A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of compo...A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.展开更多
Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ...Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ways to improve SMT solder joint reliability.In this paper. based on the theorem of minimum potential energy, an energy model of 3 - D solder joint shape is established,and the forma- tion of solder joint is numerically simulated by Surface Ecolver program. On the basis of the prediction of SMT solder joint shape,the mechanical model of analyzing solder joint reliability is established. An elasto - plasto - creep mateial model and its mechanical constitutive equaton are established for SnPb solder alloy, and the stress/strain response of SMT solder joint under thermal cyclical loabing is ana- lyzed with nonlinear 3 - D FEM. The fatigue life of solder joint is predicted according to Coffin- Manson fatigue life model. An integrated system for Predicting and analyzing SMT solder joint shape and reliability(PSAR) is developed.The system can analyze efficiently SMT solder joint reliability with the variation of structural parameters in the joint and give the optimal structure.展开更多
A visual software system has been developed for predicting and analyzing the shape of solder joints in surface mount technology (SMT). The formation of the solder joint is numerically simulated through Surface Evolver...A visual software system has been developed for predicting and analyzing the shape of solder joints in surface mount technology (SMT). The formation of the solder joint is numerically simulated through Surface Evolver program and the calculation is automated with an additional controller. A preprocessor is developed in which process parameters determining the shape of solder joints can be input visually and transferred into Evolver program automatically. A postprocessor is built to analyze the global three dimensional shape and cross section profiles of solder fillets in multiple windows. Also, the application for predicting the solder joint shape of RC chip component is conducted with the PSJS system.展开更多
文摘A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward.
文摘Solder joint reliability is one of critical problems detemining whether Sirface Mount Technology (SMT) can be used in the prohotion of important electronic products. Optimizing solder joint shape is one of effective ways to improve SMT solder joint reliability.In this paper. based on the theorem of minimum potential energy, an energy model of 3 - D solder joint shape is established,and the forma- tion of solder joint is numerically simulated by Surface Ecolver program. On the basis of the prediction of SMT solder joint shape,the mechanical model of analyzing solder joint reliability is established. An elasto - plasto - creep mateial model and its mechanical constitutive equaton are established for SnPb solder alloy, and the stress/strain response of SMT solder joint under thermal cyclical loabing is ana- lyzed with nonlinear 3 - D FEM. The fatigue life of solder joint is predicted according to Coffin- Manson fatigue life model. An integrated system for Predicting and analyzing SMT solder joint shape and reliability(PSAR) is developed.The system can analyze efficiently SMT solder joint reliability with the variation of structural parameters in the joint and give the optimal structure.
文摘A visual software system has been developed for predicting and analyzing the shape of solder joints in surface mount technology (SMT). The formation of the solder joint is numerically simulated through Surface Evolver program and the calculation is automated with an additional controller. A preprocessor is developed in which process parameters determining the shape of solder joints can be input visually and transferred into Evolver program automatically. A postprocessor is built to analyze the global three dimensional shape and cross section profiles of solder fillets in multiple windows. Also, the application for predicting the solder joint shape of RC chip component is conducted with the PSJS system.
