Atomic-Scale Friction Studies on Single-Crystal Gallium Arsenide Using Atomic Force Microscope and Molecular Dynamics Simulation

This paper provides a fresh perspective and new insights into nanoscale friction by investigating it through molecular dynamics(MD)simulation and atomic force microscope(AFM)nanoscratch experiments.This work considered gallium arsenide,an importantⅢ-Ⅴdirect bandgap semiconductor material residing in the zincblende structure,as a reference sample material due to its growing usage in 5G communication devices.In the simulations,the scratch depth was tested as a variable in the fine range of 0.5-3 nm to understand the behavior of material removal and to gain insights into the nanoscale friction.Scratch force,normal force,and average cutting forces were extracted from the simulation to obtain two scalar quantities,namely,the scratch cutting energy(defined as the work performed to remove a unit volume of material)and the kinetic coefficient of friction(defined as the force ratio).A strong size effect was observed for scratch depths below 2 nm from the MD simulations and about 15 nm from the AFM experiments.A strong quantitative corroboration was obtained between the specific scratch energy determined by the MD simulations and the AFM experiments,and more qualitative corroboration was derived for the pile-up and the kinetic coefficient of friction.This conclusion suggests that the specific scratch energy is insensitive to the tool geometry and the scratch speed used in this investigation.However,the pile-up and kinetic coefficient of friction are dependent on the geometry of the tool tip.

Preparation, characterization and nonlinear optical properties of colloidal gallium arsenide nanocrystals

GaAs nanocrystals were prepared via a simple mechanical ball milling technique. The prepared GaAs nanocrystals have high purity and could form colloidal ethanol suspension without any surfactant additives. The colloidal GaAs nanocrystal suspension displayed excellent two-photon absorption property over the visible and near-infrared region from 490 nm to 1064 nm, which enables it to become a promising broadband optical limiting material.

Burst mode enabled ultrafast laser inscription inside gallium arsenide

Ultrafast laser inscription(ULI)inside semiconductors offers new perspectives for 3D monolithic structures to be fabricated and new functionalities to be added in electronic and photonic microdevices.However,important challenges remain because of nonlinear effects such as strong plasma generation that distort the energy delivery at the focal point when exposing these materials to intense infrared light.Up to now,the successful technological demonstrations have primarily concentrated on silicon(Si).In this paper,we target at another important semiconductor:gallium arsenide(GaAs).With nonlinearities higher than those of Si,3D-machining of GaAs with femtosecond pulses becomes even harder.However,we show that the difficulty can be circumvented by burst-mode irradiation.We generate and apply trains of pulses at terahertz repetition rates for efficient pulse-to-pulse accumulation of laser-induced free carriers in the focal region,while avoiding an overdose of prefocal excitations.The superior performance of burst-mode irradiation is confirmed by a comparative study conducted with infrared luminescence microscopy.The results indicate a successful reduction of the plasma density in the prefocal region so that higher pulse energy reaches the focal spot.The same method is applied to identify optimum irradiation conditions considering particular cases such as asymmetric pulse trains and aberrated beams.With 64-pulse trains,we successfully manage to cross the writing threshold providing a solution for ULI inside GaAs.The application potential is finally illustrated with a stealth dicing demonstration by taking benefit of the burst mode.The irradiation method opens wide possibilities for 3D structuring inside GaAs by ULI.

Accurate Electronic, Transport, and Bulk Properties of Zinc Blende Gallium Arsenide (Zb-GaAs)

We report accurate, calculated electronic, transport, and bulk properties of zinc blende gallium arsenide (GaAs). Our ab-initio, non-relativistic, self-con-sistent calculations employed a local density approximation (LDA) potential and the linear combination of atomic orbital (LCAO) formalism. We strictly followed the Bagayoko, Zhao, and William (BZW) method, as enhanced by Ekuma and Franklin (BZW-EF). Our calculated, direct band gap of 1.429 eV, at an experimental lattice constant of 5.65325 Å, is in excellent agreement with the experimental values. The calculated, total density of states data reproduced several experimentally determined peaks. We have predicted an equilibrium lattice constant, a bulk modulus, and a low temperature band gap of 5.632 Å, 75.49 GPa, and 1.520 eV, respectively. The latter two are in excellent agreement with corresponding, experimental values of 75.5 GPa (74.7 GPa) and 1.519 eV, respectively. This work underscores the capability of the local density approximation (LDA) to describe and to predict accurately properties of semiconductors, provided the calculations adhere to the conditions of validity of DFT.

Evaluation of Gallium Arsenide Thermal Expansion Coefficient by Extended X-Ray Absorption Fine Structure

Negative thermal expansion of gallium arsenide has been investigated through temperature dependent Extended X-ray Absorption Fine Structure (EXAFS) measurements. The bond thermal expansion coefficient αbond has been evaluated and compared to negative expansion coefficient αtens due to tension effects. The overall thermal expansion coefficient is the sum?of?αbond?and αtens. Below 60 K, αtens is greater than αbond? yielding to a negative expansion in this temperature region. Tension effects are progressively overcome by the stretching effects in the region 60 - 300 K. The asymmetry of nearest neighbors distribution is not negligible since the gaussian approximation underestimates the bond expansion by about 0.00426 Å. This error decreases when the temperature is lowered. The accuracy in the thermal expansion evaluation and the connection between third cumulant and thermal expansion are discussed.

Determination of Band Structure of Gallium-Arsenide and Aluminium-Arsenide Using Density Functional Theory

This research paper is on Density Functional Theory (DFT) within Local Density Approximation. The calculation was performed using Fritz Haber Institute Ab-initio Molecular Simulations (FHIAIMS) code based on numerical atomic-centered orbital basis sets. The electronic band structure, total density of state (DOS) and band gap energy were calculated for Gallium-Arsenide and Aluminium-Arsenide in diamond structures. The result of minimum total energy and computational time obtained from the experimental lattice constant 5.63 A for both Gallium Arsenide and Aluminium Arsenide is -114,915.7903 eV and 64.989 s, respectively. The electronic band structure analysis shows that Aluminium-Arsenide is an indirect band gap semiconductor while Gallium-Arsenide is a direct band gap semiconductor. The energy gap results obtained for GaAs is 0.37 eV and AlAs is 1.42 eV. The band gap in GaAs observed is very small when compared to AlAs. This indicates that GaAs can exhibit high transport property of the electron in the semiconductor which makes it suitable for optoelectronics devices while the wider band gap of AlAs indicates their potentials can be used in high temperature and strong electric fields device applications. The results reveal a good agreement within reasonable acceptable errors when compared with the theoretical and experimental values obtained in the work of Federico and Yin wang [1] [2].

Dark Current Compensation and Sensitivity Adjustment on Gallium Arsenide Linear Array Detector for X-Ray Imaging

For the last several years, the linear array x-ray detector for x-ray imaging with gallium arsenide direct conversion sensitive elements has been developed and tested at the In-stitute for High Energy Physics. The array consists of 16 sensitive modules. Each module has 128 gallium arsenide (GaAs) sensitive elements with 200 μm pitch. Current article describes two key program procedures of initial dark current compensation of each sensitive element in the linear array, and sensitivity adjustment for alignment of strip pattern in the raw image data. As a part of evaluation process a modular transfer function (MTF) was measured with the slanted sharp-edge object under RQA5 technique as it described in the International Electrotechnical Commission 62220-1 standard (high voltage 70 kVp, additional aluminium filter 21 mm) for images with compensated dark currents and adjusted sensitivity of detector elements. The 10% level of the calculated MTF function has spatial resolution within 2 - 3 pair of lines per mm for both vertical and horizontal orientation.

金薄膜辅助玻璃与砷化镓阳极键合

采用磁控溅射技术在砷化镓(GaAs)表面沉积一层厚度为1μm的金薄膜,将其作为中间层成功实现了Borofloat(BF33)玻璃与GaAs的连接。阳极键合实验结果表明键合电流在短时间内达到峰值,之后迅速降低并且稳定在一个很小的数值范围内,且键合电流峰值随着键合温度与键合电压的升高而增大。通过扫描电子显微镜(SEM)和能谱仪(EDS)对玻璃-GaAs键合界面进行微观形貌观察。结果表明键合界面良好,在400℃、700 V的条件下,玻璃-GaAs键合强度可达到1.53 J/m^(2),且键合强度随着键合温度与键合电压的升高而增大。

一种频率与带宽可调的可重构射频滤波器芯片

本文基于0.25μm砷化镓赝晶高电子迁移率晶体管工艺设计实现了一款频率与带宽皆可调的有源可重构滤波器芯片。该滤波器采用了双通道信道化拓扑结构,每个通道由两级可调谐振器与三级宽带放大器交叉级联构成,通过对通道内各级谐振器频率的同步和异步控制,实现对滤波器的频率与带宽的调谐,通过不同工作频段的通道间切换组合,实现了频率的宽范围调谐。为了验证该设计的有效性,完成了该滤波器的流片,其尺寸为3.1 mm×3.0 mm。经实测,该滤波器通带中心频率可在2.52 GHz~3.92 GHz之间进行调谐,频率调谐比达到了54%,通道内带宽可实现350 MHz~1080 MHz之间的变化,相对带宽可调范围为12%~33%,同时具备了频率和带宽的宽范围调控能力。

砷化镓一维光子晶体加速度计理论性能研究

该系统与以往的光学传感器不同,系统中将一种新的材料—砷化镓—应用于光学微机电系统(MEMS)传感器。基于GaAs的特性和波长调制分析的特点,设计了一个适用于高频率领域的光学MEMS传感器。此外,还使用了ANSYS的有限元分析(FEA)方法和严谨的耦合波分析(RCWA)方法。与其他高频传感器的比较表明,所提出的传感器在测量范围广、灵敏度高、交轴轴灵敏度几乎为零等特性方面显示出优势。所提出的光学传感器的光学灵敏度为2.99276,机械灵敏度为0.54nm/g。第一共振频率为23658.6Hz,线性测量范围为±135g,传感系统的灵敏度为161.61nm/g,工作带宽为0~23.6kHz。

Behavior of exciton in direct−indirect band gap Al_(x)Ga_(1−x)As crystal lattice quantum wells

Excitons have significant impacts on the properties of semiconductors.They exhibit significantly different properties when a direct semiconductor turns in to an indirect one by doping.Huybrecht variational method is also found to influence the study of exciton ground state energy and ground state binding energy in Al_(x)Ga_(1−x)As semiconductor spherical quantum dots.The Al_(x)Ga_(1−x)As is considered to be a direct semiconductor at AI concentration below 0.45,and an indirect one at the concentration above 0.45.With regards to the former,the ground state binding energy increases and decreases with AI concentration and eigenfrequency,respectively;however,while the ground state energy increases with AI concentration,it is marginally influenced by eigenfrequency.On the other hand,considering the latter,while the ground state binding energy increases with AI concentration,it decreases with eigenfrequency;nevertheless,the ground state energy increases both with AI concentration and eigenfrequency.Hence,for the better practical performance of the semiconductors,the properties of the excitons are suggested to vary by adjusting AI concentration and eigenfrequency.

2.4 GHz GaAs HBT高线性度功率放大器设计

为了满足Wi-Fi 6射频前端对高线性度、高发射功率的需求,基于GaAs HBT工艺设计工作于2.4~2.5 GHz的功率放大器.利用有源自适应偏置、二次谐波阻抗控制和多级放大器失真互补实现所设计放大器的高线性输出功率,通过键合金线的高品质因子寄生电感降低输出匹配的插损,并将直流与射频功率检测集成.测试结果表明,所设计放大器的小信号增益为30.6~30.7 dB,输入输出回波损耗均小于-10 dB,输出1 dB压缩功率为29.2 dBm,对应功率附加效率为26.4%.在802.11ax标准、MCS7调制策略、40 MHz带宽的测试信号下,当误差矢量幅度小于-30 dB时,所设计放大器的最大输出功率为24.1 dBm.在MCS9调制策略下,当误差矢量幅度小于-35 dB时,所设计放大器的最大输出功率为23.6 dBm;在MCS11调制策略下,当误差矢量幅度小于-40 dB时,所设计放大器的最大输出功率为22.4 dBm,对应最大功率附加效率为10.2%.

应用于WiFi6的新型高线性度功率放大器设计

针对WiFi 6的设备需求,设计了一款工作在5.15 GHz~5.85 GHz的高线性度砷化镓异质结双极型晶体管射频功率放大器。为了保证大信号和高温下功率管静态工作点的稳定性,采用了一种新型有源自适应偏置电路。对射频功率检测电路进行了设计和改进,有效降低了射频系统的功耗。针对各次谐波分量产生的影响,对输出匹配网络进行了优化。仿真结果表明:该射频功率放大器芯片小信号增益达到了32.6 dB;在中心频率5.5 GHz时1 dB压缩点功率为30.4 dBm,功率附加效率超过27.9%;输出功率为26 dBm时,三阶交调失真低于-40 dBc。实测数据表明:小信号增益大于31.4 dB;5.5 GHz时1 dB压缩点功率为29.06 dBm;输出功率为26 dBm时,三阶交调失真低于-30 dBc。当输出功率为20 dBm时,二次三次谐波抑制到-30 dBc和-45 dBc。

Pressure-driven anomalous thermal transport behaviors in gallium arsenide

High-pressure has been widely utilized to improve material performances such as thermal conductiv-ityκand interfacial thermal conductance G.Gallium arsenide(GaAs)as a functional semiconductor has attracted extensive attention in high-pressure studies for its technological importance and complex structure transitions.Thermal properties of GaAs under high pressure are urgent needs in physics but remain elusive.Herein,we systematically investigateκGaAs and G Al/GaAs of multi-structure up to -23 GPa.We conclude that:(1)in pressurization,phonon group velocity,lattice defects,and electrons play a central role inκGaAs in elastic,plastic,and metallization regions,respectively.The increased phonon density of states(PDOS)overlap,group velocity,and interfacial bonding enhances G Al/GaAs.(2)In depressurization,electrons remain the dominant factor on κ GaAs from 23 to 13.5 GPa.G Al/GaAs increases dramatically at -12 GPa due to the larger PDOS overlap.With decompressing to ambient,lattice defects including grain size reduction,arsenic vacancies,and partial amorphization reduce κ GaAs to a glass-like value.Remarkably,the released G Al/GaAs is 2.6 times higher than that of the initial.Thus our findings open a new dimension in synergistically realizing glass-like κ and enhancing G,which can facilitate thermoelectric performance and its potential engineering applications.

三结砷化镓太阳能电池外延层表面抛光技术研究

以空间用三结砷化镓(GaAs)电池外延表面抛光为研究对象,对抛光压力、抛光转速、抛光液pH等参数进行试验研究。研究结果表明:选用抛光压力40 g/cm^(3),采用55 r/min的转速,有效氯含量为5%的抛光液,对三结砷化镓太阳能电池外延表面有良好的抛光效果,可得到良好的表面颗粒度,即表面粗糙度小于0.4 nm、颗粒粒径大于0.2μm(含0.2/μm)的数量低于50个,颗粒粒径小于0.2μm的数量低于100个的外延片表面,为键合技术用于三结砷化镓太阳能电池的批量生产提供了可能。

触发区域宽度对砷化镓光导开关输出特性影响

基于TCAD数值仿真软件,建立了异面结构砷化镓光导开关(GaAs PCSS)的二维数值计算模型,研究了触发区域宽度对GaAs PCSS输出特性影响。首先分析了PCSS的瞬态导通特性,结果表明,急剧增加的载流子浓度与快速演化的空间电离畴使PCSS工作在超快速导通模式。基于此,研究了触发区域宽度对PCSS输出特性影响,结果表明,宽度变大会促进载流子密度急剧倍增和雪崩电离畴的快速演化,缩短PCSS的延迟时间和导通时间。研究分析了不同触发位置对延迟时间与导通时间影响,结果表明,阴极触发的延迟时间明显低于阳极触发,而导通时间受触发位置的影响不显著。

基于GaAs IPD的小型化高选择性X波段宽带带通滤波器

文中设计并实际开发了一种基于砷化镓(Gallium Arsenide,GaAs)集成无源器件(Integrated Passive Device,IPD)技术的小型化高选择性宽带带通滤波器。首先,所提出的带通滤波器是通过引入集总参数谐振器来设计的,以实现高选择性和宽带性能。其次,进一步研究了实现高选择性和宽带性能的工作原理。最后,为了证明所述性能,基于GaAs-IPD技术设计、制造和测量了一个紧凑型高选择性宽带带通滤波器。该滤波器工作频率覆盖了整个X波段(6~13 GHz),相对带宽为74.0%,带外实现了四个传输零点,从而实现了高选择性和良好的带外性能,芯片尺寸为0.05λ_(0)×0.03λ_(0)。比较了实测结果与电磁仿真结果,验证了该设计的可行性。

激光辅助水射流加工砷化镓晶片微槽的实验研究

对干激光、低压水射流辅助激光和激光辅助水射流技术加工砷化镓晶片微槽进行了对比实验,结果表明,激光辅助水射流技术适合加工砷化镓材料,它能够加工出晶片表面无污染、大深度、小热影响区宽度、大深宽比的高质量微槽,加工表面微观形貌均匀、微裂纹少,优于其他两种加工方式。实验研究了激光辅助水射流加工砷化镓晶片微槽的切割性能,结果表明,加工参数(激光脉冲能量、水射流压力、加工速度、水射流倾斜角度、焦平面位置和加工次数)对微槽深度、微槽宽度和材料去除率具有显著影响。微槽深度、微槽宽度和材料去除率随着激光脉冲能量的增大而增大,随着水射流压力的增大而减小,材料去除率随着加工速度的增大而显著增大。

高截止频率肖特基二极管仿真模型研究

基于表面沟道型平面肖特基势垒二极管基本结构,采用GaAs 0.15μm伪高电子迁移率晶体管(pseudomorphic high electron mobility transistors,pHEMT)工艺制程,提出了一种垂直沟道长跨度空气桥的肖特基二极管模型.研究了不同阳极直径对肖特基二极管级联电阻的影响,对比分析了不同焊盘间距下肖特基二极管模型的S参数仿真结果,得到最优空气桥长度;仿真了最优焊盘间距下二极管肖特基结的TCAD模型,根据仿真得到的特性曲线提取肖特基二极管的SPICE参数.经实验测试,该二极管具有极低的零偏置结电容,截止频率高达9 THz,仿真结果与实测结果吻合度较高,可用于太赫兹频段上.

红外LED用GaAs单晶的垂直梯度凝固制备研究

GaAs单晶是当前光电子器件的主要衬底材料之一,在红外LED中有着重要应用。但杂质浓度高、迁移率低等缺点会严重影响红外LED器件性能。为生产出低杂质浓度、高迁移率、载流子分布均匀、高利用率的红外LED用掺硅垂直梯度凝固(VGF)法GaAs单晶,本文研究了热场分布、合成舟和炉膛材质、工艺参数对单晶的成晶质量、杂质浓度、迁移率、载流子分布的影响。利用CGSim软件对单晶生长热场系统进行数值模拟研究,温区一至温区六长度比例为8∶12∶9∶5∶5∶7时,恒温区达到最长,位错密度达到1 000 cm^(-2)以下,成晶率达到85%。采用打毛石英合成舟进行GaAs合成,用莫来石炉膛替代石英炉膛,可以获得迁移率整体高于3 000 cm^(2)/(V·s)的GaAs单晶,满足红外LED使用要求。对单晶生长工艺参数展开研究,采用提高头部生长速度、降低尾部生长速度的方式提高单晶轴向载流子浓度均匀性,头尾部载流子浓度差降低33%,尾部迁移率从2 900 cm^(2)/(V·s)提高到3 560 cm^(2)/(V·s)。单晶有效利用长度提高33%,单晶利用率达到75%,大幅降低了原料损耗成本。