A comprehensive review on microchannel heat sinks for electronics cooling

The heat generation of electronic devices is increasing dramatically,which causes a serious bottleneck in the thermal management of electronics,and overheating will result in performance deterioration and even device damage.With the development of micro-machining technologies,the microchannel heat sink(MCHS)has become one of the best ways to remove the considerable amount of heat generated by high-power electronics.It has the advantages of large specific surface area,small size,coolant saving and high heat transfer coefficient.This paper comprehensively takes an overview of the research progress in MCHSs and generalizes the hotspots and bottlenecks of this area.The heat transfer mechanisms and performances of different channel structures,coolants,channel materials and some other influencing factors are reviewed.Additionally,this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer.The comprehensive review is expected to provide a theoretical reference and technical guidance for further research and application of MCHSs in the future.

Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.

Computer simulation of Cu:AlOOH/water in a microchannel heat sink using a porous media technique and solved by numerical analysis AGM and FEM

Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the coherent nanofluid-guided microchannel heat sink are described in this perusal.The porous media approximate was used to search the heat distribution in the expanded sheet and Cu:γ-AlOOH/water.A hybrid blend of Boehme copper and aluminum nanoparticles is evaluated to have a cooling effect on the microchannel heat sink.By using Akbari Ganji and finite element methods,linear and non-linear differential equations as well as simple dimensionless equations have been analyzed.The purpose of this study is to investigate the fluid and thermal parameters of copper hybrid solution added to water,such as Nusselt number and Darcy number so that we can reach the best cooling of the fluid.Also,by installing a piece of fin on the wall of the heat sink,the coefficient of conductive heat transfer and displacement heat transfer with the surrounding air fluid increases,and the efficiency of the system increases.The overall results show that expanding values on the NP(series heat transfer fluid system maximizes performance with temperatures)volume division of copper,as well as boehmite alumina particles,lead to a decrease within the stream velocity of the Cu:AlOOH/water.Increasing the volume fraction of nanoparticles in the hybrid mixture decreases the temperature of the solid surface and the hybrid nanofluid.The Brownian movement improves as the volume percentage of nanoparticles in the hybrid mixture grows,spreading the heat across the environment.As a result,heat transmission rates rise.As the Darcy number increases,the thermal field for solid sections and Cu:AlOOH/water improves.

Impact of Cattaneo-Christov Heat Flux in the Nanofluid Flow over an Inclined Permeable Surface with Irreversibility Analysis

This study discusses the magnetohydrodynamic nanofluid flow over an inclined permeable surface influenced by mixed convection, and Cattaeo-Christov heat flux. The heat transfer analysis is performed in the presence of a heat source/sink and thermal stratification. To gauge the energy loss during the process, an irreversibility analysis is also performed. A numerical solution to the envisaged problem is obtained using the bvp4c package of MATLAB. Graphs are drawn to assess the consequences of the arising parameters against the associated profiles. The results show that an augmentation in the magnetic field and nanomaterial volume fraction results in an enhancement in the temperature profile. A strong magnetic field can significantly reduce the fluid velocity. The behavior of the Skin friction coefficient against the different estimates of emerging parameters is discussed. .

Fabrication and testing of phase change heat sink for high power LED

A novel phase change heat sink was fabricated for packaging cooling of high power light emitting diode （LED）. 3D structures as enhanced boiling structure in the evaporation surface were composed of a spiral micro-groove along circumferential direction and radial micro-grooves which were processed by ploughing-extrusion （P-E） and stamping, respectively. Meanwhile, the cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. Operational characteristics were tested under different heat loads and refrigerants. The experimental results show that phase change heat sink is provided with a good heat transfer capability and the temperature of phase change heat sink reaches 86.8 ℃ under input power of 10 W LED at ambient temperature of 20 ℃.

关于“bow wave”和“heat sink”的正确译法

在概念上,bow wave应译为"头波"而不是"弓形波"。同样,heat sink应译为"热汇"而不是"热沉"。

Interannual Variability of Atmospheric Heat Source/ Sink over the Qinghai-Xizang (Tibetan) Plateau and its Relation to Circulation

Based on the 1961-1995 atmospheric apparent heat source/sink and the 1961-1990 snow-cover days and depth over the Qinghai-Xizang Plateau (QXP) and the 1961-1995 reanalysis data of NCEP/NCAR and the 1975-1994 OLR data, this paper discusses the interannual variability of the heat regime and its relation to atmospheric circulation It is shown that the interannual variability is pronounced, with maximal variability in spring and autumn, and the variability is heterogeneous horizontally. In the years with the weak (or strong) winter cold source, the deep trough over East Asia is to the east (or west) of its normal, which corresponds to strong (or weak) winter monsoon in East Asia. In the years with the strong (or weak) sum mer heat source, there exists an anomalous cyclone (or anticyclone) in the middle and lower troposphere over the QXP and ifs neighborhood and anomalous southwest (or northeast) winds over the Yangtze River valley of China, corresponding to strong (or weak) summer monsoon in East Asia. The summer heat source of the QXP is related to the intensity and position of the South Asia high. The QXP snow cover condition of April has a close relation to the heating intensity of summer. There is a remarkable negative correlation between the summer heat source of the QXP and the convection over the southeastern QXP, the Bay of Bengal, the Indo-China Peninsula, the southeastern Asia, the southwest part of China and the lower reaches of the Yangtze River and in the area from the Yellow Sea of China to the Sea of Japan.

Thermal analysis of an LED module with a novelly assembled heat pipe heat sink

This work aims to improve the thermal performance of a light emitting diode(LED) module by employing a novelly assembled heat pipe heat sink. The heat pipe was embedded into the heat sink by a phase change expansion assembly(PCEA) process, which was developed by both finite element(FE) analysis and experiments. Heat transfer performance and optical performance of the LED modules were experimentally investigated and discussed. Compared to the LED module with a traditionally assembled heat pipe heat sink, the LED module employing the PCEA process exhibits about 20% decrease in the thermal resistance from the MCPCB to the heat pipe. The junction temperature is 4% lower and the luminous flux is 2% higher. The improvement in the thermal and optical performance is important to the high power LED applications.

Diagnostic Study of Apparent Heat Sources and Moisture Sinks in the South China Sea and its Adjacent Areas during the Onset of 1998 SCS Monsoon

The apparent heat sources (?Q1 ?) and moisture sinks (?Q2 ?) are calculated based on the reanalyzed data of the South China Sea Monsoon Experiment (SCSMEX) from May 1 to August 31, 1998. It is found that the formation and distribution of the atmospheric heat sources are important for the monsoon onset. The earlier onset of the SCS monsoon is the result of enduring atmospheric heating in the Indo–China Peninsula and South China areas. The atmospheric heating firstly appears in the Indo–China Peninsula area and the sensible heat is the major one. The 30–50 day periodic oscillation of atmospheric heat sources between the SCS area and the western Pacific warm pool has a reverse phase distribution before the middle of July and the low frequency oscillation of heat sources in SCS area has an obvious longitudinal propagation. The 30–50 day low frequency oscillation has vital modificatory effects on the summer monsoon evolution during 1998. Key words Apparent heat sources - Apparent moisture sinks - The South China Sea monsoon - Diagnostic Study Sponsored by the National Key Project of Fundamental Research “ SCSMEX” and the Research Fund for the Doctoral Program of Higher Education: “ Study of the Air-sea Interaction in the SCS Monsoon Region”.

Anomalous Atmospheric Circulation, Heat Sources and Moisture Sinks in Relation to Great Precipitation Anomalies in the Yangtze River Valley

Using the summer (June to August) monthly mean data of the National Centers for Environmental Predictions (NCEP) - National Center for Atmospheric Research (NCAR) reanalysis from 1980 to 1997, atmospheric heat sources and moisture sinks are calculated. Anomalous circulation and the vertically integrated heat source with the vertical integrated moisture sink and outgoing longwave radiation (OLR) flux are examined based upon monthly composites for 16 great wet-spells and 8 great dry-spells over the middle-lower reaches of the Yangtze River. The wind anomaly exhibits prominent differences between the great wet-spell and the great dry-spell over the Yangtze River Valley. For the great wet-spell, the anomalous southerly from the Bay of Bengal and the South China Sea and the anomalous northerly over North China enhanced low-level convergence toward a narrow latitudinal belt area (the middle-lower reaches of the Yangtze River). The southerly anomaly is connected with an anticyclonic anomalous circulation system centered at 22 degreesN, 140 degreesE and the northerly anomaly is associated with a cyclonic anomalous circulation system centered at the Japan Sea. In the upper level, the anomalous northwesterly between an anticyclonic anomalous system with the center at 23 degreesN, 105 degreesE and a cyclonic anomalous system with the center at Korea diverged over the middle-lower reaches of the Yangtze River. On the contrary, for the great dry-spell, the anomalous northerly over South China and the anomalous southerly over North China diverged from the Yangtze River Valley in the low level. The former formed in the western part of a cyclonic anomalous system centered at 23 degreesN, 135 degreesE. The latter was located in the western ridge of an anticyclonic anomalous system in the northwestern Pacific. The upper troposphere showed easterly anomaly that converged over the middle-lower reaches of the Yangtze River. A cyclonic anomalous system in South China and an anticyclonic system centered in the Japan Sea enhanced the easterly. Large atmospheric heat source anomalies of opposite signs existed over the western Pacific - the South China Sea, with negative in the great wet-spell and positive in the great dry-spell. The analysis of heat source also revealed positive anomalous heat sources during the great wet-spell and negative anomalous heat sources during the great dry-spell over the Yangtze River valley. The changes of the moisture sink and OLR were correspondingly altered, implying the change of heat source anomaly is due to the latent heat releasing of convective activity. Over the southeastern Tibetan Plateau- the Bay of Bengal, the analysis of heat source shows positive anomalous heat sources during the great wet-spell and negative anomalous heat sources during the great dry-spell because of latent heating change. The change of divergent wind coexisted with the change of heat source. In the great wet-spell, southerly divergent wind anomaly in the low level and northerly divergent wind anomaly in high-level are seen over South China. These divergent wind anomalies are helpful to the low-level convergence anomaly and high-level divergence anomaly over the Yangtze River valley. The low-level northerly divergent wind anomaly and high-level southerly divergent wind anomaly over South China reduced the low-level convergence and high-level divergence over the Yangtze River valley during the great dry-spell.

Fabrication, microstructure and properties of SiCp/Cu heat sink materials

Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.

Theoretic heat sink simulation and experimental investigation of the pyrolysis of substituted cyclohexanes

Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherein the substituent effects were detailedly discussed under supercritical condition. It was found that Reaxgen program played a good part in the screening and optimization of cyclohexanes. A good agreement with the experimental data for the mono-substituted and bi-substituted cyclohexanes was demonstrated, however, some deviation for the tri-substituted cyclohexanes were observed. The experiment results indicated that the gaseous product yield increased sharply for mono- substituted cyclohexanes with short substituents containing no more than two carbons. Nevertheless, continuous increase in the alkyl chain depressed the gaseous product yield smoothly. The cyclic substituent dramatically inhibited the pyrolysis of cyclohexanes. All the substituents but cyclohexyl had no obvious effect on the yield of hydrogen and olefins （≤C4）. For bi-substituted cyclohexanes, the more close the distance between the two substituents, the higher the gaseous product yield was obtained. However, opposite result on the selectivity to hydrogen and olefins （≤C4） was generally obtained except 1,3-dimethylcyclohexane. The position of tri-substituents acted little significance on the gaseous product yield, as well as the selectivity to hydrogen and olefins （≤C4）.

Integrated Behavior of Carbon and Copper Alloy Heat Sink Under Different Heat Loads and Cooling Conditions

An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.

Heat transfer performance testing of a new type of phase change heat sink for high power light emitting diode

In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode （LED）, a kind of miniaturized phase change heat sink is developed for high power LED packaging. First, the fabrication process of miniaturized phase change heat sink is investigated, upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink, the formation of three-dimensional boiling structures at the evaporation end, the sintering of the wick, and the encapsulation of high power LED phase change heat sink. Subsequently, with the assistance of the developed testing system, heat transfer performance of the heat sink is tested under the condition of natural convection, upon which the influence of thermal load and working medium on the heat transfer performance is investigated. Finally, the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink. Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink, and is suitable for the packaging of high power LED.

Convection of Maxwell fluid over stretching porous surface with heat source/sink in presence of nanoparticles:Lie group analysis

The convection of a Maxwell fluid over a stretching porous surface with a heat source/sink in the presence of nanoparticles is investigated. The Lie symmetry group transformations are used to convert the boundary layer equations into coupled nonlinear ordinary differential equations. The ordinary differential equations are solved numerically by the Bvp4c with MATLAB, which is a collocation method equivalent to the fourth-order mono-implicit Runge-Kutta method. Furthermore, more attention is paid to the effects of the physical parameters, especially the parameters related to nanoparticles, on the temperature and concentration distributions with consideration of permeability and the heat source/sink.

Mixed convection flow in vertical channel with boundary conditions of third kind in presence of heat source/sink

The effects of viscous dissipation and heat source/sink on fully developed mixed convection for the laminar flow in a parallel-plate vertical channel are investigated. The plate exchanges heat with an external fluid. Both conditions of equal and different reference temperatures of the external fluid are considered. First, the simple cases of the negligible Brinkman number or the negligible Grashof number are solved analytically. Then, the combined effects of buoyancy forces and viscous dissipation in the presence of heat source/sink are analyzed by a perturbation series method valid for small values of the perturbation parameter. To relax the conditions on the perturbation parameter, the velocity and temperature fields are solved by using the Runge-Kutta fourth-order method with the shooting technique. The velocity, temperature, skin friction, and Nusselt num- bers at the plates are discussed numerically and presented through graphs.

CFD investigation of the feasibility of polymer-based microchannel heat sink as thermal solution

Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCHSs due to their high thermal conductivity.Consequently,MCHSs are heavy due to the high density of these materials albeit the small footprint of MCHSs.Polymer-based materials are interesting alternatives.Despite their poor thermal conductivity,lightweight feature attracts the interest of researchers.Heat transfer is a conjugate process of heat conduction and heat convection.Poor heat conductions aspect may be compensated through enhancement of heat convection aspects.Although polymer-based materials have been used in microscale heat transfer studies,their focus was not on their feasibility.The present study aims to evaluate the feasibility of polymer-based MCHSs as thermal solutions.The effect of thermal conductivity of fabrication materials,including polymer-based PDMS,PTFE,PDMS/MWCNT,and metal-based aluminum,on the thermal performance of MCHSs was investigated and compared at various inlet flow rate,fluid thermal conductivity,and microchannel ratio at different constant heat fluxes using three-dimensional CFD approach.Results showed that the thermal performance of MCHSs was greatly affected by the heat conduction aspect in which poor heat conduction limited the thermal performance improvement due to enhanced heat convection aspects.This suggests polymer-based materials have the potential for heat transfer applications through thermal conductivity enhancement.This was confirmed in the further analysis using a recently proposed high thermal conductivity polymer-based graphite/epoxy MCHS and a hybrid-based PDMS/aluminum MCHS.

Microchannel heat sink;Nanofluids;Entropy generation;Numerical analysis;Laminar flow

Based on the Second Law of Thermodynamics, the entropy generation is studied for laminar forced convection flow of different nanoparticles(Al_2 O_3, CuO and SiO_2) mixed with water through a hexagon microchannel heat sink(HMCHS). The effects of different heat fluxes and Reynolds numbers on the entropy generation for different nanofluids, volume fractions and nanoparticles diameter are investigated. The heat flux is in the range of 125 to 500 kW·m^(-2) and the Reynolds numbers vary between 200 and 1500. The thermal, frictional and total entropy generations are calculated by integrating the volumetric rate components over the entire HMCHS. The results clearly show that the rise in the heat flux leads to an increase in the thermal entropy generation for nanofluids and pure water but they don't have any influence on the frictional entropy generation. Moreover, when the Reynolds number increases, the frictional entropy generation increases while the thermal entropy generation decreases. The results revealed that at low heat fluxes and high Reynolds numbers, pure water gives the lowest entropy generation, while at high heat flux the nanofluid has to be used in order to lower the overall irreversibility.

Thermal Analysis of High Power LED on Heat Sink

Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.

Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling

A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the actual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.