibition mechanism
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