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Doping Silicon Wafers with Boron by Use of Silicon Paste 被引量:2
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作者 Yu Gao Shu Zhou +3 位作者 Yunfan Zhang Chen Dong Xiaodong Pi Deren Yang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2013年第7期652-654,共3页
In this work we introduce recently developed silicon-paste-enabled p-type doping for silicon. Boron-doped silicon nanoparticles are synthesized by a plasma approach. They are then dispersed in solvents to form silicon... In this work we introduce recently developed silicon-paste-enabled p-type doping for silicon. Boron-doped silicon nanoparticles are synthesized by a plasma approach. They are then dispersed in solvents to form silicon paste. Silicon paste is screen-printed at the surface of silicon wafers. By annealing, boron atoms in silicon paste diffuse into silicon wafers. Chemical analysis is employed to obtain the concentrations of boron in silicon nanoparticles. The successful doping of silicon wafers with boron is evidenced by secondary ion mass spectroscopy (SIMS) and sheet resistance measurements. 展开更多
关键词 Silicon nanoparticles Silicon paste DOPING BORON
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