Comparison of the interface reaction behaviors of CaO–V_(2)O_(5) and MnO_(2)–V_(2)O_(5) solid-state systems based on the diffusion couple method

The formation mechanism of calcium vanadate and manganese vanadate and the difference between calcium and manganese in the reaction with vanadium are basic issues in the calcification roasting and manganese roasting process with vanadium slag.In this work,CaO–V_(2)O_(5) and MnO_(2)–V_(2)O_(5) diffusion couples were prepared and roasted for different time periods to illustrate and compare the diffusion reaction mechanisms.Then,the changes in the diffusion product and diffusion coefficient were investigated and calculated based on scanning electron microscopy (SEM) with energy dispersive X-ray spectroscopy (EDS) analysis.Results show that with the extension of the roasting time,the diffusion reaction gradually proceeds among the CaO–V_(2)O_(5) and MnO_(2)–V_(2)O_(5) diffusion couples.The regional boundaries of calcium and vanadium are easily identifiable for the CaO–V_(2)O_(5) diffusion couple.Meanwhile,for the MnO_(2)–V_(2)O_(5) diffusion couple,MnO_(2) gradually decomposes to form Mn_(2)O_(3),and vanadium diffuses into the interior of Mn_(2)O_(3).Only a part of vanadium combines with manganese to form the diffusion production layer.CaV_(2)O_(6) and MnV_(2)O_(6) are the interfacial reaction products of the CaO–V_(2)O_(5) and MnO_(2)–V_(2)O_(5) diffusion couples,respectively,whose thicknesses are 39.85 and 32.13μm when roasted for 16 h.After 16 h,both diffusion couples reach the reaction equilibrium due to the limitation of diffusion.The diffusion coefficient of the CaO–V_(2)O_(5) diffusion couple is higher than that of the MnO_(2)–V_(2)O_(5) diffusion couple for the same roasting time,and the diffusion reaction between vanadium and calcium is easier than that between vanadium and manganese.

Bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy

The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount of voids decreases after increasing to the maximum value with the increasing bonding time. The irregular void with a scraggly edge tends to an ellipse void with smooth surface and then changes to a tiny void with round shape. The grains across bonding interface occur at bonding time of 60 min. The shear strength of bond increases with increasing bonding time, and the highest shear strength of bond is 887.4 MPa at 60 min. The contribution of plastic deformation on the void closure and the increase of shear strength is significant even though the action time of plastic deformation is short.

Construction of Dynamic Alloy Interfaces for Uniform Li Deposition in Li-Metal Batteries

It is well accepted that a lithiophilic interface can effectively regulate Li deposition behaviors,but the influence of the lithiophilic interface is gradually diminished upon continuous Li deposition that completely isolates Li from the lithiophilic metals.Herein,we perform in-depth studies on the creation of dynamic alloy interfaces upon Li deposition,arising from the exceptionally high diffusion coefficient of Hg in the amalgam solid solution.As a comparison,other metals such as Au,Ag,and Zn have typical diffusion coefficients of 10-20 orders of magnitude lower than that of Hg in the similar solid solution phases.This difference induces compact Li deposition pattern with an amalgam substrate even with a high areal capacity of 55 mAh cm^(-2).This finding provides new insight into the rational design of Li anode substrate for the stable cycling of Li metal batteries.

Interface Reaction of SiO_2/Ta and Its Influence on Cu Diffusion

Ta/NiFe film is deposited on Si substrate precoated with SiO_2 by magnetron sputtering.SiO_2/Ta interface and Ta_5Si_3 standard sample are investigated by using X-ray photoelectron spectroscopy (XPS) and peak decomposition technique.The results show that there is a thermodynamically favorable reaction at the SiO_2/Ta interface:37Ta+15SiO_2=5Ta_5Si_3+6Ta_2O_5.The more stable products Ta_5Si_3 and Ta_2O_5 may be beneficial to stop the diffusion of Cu into SiO_2.

A novel diffusion model considering curvature radius at the bonding interface in a titanium/steel explosive clad plate

This article introduces an element diffusion behavior model for a titanium/steel explosive clad plate characterized by a typical curved interface during the heat-treatment process. A series of heat-treatment experiments were conducted in the temperature range from 750℃ to 950℃, and the effects of heat-treatment parameters on the microstructural evolution and diffusion behavior were investigated by optical microscopy, scanning electron microscopy, X-ray diffraction analysis, and electron-probe microanalysis. Carbon atoms within the steel matrix were observed to diffuse toward the titanium matrix and to aggregate at the bonding interface at 850℃ or lower; in contrast, when the temperature exceeded 850℃, the mutual diffusion of Ti and Fe occurred, along with the diffusion of C atoms, resulting in the for- marion of Ti-Fe intermetallics （Fe2Ti/FeTi）. The diffusion distances of C, Ti, and Fe atoms increased with increasing heating temperature and/or holding time. On the basis of this diffusion behavior, a novel diffusion model was proposed. This model considers the effects of various factors, including the curvature radius of the curved interface, the diffusion coefficient, the heating temperature, and the holding rime. The experimental results show good agreement with the calculated values. The proposed model could clearly provide a general prediction of the elements＇ diffusion at both straight and curved interfaces.

Analysis of diffusion bond interface of TiAl base alloy with Ti, TC4 alloy and 40Cr steel

TiAl is diffusion bonded with Ti, TC4 Alloy and 40Cr Steel by heating in vacuum, and analysis of interfaces shows stratified Ti 3Al forms in TiAl/Ti interface closest to TiAl base, and the α phase and the α+β phase arise closest to Ti base at lower temperature and higher temperature respectively; Structure of TiAl/TC4 interface is TiAl/γ+α 2/Ti 3Al/α-Ti/TC4 at lower temperature and TiAl/γ+β+α 2/TC4 at high temperature; in TiAl/40Cr steel interface, obvious decarbonised layer on steel side while TiC and reaction phase with Fe Al Ti system form on TiAl side.

Interface structure and formation mechanism of diffusion-bonded joints of TiAl-based alloy to titanium alloy

Vacuum diffusion bonding of a TiAl based alloy (TAD) to a titanium alloy (TC2) was carried out at 1 273 K for 15～120 min under a pressure of 25 MPa . The kinds of the reaction products and the interface structures of the joints were investigated by SEM, EPMA and XRD. Based on this, a formation mechanism of the interface structure was elucidated. Experimental and analytical results show that two reaction layers have formed during the diffusion bonding of TAD to TC2. One is Al rich α(Ti)layer adjacent to TC2,and the other is (Ti 3Al+TiAl)layer adjacent to TAD,thus the interface structure of the TAD/TC2 joints is TAD/(Ti 3Al+TiAl)/α(Ti)/TC2.This interface structure forms according to a three stage mechanism,namely(a)the occurrence of a single phase α(Ti)layer;(b)the occurrence of a duplex phase(Ti 3Al+TiAl)layer;and(c)the growth of the α(Ti)and (Ti 3Al+TiAl)layers.

First principles study of the diffusional phenomena across the clean and Re-doped γ-Ni/γ'-Ni_3Al interface of Ni-based single crystal superalloy

Density functional theory calculations in conjunction with the climbing images nudged elastic band method are conducted to study the diffusion phenomena of the Ni-based single crystal superalloys.We focus our attention on the diffusion processes of the Ni and Al atoms in the γ and γ ’ phases along the direction perpendicular to the interface.The diffusion mechanisms and the expressions of the diffusion coefficients are presented.The vacancy formation energies,the migration energies,and the activation energies for the diffusing Ni and Al atoms are estimated,and these quantities display the expected and clear transition zones in the vicinity of the interface of about 3–7（002） layers.The local density-of-states profiles of atoms in each（002） layer in the γ and γ ’ phases and the partial density-of-states curves of Re and some of its nearest-neighbor atoms are also presented to explore the electronic effect of the diffusion behavior.

XRD and TEM Analysis in the Interface of Diffusion Bonding for Fe_3Al/Q235 Dissimilar Materials

Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test results indicatedthat obviously a diffusion transition zone forms near the interface of Fe3Al/Q235 under the condition of heatingtemperature 1050~1100℃, holding time 60 min and pressure 9.8 MPa, which indicated that the diffusion interfaceof Fe3Al/Q235 was combined well. The diffusion transition zone consisted of Fe3Al and a-Fe(Al) solid solution.Microhardness near the diffusion transition zone was HM 480~540. There was not brittle phase of high hardness inthe interface transition zone. This is favorable to enhance toughness of Fe3Al/Q235 diffusion joint.

On the perturbation solution of interface-reaction controlled diffusion in solids

Insertion of species A into species B forms a product P through two kinetic processes, namely, （1） the chemical reaction between A and B that occurs at the B-P interface, and （2） the diffusion of species A in product P. These two processes are symbiotic in that the chemical reaction provides the driving force for the diffusion, while the diffusion sustains the chemical reaction by providing sufficient reactant to the reactive interface. In this paper, a math- ematical framework is developed for the coupled reaction- diffusion processes. The resulting system of boundary and initial value problem is solved analytically for the case of interface-reaction controlled diffusion, i.e., the rate of diffu- sion is much faster than the rate of chemical reaction at the interface so that the final kinetics are limited by the interface chemical reaction. Asymptotic expressions are given for the velocity of the reactive interface and the concentration of diffusing species under two different boundary conditions.

Effects of temperature gradient on the interface microstructure and diffusion of diffusion couples:Phase-field simulation

The temporal interface microstructures and diffusions in the diffusion couples with the mutual interactions of the temperature gradient, concentration difference and initial aging time of the alloys are studied by phase-field simulation, and the diffusion couples are produced by the initial aged spinodal alloys with different compositions. Temporal composition evolution and volume fraction of the separated phase indicate the element diffusion direction through the interface under the temperature gradient. The increased temperature gradient induces a wide single-phase region on two sides of the interface.The uphill diffusion proceeds through the interface, no matter whether the diffusion direction is up or down with respect to the temperature gradient. For an alloy with short initial aging time, phase transformation accompanying the interdiffusion results in the straight interface with the single-phase regions on both sides. Compared with the temperature gradient,composition difference of diffusion couple and initial aging time of the alloy show greater effects on diffusion and interface microstructure.

Atomic diffusion across Ni_(50)Ti_(50)Cu explosive welding interface:Diffusion layer thickness and atomic concentration distribution

Molecular dynamics simulations are carried out to study atomic diffusion in the explosive welding process of NisoTis0-Cu （at.%）. By using a hybrid method which combines molecular dynamics simulation and classical diffusion the- ory, the thickness of the diffusion layer and the atomic concentration distribution across the welding interface are obtained. The results indicate that the concentration distribution curves at different times have a geometric similarity. According to the geometric similarity, the atomic concentration distribution at any time in explosive welding can be calculated. NisoTis0- Cu explosive welding and scanning electron microscope experiments are done to verify the results. The simulation results and the experimental results are in good agreement.

Interface structure and formation mechanism of vacuum-free vibration liquid phase diffusion-bonded joints of SiC_p/ZL101A composites

The vacuum-free vibration liquid phase(VLP) diffusion-bonding of SiC_p/ZL101A composites was investigated. The effects of vibration on the interface structure, the phase transformation and the tensile strength of bonded joints were examined. Experimental results show that the oxide film on the surface of the composites is a key factor affecting the tensile strength of boned joints. The distribution of the oxide layers at the interface changes from a continuous line to a discontinuous one during vibration. The tensile strength of the VLP diffusion-bonded joints increases with the vibration time, and is up to the maximum of 172MPa when the vibration time is 30s. The phase structure of the bond region changes from the Zn-Al-Cu hyper-eutectic (η+(β+η)+(β+η+ε)) phases to Al-rich Al-base solid solution (α-Al) with increasing the vibration time.

DIFFUSION REACTION IN THE INTERFACE OF TITANIUM／MILD STEEL COMPOSITE

The microstructure together with the formation and growth ofreaction phases in the interfacial diffusion zone of the explosive cladding TA2/A3 has been investigated by means of OM, SEM, AES and XRD techniques. When the specimen annealed at temperature under the βTi→αTi transformation, i. e. below 1173 K, only TiC forms along TA2 side of interface and hinders the interdiffusion of Fe and Ti atoms, thus Fe2Ti or FeTi is unable to occur. While heated up to the transformation temperature of βTi, e. g, over 1223 K, the parabolic growth of intermetallic compounds of Fe2Ti and FeTi with layer structure may form intergranularly and the formation of βTi or βTi+αTi structure at the Fe enriched side of TA2 and the martensitic transformation products at the Fedepleted side are observed owing to the diffusion of Fe. Furthermore, the growth of βTi transformation layer is revealed to follow the parabolic rule.

Diffusion Behaviour of Fe-Cu Interface of Copper Brazed Double-wall Steel Tubes

By means of electron probe(EPMA),scanning electron microscope(SEM),and optical microscope (QM),the diffusion behaviour on the Fe-Cu interface of copper brazed double-wall steel tubes and the microstructure of the diffusion layer have been investigated.There are three kinds of metallurgical bonds between copper plating layer and steel substrate: (1)the Cu diffusing into steel substrate along grain boundary of ferrite;(2)the Cu diffusion into grain bulk of ferrite: (3)the Fe diffusing into Cu layer.The copper brazed double-wall steel tubes are formed by the combination of the diffusions mentioned above and this is the reason for excellent mechanical and technological properties of the copper brazed double-wall steel tubes.

Atom Diffusion Behavior and Bonding Strength of Ag/Cu Composite Interface

The atom (Ag,Cu) diffusion behavior and the effect of technology on the interface of rolled Ag/Cu composite contact were investigated. The concentration of Ag and Cu atoms near the interface was determined with electron probe. The bonding strength of composite interface was tested and the fracture in tensile sample was observed by SEM. The results show that there was inter diffusion of Ag and Cu atoms on the interface, which formed compact layer with high bonding strength of 98 MPa. The practical application proved that the Ag/Cu composite interface is reliable.

Stress distribution at diffusion-bonded interface of Fe_3Al with Cr18-Ni8 steel

Fe3Al and Crl8-Ni8 steel were bonded in vacuum and an interface was formed between Fe3Al and Crl8-Ni8 steel. Stress distribution at the diffusion-bonded interface was researched by numerical simulation and finite element method （FEM）. The results indicated that the peak stress appeared at the interface near Cr18-Ni8 steel side. This is the key factor to induce crack at this position. With the enhancement of heating temperature, the peak stress at the bonded interface increases. When the temperature is 1 100 22, the peak stress is up to 65.9 MPa, which is bigger than that at 1 000 22 by 9. 4%. In addition, the peak stress becomes bigger with the increase of the thickness of base metal from 1 mm to 8 ram. While the thickness is more than 8 ram, the peak stress varies slightly with the change of the thickness.

Interdiffusion Flux and Interface Movement in Metallic Multilayers

Interdiffusion in the diffusion couples of metallic multilayers is investigated for the variation of mobility and different initial phase separation(IPS)states.A phase field simulation shows that the diffusion flux and interface movement increase for higher atomic mobility.The shorter IPS time influences the diffusion flux of two-phase diffusion couples,and has almost no influence on the interface movement.

Interface diffusion of sputtered CoZrNb films on silicon substrate

The amorphous CoZrNb films were deposited by DC magnetron sputtering.The depth distributions of the elements were analyzed by Rutherford backscattering spectrometry(RBS).The results indicate that when the deposition time is longer than 37 min,the film composition keeps constant along the depth.When the deposition time is longer than 45 min,the Co concentration at the interface of the silicon substrate is higher than the average value in the whole film.When the deposition time is longer than 52 min,the Co atoms diffuse into the substrate during the deposition.According to the Co composition profile in the substrate,which were determined from the RBS spectra,the Co diffusion coefficients in the substrate were calculated using the solution of Fick′s second law corresponding to an infinite source with a constant diffusion coefficient.The calculated diffusion coefficients indicate an interstitial assisted diffusion mechanism.

Study of Ni/Al Interface Diffusion by Molecular Dynamics Simulation

Molecular dynamics simulation of Ni/Al interface diffusion is carried out by Embedded Atom Method (EAM) potential. The problem how the temperature affects Ni/Al interface diffusion is discussed. The initial dynamic behavior of Ni/Al interface diffusion at high temperature is shown. The study in this letter is helpful to understand the origin of diffusion phenomenon.