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Nanocomposites of a Silicon-containing Arylacetylene Resin with Octakis(dimethylsiloxy)octasilsesquoixane 被引量:1
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作者 周燕 BU Xiaojun +2 位作者 黄发荣 DU Lei LIANG Guozheng 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2015年第6期1310-1316,共7页
Nanocomposites(PMSEPE/Q8M8^H) were prepared via solution blending of octakis(dimethylsiloxy)octasilsesquoixane(Q8M8^H) into poly(dimethylsilyleneethynylenephenyleneethynyle ne)(PMSEPE). PMSEPE/Q8M8^H nanocom... Nanocomposites(PMSEPE/Q8M8^H) were prepared via solution blending of octakis(dimethylsiloxy)octasilsesquoixane(Q8M8^H) into poly(dimethylsilyleneethynylenephenyleneethynyle ne)(PMSEPE). PMSEPE/Q8M8^H nanocomposites were characterized by Fourier transform infrared(FT-IR) spectroscopy, rheological measurement, differential scanning calorimetry(DSC), scanning electron microscopy(SEM) and thermal gravimetric analysis(TGA). The experimental results show that the hydrosilylation reaction in PMSEPE/Q8M8^H nanocomposites occurs slowly exceeding 180 ℃. PMSEPE/Q8M8^H nanocomposites can be cured at temperatures less than 260 ℃ and the cube structure of Q8M8^H keeps stable during the curing process. POSS domains are evenly dispersed in the cured nanocomposite. However, serious aggregation of POSS occurs at 15% Q8M8^H content. The thermal and thermooxidative stabilities of PMSEPE/Q8M8^H nanocomposites obviously depend on the content of Q8M8^H. The incorporation of Q8M8^H can effectively enhance the thermal and thermooxidative stabilities of cured PMSEPE. PMSEPE/Q8M8^H nanocomposites can be the candidates for applications in high temperature environment. 展开更多
关键词 silicon-containing arylacetylene resin POSS nanocomposite thermal stability hydrosilylation
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Preparation and Characterization of Cyano-Silicon-Containing Arylacetylene Resins and Their Composites:Dual Enhancement Strategy Involving Physical Interfacial Interactions and Chemical Crosslinking
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作者 Chao-En Jin Hua-Mei Zhu +5 位作者 Lei Wang Fan Wang Ya-Ping Zhu Shi-Feng Deng Hui-Min Qi Lei Du 《Chinese Journal of Polymer Science》 SCIE EI CAS CSCD 2024年第11期1719-1729,I0009,共12页
Silicon-containing arylacetylene (PSA) resins have broad application prospects because of their excellent heat resistance.However,improving their mechanical properties and interfacial bonding with reinforcement fibers... Silicon-containing arylacetylene (PSA) resins have broad application prospects because of their excellent heat resistance.However,improving their mechanical properties and interfacial bonding with reinforcement fibers while maintaining heat resistance is a challenge in engineering applications.Here,poly(diethynylbenzene-methylsilyl-3-benzonitrile)(DEB-CN) and poly(diethynylbenzene-methylsilyl-3,6-diethynylcarbazole-3-benzonitrile)(DEC-CN) were synthesized via an isopropylmagnesium chloride lithium-chloride complex (i-PrMgCl·LiCl),overcoming the compatibility problem between cyano groups and Grignard reagents.The cyano and alkyne groups in the resin underwent cyclization to form pyridine,catalyzed by the-NH-moiety in DEC-CN,resulting in extremely high thermal stability (5%weight loss temperature:669.3°C,glass transition temperature>650°C).The combination of cyano dipole-dipole pairing and hydrogen bonding greatly enhanced the resin-fiber interface properties,while the generated pyridine promoted stress relief in the crosslinked network,substantially improving the mechanical properties of the cyano-silicon-containing arylacetylene resin composites.The flexural strength of quartz fiber cloth/DEC-CN composites was 298.2 MPa at room temperature and 145.9 MPa at 500°C,corresponding to 84.0%and 127.6%enhancements,respectively,over the cyano-free counterpart.These cyano-silicon-containing arylacetylene resins exhibited a dual reinforcement mechanism involving physical interfacial interactions and chemical crosslinking,achieving a good balance between thermal stability and mechanical properties. 展开更多
关键词 silicon-containing arylacetylene resins Cyano group Heat resistance Composite interfaces Mechanical properties
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CHARACTERIZATION OF A MODIFIED SILICON-CONTAINING ARYLACETYLENE RESIN WITH POSS FUNCTIONALITY 被引量:16
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作者 黄发荣 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2011年第6期726-731,共6页
A modified silicon-containing arylacetylene resin with a well-defined organic-inorganic POSS functionality was successfully synthesized by Huisgen azide-alkyne 1,3-dipolar cycloaddition. The POSS hybridized resin exhi... A modified silicon-containing arylacetylene resin with a well-defined organic-inorganic POSS functionality was successfully synthesized by Huisgen azide-alkyne 1,3-dipolar cycloaddition. The POSS hybridized resin exhibits excellent thermal properties which were characterized by differential scanning calorimetry (DSC) and thermogravimetric analyses (TGA). Scanning electron microscope (SEM) was used to characterize fracture surface of the hybridized polymer. The results show that phase separation occurs. The POSS moieties are aggregated each other in the polymer to form 200-400 nm domains. 展开更多
关键词 silicon-containing arylacetylene resin 1 3-Dipolar cycloaddition POSS-hybridized resin High performance resin Modification by click chemistry.
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SYNTHESIS AND CHARACTERIZATION OF POLY[(METHYLSILYLENE ETHYNYLENEPHENYLENEETHYNYLENE)-CO-(DIMETHYLSILYLENE ETHYNYLENEPHENYLENEETHYNYLENE)]S 被引量:4
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作者 黄发荣 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2010年第2期199-207,共9页
A series of poly[(methylsilylene ethynylenephenyleneethynylene)-co-(dimethylsilylene ethynylenephenyleneethynylene)]s were synthesized by the incorporation of various ratios of methylsilylene to dimethylsilylene u... A series of poly[(methylsilylene ethynylenephenyleneethynylene)-co-(dimethylsilylene ethynylenephenyleneethynylene)]s were synthesized by the incorporation of various ratios of methylsilylene to dimethylsilylene units into the polymer chain backbone. The resultant copolymers were soluble in a variety of common organic solvents at room temperature. The copolymers were characterized by FT-IR, ^1H-NMR, GPC, rheological analysis, differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). The results showed that the copolymers exhibited good processability and cured at low temperatures like 200℃. The curing reactions involved in hydrosilylation of Si-H and alkyne groups and the polymerization of alkynes. Td5 (5% weight loss) of the cured copolymers ranged from 629℃ to 686℃, and the decomposition residues of cured copolymers at 1000℃ ranged from 88.1% to 90.9% under nitrogen. Thermal stability of the copolymers increased with the introduction of methylsilylene traits into polymer chains. The cured copolymers were sintered at 1450℃, and the results of X-ray diffraction analysis showed that β-SIC was formed in the sintered products. 展开更多
关键词 silicon-containing arylacetylene resin polymer with methylsilylene and dimethysilyene units mdiethynylbenzene Thermally stable polymer High performance resin.
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Investigation on poly[(methylsilylene ethynylene phenylene ethynylene)-co-(tetramethyldisiloxane ethynylene phenylene ethynylene)] 被引量:3
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作者 Fei Gao Ling Ling Zhang +1 位作者 Fa Rong Huang Lei Du 《Chinese Chemical Letters》 SCIE CAS CSCD 2010年第6期738-742,共5页
Poly[(methylsilylene ethynylene phenylene ethynylene)-co-(tetramethyldisiloxane ethynylene phenylene ethynylene)]was synthesized by polycondensation reaction of m-diethynylbenzene magnesium reagent with 1,3-dichlorote... Poly[(methylsilylene ethynylene phenylene ethynylene)-co-(tetramethyldisiloxane ethynylene phenylene ethynylene)]was synthesized by polycondensation reaction of m-diethynylbenzene magnesium reagent with 1,3-dichlorotetramethyldisiloxane and dichloromethylsilane.The copolymer was characterized by FT-IR,~1H NMR,differential scanning calorimetry and thermogravimetric analysis.The results show that the copolymer exhibits good processability and cures at low temperatures.The cured copolymer shows high thermal stability. 展开更多
关键词 silicon-containing arylacetylene resin SILOXANE m-Diethynylbenzene Methylsilylene
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含硅氢基团甲基芳炔树脂的合成及表征 被引量:24
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作者 张玲玲 高飞 +3 位作者 周围 张健 黄发荣 杜磊 《过程工程学报》 CAS CSCD 北大核心 2009年第3期574-579,共6页
以二氯甲基硅烷和间二乙炔基苯为原料,通过格氏反应合成了不同分子量的含硅氢基团甲基芳炔树脂(PSA-H),并分析确定了合成产物的结构.树脂的热固化行为和固化树脂的热稳定性分析表明,PSA-H树脂具有良好的加工性能,可在较低的温度下(低于... 以二氯甲基硅烷和间二乙炔基苯为原料,通过格氏反应合成了不同分子量的含硅氢基团甲基芳炔树脂(PSA-H),并分析确定了合成产物的结构.树脂的热固化行为和固化树脂的热稳定性分析表明,PSA-H树脂具有良好的加工性能,可在较低的温度下(低于200℃)发生交联反应.其固化物有较低的介电常数(2.57F/m)、较低的介电损耗(tanδ0.001)和优异的热稳定性,在N2气氛下5%失重温度Td5为675~703℃,1000℃的残留率为90.9%~91.4%.PSA-H树脂固化物在氩气中1450℃下烧结可形成含β-SiC陶瓷. 展开更多
关键词 含硅芳炔树脂 含硅氢基团树脂 陶瓷前驱体
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含柔性链端炔基POSS(POSS-LA)的合成及对含硅芳炔树脂的改性 被引量:3
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作者 步晓君 周燕 黄发荣 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2017年第6期24-29,36,共7页
通过水解缩聚、巯烯加成及酯化反应合成了八(十一烷酸丁炔醇酯基硫醚丙基)笼型倍半硅氧烷(POSS-LA),并通过红外光谱、核磁共振谱、差示扫描量热法等对POSS-LA的结构及性能进行了表征。用POSS-LA与含硅芳炔树脂(PSA)共混制得改性树脂LP-P... 通过水解缩聚、巯烯加成及酯化反应合成了八(十一烷酸丁炔醇酯基硫醚丙基)笼型倍半硅氧烷(POSS-LA),并通过红外光谱、核磁共振谱、差示扫描量热法等对POSS-LA的结构及性能进行了表征。用POSS-LA与含硅芳炔树脂(PSA)共混制得改性树脂LP-PSA,并对改性LP-PSA树脂进行了表征。研究表明,改性LP-PSA固化物的强度及韧性随POSS-LA的加入而提高。当POSS-LA的质量分数为15%时,弯曲强度可提升86%,冲击断裂能可提升91%。此外,LP-PSA固化物还显示了良好的热稳定性(热分解温度T_(d5)>436℃)。 展开更多
关键词 端炔基倍半硅氧烷 含硅芳炔树脂 增强 增韧
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新型含甲基苯基硅芳醚芳炔树脂的制备与性能 被引量:2
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作者 牛奇 唐均坤 +4 位作者 李传 骆佳伟 刘晓天 袁荞龙 黄发荣 《航空材料学报》 EI CAS CSCD 北大核心 2019年第3期69-74,共6页
以1,4-二(4’-乙炔苯氧基)苯与甲基苯基二氯硅烷为原料,通过格氏反应合成具有二苯醚结构的含甲基苯基硅芳醚芳炔(PSEA-P2)树脂,进而制备其碳纤维增强复合材料。通过核磁共振(1H-NMR)、红外光谱(FT-IR)、差热分析(DSC)、热重分析(TGA)、... 以1,4-二(4’-乙炔苯氧基)苯与甲基苯基二氯硅烷为原料,通过格氏反应合成具有二苯醚结构的含甲基苯基硅芳醚芳炔(PSEA-P2)树脂,进而制备其碳纤维增强复合材料。通过核磁共振(1H-NMR)、红外光谱(FT-IR)、差热分析(DSC)、热重分析(TGA)、动态热机械分析(DMA)等分析手段对树脂及其复合材料的结构与性能进行表征。结果表明:PSEA-P2树脂加工窗口为110~175℃,适合复合材料模压成型;树脂浇铸体具有优良的力学强度和耐热性能,在室温~450℃未出现玻璃化转变,弯曲强度可达54.3MPa,氮气下热分解温度Td5达到531℃;T300碳纤维增强复合材料室温下弯曲强度可达518.0MPa,400℃下弯曲强度保留率为53%。 展开更多
关键词 含甲基苯基硅芳醚芳炔树脂 耐高温树脂 先进树脂基复合材料 高性能树脂
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碳纤维表面处理对含硅芳炔树脂复合材料的界面增强 被引量:3
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作者 李传 刘晓天 +2 位作者 唐均坤 袁荞龙 黄发荣 《高分子材料科学与工程》 EI CAS CSCD 北大核心 2022年第7期38-44,共7页
含硅芳炔(PSA)树脂是一类具有优异耐热性的树脂基体,其纤维复合材料可应用于航空航天领域,但是PSA树脂与纤维的复合材料存在界面结合较弱的问题。文中针对这个问题,以T300碳纤维/PSA树脂复合材料为对象开展研究。首先,对T300碳纤维布进... 含硅芳炔(PSA)树脂是一类具有优异耐热性的树脂基体,其纤维复合材料可应用于航空航天领域,但是PSA树脂与纤维的复合材料存在界面结合较弱的问题。文中针对这个问题,以T300碳纤维/PSA树脂复合材料为对象开展研究。首先,对T300碳纤维布进行高温处理,并进行了热重分析、红外光谱、X射线光电子能谱及扫描电镜表征;其次,制备了T300/PSA树脂复合材料,探究了其性能变化;最后,用端炔基苯并噁嗪(BA)偶联剂涂敷高温处理后的碳纤维布,再与PSA树脂复合,研究了复合材料性能变化。结果表明,高温处理的T300碳纤维/PSA树脂复合材料力学性能提高,高温处理的T300碳纤维布再经BA偶联剂涂敷,其PSA树脂复合材料的力学性能可进一步提高,常温弯曲强度提高到了413.1 MPa,提升幅度为53.9%;450℃弯曲强度提高到了295.5 MPa,提升幅度为44.3%。 展开更多
关键词 含硅芳炔树脂 碳纤维复合材料 苯并噁嗪 碳纤维表面处理 高性能复合材料
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含硅芳炔树脂合成工艺优化 被引量:2
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作者 程利 邓诗峰 +1 位作者 杜磊 周燕 《热固性树脂》 CAS CSCD 北大核心 2016年第1期34-38,共5页
以二乙炔基苯和二甲基二氯硅烷为原料,2-甲基四氢呋喃为溶剂,合成了含硅芳炔树脂。采用核磁共振波谱、红外光谱、凝胶色谱、热失重分析和示差扫描量热分析研究了反应条件对树脂产率的影响,确定了最佳反应条件,并对树脂的结构和性能进行... 以二乙炔基苯和二甲基二氯硅烷为原料,2-甲基四氢呋喃为溶剂,合成了含硅芳炔树脂。采用核磁共振波谱、红外光谱、凝胶色谱、热失重分析和示差扫描量热分析研究了反应条件对树脂产率的影响,确定了最佳反应条件,并对树脂的结构和性能进行了表征。结果表明,2-甲基四氢呋喃与镁粉物质的量比为3∶1,反应温度85℃,反应时间1.5 h时合成树脂的产率达到93.8%。该树脂可在170℃固化,加工性能良好。树脂固化物具有优异的热稳定性,N_2气氛下5%热分解温度达到619℃,800℃下树脂残留率为91%左右。 展开更多
关键词 含硅芳炔树脂 2-甲基四氢呋喃 合成 工艺优化 热稳定性
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