Annealing was carried out at 950 and 1120 degreesC under various As pressure for undoped (ND) semi-insulating (SI) LECGaAs. The effects of annealing on native defects and electrical properties were investigated. Exper...Annealing was carried out at 950 and 1120 degreesC under various As pressure for undoped (ND) semi-insulating (SI) LECGaAs. The effects of annealing on native defects and electrical properties were investigated. Experimental results indicate that, after an annealing at 950 degreesC for 14 h under low As pressure, the Hall mobility decreases and the resistivity increases dramatically for the samples. These changes in electrical properties are due to the generation of intrinsic acceptor defects, and the generation of the intrinsic acceptor defects originates from the outdiffusion of As interstitial at high temperature. The generation of the intrinsic defects and these changes in electrical properties can be suppressed by increasing the applied As pressure during annealing. The concentration of the main donor defect E12 (AsGaVGa) can be decreased by about one order of magnitude by an evacuated annealing at 1120 degreesC for 2-8 h followed by a fast cooling. The decrease in E12 concentration can also be suppressed by increasing the As pressure during annealing.展开更多
One-port surface acoustic wave resonators(SAWRs) are fabricated on semi-insulating high-quality bulk GaN and GaN film substrates, respectively. The semi-insulating GaN substrates are grown by hydride vapor phase epita...One-port surface acoustic wave resonators(SAWRs) are fabricated on semi-insulating high-quality bulk GaN and GaN film substrates, respectively. The semi-insulating GaN substrates are grown by hydride vapor phase epitaxy(HVPE)and doped with Fe. The anisotropy of Rayleigh propagation and the electromechanical coupling coefficient in Fe-doped GaN are investigated. The difference in resonance frequency between the SAWs between [1120] GaN and [1100] GaN is about 0.25% for the Rayleigh propagation mode, which is smaller than that of non-intentionally doped GaN film(~1%)reported in the literature. The electromechanical coupling coefficient of Fe-doped GaN is about 3.03%, which is higher than that of non-intentionally doped GaN film. The one-port SAWR fabricated on an 8-μm Fe-doped GaN/sapphire substrate has a quality factor of 2050, and that fabricated on Fe-doped bulk GaN has a quality factor as high as 3650. All of our results indicate that high-quality bulk GaN is a very promising material for application in SAW devices.展开更多
Two-inch semi-insulating SiC bulk crystals with resistivity higher than 1 × 10^6 Qcm were achieved by vanadium doping during sublimation. Secondary-ion-mass-spectrometry （SIMS） was employed to determine the con...Two-inch semi-insulating SiC bulk crystals with resistivity higher than 1 × 10^6 Qcm were achieved by vanadium doping during sublimation. Secondary-ion-mass-spectrometry （SIMS） was employed to determine the concentration of impurities in the crystals, such as B, AI, V and N. These results indicated that the concentration of nitrogen and aluminum kept on decreasing and the concentration of B and V was almost constant during the whole growth. An inner crucible was used to control the exhausting of vanadium, which made the uniformity of the high resistivity （〉1×10^6 Ωcm） in the wafer up to 80%. High-performance AlGaN/GaN high-electronmobility-transistor （HEMT） materials and devices were grown and fabricated on semi-insulating 6H-SiC sub- strates. The two-dimensional electron gas （2DEG） mobility at room-temperature was 1795 cm^2/V-s. The charge carrier concentration of the substrate determined by capacitance-voltage （C-V） test was 7.3×10^15 cm^-3. The device with a gate width of I mm exhibits a maximum output power of 5.5 W at 8 GHz, which proves the semi-insulating property of the substrates indirectly.展开更多
The advancements in the technology development for silicon carbide(SiC) lateral devices are summarized in the past years.By replacing conducting substrates in the conventional devices with semi-insulating ones and by ...The advancements in the technology development for silicon carbide(SiC) lateral devices are summarized in the past years.By replacing conducting substrates in the conventional devices with semi-insulating ones and by considering the charge compensation in the drift layer based on superjunction principle, blocking voltage can be enhanced by more than two times compared with those values reported in the literature.SiC lateral PiN diodes,JFETs,MOSFETs and IGBTs are realized with blocking voltages as high as 4.2 kV.A COMS inverter is also demonstrated at the sametime with the process of high-voltage lateral IGBTs, showing the potential for future SiC power management integrated circuits(ICs).展开更多
Based on the theoretical analysis of the 4H-SiC Schottky-barrier diodes （SBDs） with field plate termination, 4H-SiC SBD with semi-insulating polycrystalline silicon （SIPOS） FP termination has been fabricated. The ...Based on the theoretical analysis of the 4H-SiC Schottky-barrier diodes （SBDs） with field plate termination, 4H-SiC SBD with semi-insulating polycrystalline silicon （SIPOS） FP termination has been fabricated. The relative dielectric con-stant of the SIPOS dielectric first used in 4H-SiC devices is 10.4, which is much higher than that of the SiO2 dielectric, leading to benefitting the performance of devices. The breakdown voltage of the fabricated SBD could reach 1200 V at leak-age current 20 μA, about 70% of the theoretical breakdown voltage. Meanwhile, both of the simulation and experimental results show that the length of the SIPOS FP termination is an important factor for structure design.展开更多
文摘Annealing was carried out at 950 and 1120 degreesC under various As pressure for undoped (ND) semi-insulating (SI) LECGaAs. The effects of annealing on native defects and electrical properties were investigated. Experimental results indicate that, after an annealing at 950 degreesC for 14 h under low As pressure, the Hall mobility decreases and the resistivity increases dramatically for the samples. These changes in electrical properties are due to the generation of intrinsic acceptor defects, and the generation of the intrinsic acceptor defects originates from the outdiffusion of As interstitial at high temperature. The generation of the intrinsic defects and these changes in electrical properties can be suppressed by increasing the applied As pressure during annealing. The concentration of the main donor defect E12 (AsGaVGa) can be decreased by about one order of magnitude by an evacuated annealing at 1120 degreesC for 2-8 h followed by a fast cooling. The decrease in E12 concentration can also be suppressed by increasing the As pressure during annealing.
基金Project supported by the National Key Research and Development Program of China(Grant No.2017YFB0403002)the National Science Fund for Distinguished Young Scholars,China(Grant No.Y3CHC11001)the National Natural Science Foundation of China(Grant No.11604368)
文摘One-port surface acoustic wave resonators(SAWRs) are fabricated on semi-insulating high-quality bulk GaN and GaN film substrates, respectively. The semi-insulating GaN substrates are grown by hydride vapor phase epitaxy(HVPE)and doped with Fe. The anisotropy of Rayleigh propagation and the electromechanical coupling coefficient in Fe-doped GaN are investigated. The difference in resonance frequency between the SAWs between [1120] GaN and [1100] GaN is about 0.25% for the Rayleigh propagation mode, which is smaller than that of non-intentionally doped GaN film(~1%)reported in the literature. The electromechanical coupling coefficient of Fe-doped GaN is about 3.03%, which is higher than that of non-intentionally doped GaN film. The one-port SAWR fabricated on an 8-μm Fe-doped GaN/sapphire substrate has a quality factor of 2050, and that fabricated on Fe-doped bulk GaN has a quality factor as high as 3650. All of our results indicate that high-quality bulk GaN is a very promising material for application in SAW devices.
基金supported by the National Natural Sci-ence Foundation of China under grant No. 50472068 and No. 50721002the National "863" High Technology Re-search and Development Program of China under grant No. 2006AA03A145 and No. 2007AA03Z405+1 种基金the Na-tional Basic Research Program of China under grant No.2009CB930503the Cultivation Fund of the Key Scientific and Technical Innovation Project, Ministry of Education of China under grant No. 707039
文摘Two-inch semi-insulating SiC bulk crystals with resistivity higher than 1 × 10^6 Qcm were achieved by vanadium doping during sublimation. Secondary-ion-mass-spectrometry （SIMS） was employed to determine the concentration of impurities in the crystals, such as B, AI, V and N. These results indicated that the concentration of nitrogen and aluminum kept on decreasing and the concentration of B and V was almost constant during the whole growth. An inner crucible was used to control the exhausting of vanadium, which made the uniformity of the high resistivity （〉1×10^6 Ωcm） in the wafer up to 80%. High-performance AlGaN/GaN high-electronmobility-transistor （HEMT） materials and devices were grown and fabricated on semi-insulating 6H-SiC sub- strates. The two-dimensional electron gas （2DEG） mobility at room-temperature was 1795 cm^2/V-s. The charge carrier concentration of the substrate determined by capacitance-voltage （C-V） test was 7.3×10^15 cm^-3. The device with a gate width of I mm exhibits a maximum output power of 5.5 W at 8 GHz, which proves the semi-insulating property of the substrates indirectly.
文摘The advancements in the technology development for silicon carbide(SiC) lateral devices are summarized in the past years.By replacing conducting substrates in the conventional devices with semi-insulating ones and by considering the charge compensation in the drift layer based on superjunction principle, blocking voltage can be enhanced by more than two times compared with those values reported in the literature.SiC lateral PiN diodes,JFETs,MOSFETs and IGBTs are realized with blocking voltages as high as 4.2 kV.A COMS inverter is also demonstrated at the sametime with the process of high-voltage lateral IGBTs, showing the potential for future SiC power management integrated circuits(ICs).
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61234006 and 61274079)the Key Specific Projects of Ministry of Education of China(Grant No.625010101)the Science Project of State Grid,China(Grant No.SGRI-WD-71-13-004)
文摘Based on the theoretical analysis of the 4H-SiC Schottky-barrier diodes （SBDs） with field plate termination, 4H-SiC SBD with semi-insulating polycrystalline silicon （SIPOS） FP termination has been fabricated. The relative dielectric con-stant of the SIPOS dielectric first used in 4H-SiC devices is 10.4, which is much higher than that of the SiO2 dielectric, leading to benefitting the performance of devices. The breakdown voltage of the fabricated SBD could reach 1200 V at leak-age current 20 μA, about 70% of the theoretical breakdown voltage. Meanwhile, both of the simulation and experimental results show that the length of the SIPOS FP termination is an important factor for structure design.
