Thermal rectification induced by Wenzel–Cassie wetting state transition on nano-structured solid–liquid interfaces

Thermal rectification refers to the phenomenon by which the magnitude of the heat flux in one direction is much larger than that in the opposite direction.In this study,we propose to implement the thermal rectification phenomenon in an asymmetric solid–liquid–solid sandwiched system with a nano-structured interface.By using the non-equilibrium molecular dynamics simulations,the thermal transport through the solid–liquid–solid system is examined,and the thermal rectification phenomenon can be observed.It is revealed that the thermal rectification effect can be attributed to the significant difference in the interfacial thermal resistance between Cassie and Wenzel states when reversing the temperature bias.In addition,effects of the liquid density,solid–liquid bonding strength and nanostructure size on the thermal rectification are examined.The findings may provide a new way for designs of certain thermal devices.

Evolution of bonding interface in solid-liquid cast-rolling bonding of Cu/Al clad strip

Cu/Al clad strips are prepared using solid?liquid cast-rolling bonding(SLCRB)technique with a d160mm×150mm twin-roll experimental caster.The extent of interfacial reactions,composition of the reaction products,and their micro-morphology evolution in the SLCRB process are investigated with scanning electron microscope(SEM),energy dispersive spectrometer(EDS),and X-ray diffraction(XRD).In the casting pool,initial aluminized coating is first generated on the copper strip surface,with the diffusion layer mainly consisting ofα(Al)+CuAl2and growing at high temperatures,with the maximum thickness of10μm.After sequent rolling below the kiss point,the diffusion layer is broken by severe elongation,which leads to an additional crack bond process with a fresh interface of virgin base metal.The average thickness is reduced from10to5μm.The reaction products,CuAl2,CuAl,and Cu9Al4,are dispersed along the rolling direction.Peeling and bending test results indicate that the fracture occurs in the aluminum substrate,and the morphology is a dimple pattern.No crack or separation is found at the bonding interface after90°-180°bending.The presented method provides an economical way to fabricate Cu/Al clad strip directly.

Microstructure and Solid/Liquid Interface Evolutions of Directionally Solidified Fe-Al-Ta Eutectic Alloy

A modified Bridgman directional solidification technique was used to prepare Fe-Al-Ta eutectic in situ composites at different growth rates ranging from 6 to 80 μm/s. The directionally solidified FeAl-Ta eutectic composites are composed of two phases: Fe（Al,Ta） matrix phase, and Fe2 Ta（Al） Laves phase. Solidification microstructure is affected by solidification rate. Microstructure of the Fe-Al-Ta eutectic alloy grown at 6.0 μm/s is broken-lamellar eutectic. Eutectic colonies are formed with the increase of the solidification rate. Microstructures are mainly composed of the lamellar or fibrous eutectic at the center of the colony and coarse lamellar eutectic zone at the boundary. Meanwhile, the inter-lamellar spacing（or the inter-rod spacing） is decreased. The spacing adjustments are also observed in Fe-Al-Ta eutectic alloy. The solid/liquid interface evolves from planar interface to shallow cellular interface, then to deep cellular, and finally to shallow cellular planar with the increase of the solidification rate.

An APXPS endstation for gas–solid and liquid–solid interface studies at SSRF

In the past few decades, various surface analysis techniques find wide applications in studies of interfacial phenomena ranging from fundamental surface science,catalysis, environmental science and energy materials.With the help of bright synchrotron sources, many of these techniques have been further advanced into novel in-situ/operando tools at synchrotron user facilities, providing molecular level understanding of chemical/electrochemical processes in-situ at gas–solid and liquid–solid interfaces.Designing a proper endstation for a dedicated beamline is one of the challenges in utilizing these techniques efficiently for a variety of user's requests. Many factors,including pressure differential, geometry and energy of the photon source, sample and analyzer, need to be optimized for the system of interest. In this paper, we discuss the design and performance of a new endstation at beamline02 B at the Shanghai Synchrotron Radiation Facility for ambient pressure X-ray photoelectron spectroscopy studies.This system, equipped with the newly developed hightransmission HiPP-3 analyzer, is demonstrated to be capable of efficiently collecting photoelectrons up to 1500 eV from ultrahigh vacuum to ambient pressure of 20 mbar.The spectromicroscopy mode of HiPP-3 analyzer also enables detection of photoelectron spatial distribution with resolution of 2.8 ± 0.3 lm in one dimension. In addition,the designing strategies of systems that allow investigations in phenomena at gas–solid interface and liquid–solid interface will be highlighted through our discussion.

Understanding fundamentals of electrochemical reactions with tender X-rays:A new lab-based operando X-ray photoelectron spectroscopy method for probing liquid/solid and gas/solid interfaces across a variety of electrochemical systems

Electrocatalysis is key to improving energy efficiency,reducing carbon emissions,and providing a sustainable way of meeting global energy needs.Therefore,elucidating electrochemical reaction mechanisms at the electrolyte/electrode interfaces is essential for developing advanced renewable energy technologies.However,the direct probing of real-time interfacial changes,i.e.,the surface intermediates,chemical environment,and electronic structure,under operating conditions is challenging and necessitates the use of in situ methods.Herein,we present a new lab-based instrument commissioned to perform in situ chemical analysis at liquid/solid interfaces using ambient pressure X-ray photoelectron spectroscopy(APXPS).This setup takes advantage of a chromium source of tender X-rays and is designed to study liquid/solid interfaces by the“dip and pull”method.Each of the main components was carefully described,and the results of performance tests are presented.Using a three-electrode setup,the system can probe the intermediate species and potential shifts across the liquid electrolyte/solid electrode interface.In addition,we demonstrate how this system allows the study of interfacial changes at gas/solid interfaces using a case study:a sodium–oxygen model battery.However,the use of APXPS in electrochemical studies is still in the early stages,so we summarize the current challenges and some developmental frontiers.Despite the challenges,we expect that joint efforts to improve instruments and the electrochemical setup will enable us to obtain a better understanding of the composition–reactivity relationship at electrochemical interfaces under realistic reaction conditions.

Mathematical Modelling of Particle Movement Ahead of the Solid-liquid Interface in Continuous Casting

Whether the particle will be trapped by the solid-liquid interface or not is dependent on its moving behavior ahead of the interface, so a mathematical model has been developed to investigate the movement of the particle ahead of the solid-liquid interface. Based on the theory for the boundary layer, the fluid velocity field near the solid-liquid interface was obtained, and the trajectories of particles were calculated by the equations of motion for particles. In this model, the drag force, the added mass force, the buoyance force, the gravitational force, the Saffman force and the Basset history force are considered. The results show that the behavior of the particle ahead of the solid-liquid interface is affected by the physical property of the particle and fluid flow. And in the continuous casting process, if it moves in the stream directed upward or downward near vertical solid-liquid interface or in the horizontal flow under the solid-liquid interface, the particle with the diameter from 5 um to 60um can reach the solid-liquid interface. But if it moves in horizontal flow above the solid-liquid interface, only the particle with the diameter from 5 um to 10 um can reach the solid-liquid interface.

Effect of current density on distribution coefficient of solute at solid-liquid interface

When current passes through the solid-liquid interface, the growth rate of crystal, solid-liquid interface energy and radius of curvature at dendritic tip will change. Based on this fact, the theoretical relation between the distribution of solute at solid-liquid interface and current density was established, and the effect of current on the distribution coefficient of solute through effecting the rate of crystal growth, the solid-liquid interface energy and the radius of curvature at the dendritic tip was discussed. The results show that as the current density increases, the distribution coefficient of solute tends to rise in a whole, and when the former is larger than about 400 A/cm 2, the latter varies significantly.

Fractal Description of the Solid/Liquid Interface of a Directionally Solidified Superalloy with Different Phosphorus Content

The solid/liquid interface of a directionally solidified Ni-base superalloy with different phosphorus contents was quantitatively described by means of fractat method.When the solidification rate was fixed,the relationship between the fractal dimensionality of the solid/liquid interface and the phos- phorus content of the test alloy was given.Combined the thermodynamics and fractal theory,the ef- fect mechanism of phosphorus content on fractal dimensionality of the solid/liquid interface was discussed.

Atomic-level characterization of liquid/solid interface

The detailed understanding of various underlying processes at liquid/solid interfaces requires the development of interface-sensitive and high-resolution experimental techniques with atomic precision.In this perspective,we review the recent advances in studying the liquid/solid interfaces at atomic level by electrochemical scanning tunneling microscope(EC-STM),non-contact atomic force microscopy(NC-AFM),and surface-sensitive vibrational spectroscopies.Different from the ultrahigh vacuum and cryogenic experiments,these techniques are all operated in situ under ambient condition,making the measurements close to the native state of the liquid/solid interface.In the end,we present some perspectives on emerging techniques,which can defeat the limitation of existing imaging and spectroscopic methods in the characterization of liquid/solid interfaces.

Apparent Active Adsorption Force at a Solid-Liquid Interface with Active Adsorption

The paper presents a new relationship between the three surface tensions on the solid-liquid-vapor interface, γ_(sl)-γ_(sv)+γ_(lv)cosθ=βin order to understand the wetting on the liquid-solid interface in the case of active adsorption.The authors suggest a new force“apparent active adsorption force”βto take part in the balance at the three interface lines of contact in the solid-liquid-vapor phases,its dimen- sion isβ=Σα_iRT(Γ_i^(sl)-Γ_i^(sv)+Γ_i^(lv)cosθ),and its direction is dependent on the sign of β,whenβis a positive, the direction is agree with surface tension of the sol- id-vapor interface γ and vice versa.

Influence of Ni interlayer on interfacial microstructure and mechanical properties of Ti-6Al-4V/AZ91D bimetals fabricated by a solid–liquid compound casting process

The solid–liquid compound casting of Mg-AZ91D and Ti-TC4 alloys was developed by using pure Ni electro-deposited coating.The pouring temperatures of 660℃,690℃,720℃and 750℃were chosen to investigated the effects of casting temperatures on microstructural evolution,properties,and fracture behaviors of Ni-coated TC4/AZ91D bimetals by the solid–liquid compound casting(SLCC).The scanning electron microscopy(SEM)and the energy dispersive spectroscopy(EDS)results showed that the interfacial zone mainly composed of nickel,Mg_(2)Ni and Mg-Al-Ni in the bimetals cast at 660℃.As the pouring temperature was increased to 750℃,the width of the interface zone,which mainly composed ofδ(Mg),Mg_(2)Ni,Mg-Al-Ni,Mg_(3)TiNi_(2) and Al_(3)Ni,gradually increased.The microhardness tests showed that the micro-hardness of the interface zone was smaller than that of TC4 substrate but larger than that of the cast AZ91D matrix.At the pouring temperature of 720℃,the Ni-coated TC4/AZ91D bimetals had the most typical homogeneous interface,which had granular Mg-Al-Ni ternary phase but no ribbon-like Al3Ni binary phase,and achieved the highest shear strength of 97.35MPa.Meanwhile,further fracture behavior analysis showed that most fracture failure of Ni-coated TC4/AZ91D bimetals occurred at the Mg_(2)Ni+δ(Mg)eutectic structure and Al_(3)Ni hard intermetallic.

Role of temperature gradient in liquid/solid phase solution-diffusion bonding

The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.

INTERACTION OF PARTICLES WITH A SOLIDIFIED INTERFACE DURING SOLIDIFICATION OF METAL MATRIX COMPOSITE REINFORCED WITH PARTICLES

The interaction of particles with a solid-liquid interface during solidification of metal matrix composites has been investigated theoretically in this paper.Owing to the presence of particles in the melt,the shape of the solidification front and solute concentration field in front of solidification interface have been disturbed The thermodynamic method was employed,and a mathematical expression of the shape of the solidification interface and solute concentration field were deduced.Meanwhile,a theory is developed for evaluation of critical velocities of particles pushed by the solidification interface.A numerical simulation is done in which the critical velocity is evaluated as a function of particle size,thermal conductivity,diffusion coefficient,temperature gradient at the solidification front,the solid-liquid interfacial energy and the melt viscosity.The critical velocity is shown to be closely linked to the shape of the solidification interface and solute concentration field, and hence all the parameters also affect the shape of the solidification interface and solute concentration field of the front.

Effects of Ca(Y)-Si modifier on interface morphology and solute segregation during directional solidification of an austenite medium Mn steel

The austenite medium Mn steel modified with controlled additions of Ca, Y, Si were directionally solidified using the vertical Bridgman method to study the effects of Ca（Y）-Si modifier on the solid-liquid （S-L） interface morphology and solute segregation. The interface morphology and the C and Mn segregation of the steel directionally solidified at 6.9 μtrn/s were investigated with an image analysis and a scanning electron microscope equipped with energy dispersive X-ray analysis. The 0.5wt% Ca-Si modified steel is solidified with a planar S-L interface. The interface of the 1.0wt% Ca-Si modified steel is similar to that of the 0.5wt% Ca-Si modified steel, but with larger nodes. The 1.5wt% Ca-Si modified steel displays a cellular growth parttern. The S-L interface morphology of the 0.5wt% Ca-Si＋1.0wt% Y-Si modified Mn steel appears as dendritic interface, and primary austenite dendrites reveal developed lateral branching at the quenched liquid. In the meantime, the independent austenite colonies are formed ahead of the S-L interface. A mechanism involving constitutional supercooling explains the S-L interface evolution. It depends mainly on the difference in the contents of Ca, Y, and Si ahead of the S-L interface. The segregation of C and Mn ahead of the S-L interface enhanced by the modifiers is observed.

The effect of interfacial energy anisotropy on planar interface instability in a succinonitrile alloy under a small temperature gradient

The morphological stability of a planar interface with different crystallographic orientations is studied under a small positive temperature gradient using a transparent model alloy of succinonitrile. Novel experimental apparatus is constructed to provide a temperature gradient of about 0.37 K/mm. Under this small temperature gradient, the planar interface instability depends largely on the crystallographic orientation. It is shown experimentally that the effect of interfacial energy anisotropy on planar interface stability cannot be neglected even in a small temperature gradient system. Higher interfacial energy anisotropy leads the planar interface to become more unstable, which is different from the stabilizing effect of the interfacial energy on the planar interface. The experimental results are in agreement with previous theoretical calculations and phase field simulations.

Experimental determination of interfacial energies for Ag_2Al solid solution in the CuAl_2-Ag_2Al system

The equilibrated grain boundary groove shapes of solid solution Ag2Al in equilibrium with an AI-Cu-Ag liquid were observed from a quenched sample with a radial heat flow apparatus. The Gibbs Thomson coefficient, solid liquid interfacial energy and grain boundary energy of the solid solution Ag2Al have been determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase and the thermal conductivity ratio of the liquid phase to solid phase for Ag2Al-28.3 at the %CuAl2 alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, separately.

20钢/316L复合管固液复合制坯工艺研究

双金属复合管在石油运输行业中应用前景广阔,结合性能是考察复合管是否合格的重要指标之一。为了能在轧制成形过程中得到高品质的复合管材,在复合管制坯过程中要求实现界面处的冶金复合。以20钢和316L为原材料,基于结合温度及元素扩散情况,采用固液复合方式,并且结合界面的温度模型及通过Pro CAST软件模拟,获得了外模最佳预热温度为1050—1100℃。通过现场试制界面处实现了冶金复合,在最佳温度范围既保证了固态20钢和液态316L之间能达到冶金复合,又能使元素有充分的扩散时间而增强了界面结合强度,同时又可以防止因元素过渡扩散而导致316L腐蚀性能下降。该方法为后续复合管连轧提供了优良的管坯,可实现高品质复合管的现场生产。

混合润滑状态下非高斯表面法向接触刚度研究

为了揭示混合润滑状态下表面形貌特征对接触特性的影响,针对微凸体高度非高斯分布粗糙表面在法向静载荷作用下的固-液接触问题展开研究。固-液接触结合面包括微凸体的固体接触和润滑介质的流体接触。对于固体接触部分,基于弹塑性固体力学对非高斯等效粗糙表面接触展开接触特性分析,建立了考虑微凸体弹塑性变形的非高斯粗糙表面法向接触刚度计算模型;对于流体接触部分,提出了一种考虑微凸体峰度/偏度分布影响的密闭油坑接触模型。通过仿真分析,揭示了法向压力、非高斯表面粗糙度参数及润滑油黏度系数对混合润滑固-液结合面法向接触刚度的影响规律,并对比分析了无润滑介质的固-固结合面和存在润滑介质时的固-液结合面法向接触刚度。研究表明:固-液和固-固结合面法向接触刚度均随着法向载荷的增大呈非线性增大,且固-液结合面相对固-固结合面的接触刚度略大;润滑介质黏度越大,接触刚度越大;非高斯分布的峰度和偏度对混合润滑结合面接触刚度具有显著影响,相对于零偏度分布的高斯分布表面,呈负偏度分布的非高斯表面通常具有较大的接触刚度;在轻载时,峰度对接触刚度的影响不容忽视。因此,通过改变接触表面峰度/偏度、增大法向载荷、提高润滑介质黏度,可有效改善混合润滑状态固-液结合面法向接触刚度。

固液界面热阻的温度依赖特性模拟研究

基于非平衡态分子动力学模拟方法,研究了系统温度及固液结合强度对固液界面传热的影响规律。模拟结果表明,固液界面热阻随着系统温度的升高而降低,并且亲水性界面的界面热阻温度依赖性较弱。基于微观热流密度计算式的分析表明,随着系统温度升高,动能项和维里项的贡献均逐渐增大,因而固液界面传热增强,但是动能项占比逐渐增大,维里项占比逐渐降低;随着固液结合强度逐渐增大,界面吸附效应增强,维里项贡献明显增大,这是较强的固液相互作用能够强化界面传热的主要原因。

Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies

The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronautics,and astronautics,and therefore has drawn increasing research interests.To design preferential microstructure and optimize mechanical properties of the interconnects,it is crucial to understand the formation and growth mechanisms of diversified structures at the L/S interface during interconnecting.In situ synchrotron radiation or tube-generated X-ray radiography and tomography technologies make it possible to observe the evolution of the L/S interface directly and therefore have greatly propelled the research in this field.Here,we review the recent progress in understanding the L/S interface behaviors using advanced in situ X-ray imaging techniques with a particular focus on the following two issues:(1)interface behaviors in the solder joints for microelectronic packaging including the intermetallic compounds(IMCs)during refl ow,Sn dendrites,and IMCs during solidification and refl ow porosities and(2)growth characteristics and morphological transition of IMCs in the interconnect of dissimilar metals at high temperature.Furthermore,the main achievements and future research perspectives in terms of metallurgical bonding mechanisms under complex conditions with improved X-ray sources and detectors are remarked and discussed.