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Analysis of Wettability and X-ray Photoelectron Spectroscopy of Wheat Straw/SPI
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作者 刘志明 沈江华 《Agricultural Science & Technology》 CAS 2012年第4期815-817,共3页
[Objective] The aim was to improve the adhesive bonding property of wheat straw surface to prepare wheat straw particleboard of soy protein isolate (SPI) adhesive through chemical and enzyme treatments. [Method] Eva... [Objective] The aim was to improve the adhesive bonding property of wheat straw surface to prepare wheat straw particleboard of soy protein isolate (SPI) adhesive through chemical and enzyme treatments. [Method] Evaluation and analysis were made on wettability of wheat straws in the control group and treated groups (chemical and enzyme treatments) by means of measurement of contact angle and calculation of spreading-penetration parameters (K). In addition, we made analysis on surface elements through X-ray photoelectron spectroscopy (XPS). [Result] The re- sults showed that K value of straw treated with sodium hydroxide, hydrogen peroxide and lipase increased by 58.0%, 48.7% and 83.2% compared to that of control group, respectively. The XPS analysis indicated that rapid decrease of silicon content and destruction of wax layer greatly contributed to wettability improvement of wheat straw surface. [Conclusion] The chemical and lipase treatments of wheat straw provided technical support for manufacture of wheat straw particle boand. 展开更多
关键词 Wheat straw WETTABILITY soy protein isolate adhesive X-ray photoelec- tron spectroscopy
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