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Effects of sputtering power and annealing temperature on surface roughness of gold films for high-reflectivity synchrotron radiation mirrors 被引量:3
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作者 Jia-Qi Chen Qiu-Shi Huang +5 位作者 Run-Ze Qi Yu-Fei Feng Jiang-Tao Feng Zhong Zhang Wen-Bin Li Zhan-Shan Wang 《Nuclear Science and Techniques》 SCIE CAS CSCD 2019年第7期36-41,共6页
Gold films deposited by direct current magnetron sputtering are used for synchrotron radiation optics. In this study, the microstructure and surface roughness of gold films were investigated for the purpose of develop... Gold films deposited by direct current magnetron sputtering are used for synchrotron radiation optics. In this study, the microstructure and surface roughness of gold films were investigated for the purpose of developing high-reflectivity mirrors. The deposition process was first optimized. Films were fabricated at different sputtering powers (15, 40, 80, and 120 W) and characterized using grazing incidence X-ray reflectometry, X-ray diffraction, and atomic force microscopy. The results showed that all the films were highly textured, having a dominant Au (111) orientation, and the film deposited at 80 W had the lowest surface roughness. Subsequently, post-deposition annealing from 100 to 200℃ in a vacuum was performed on the films deposited at 80 W to investigate the effect of annealing on the microstructure and surface roughness of the films. The grain size, surface roughness, and their relationship were investigated as a function of annealing temperature. AFM and XRD results revealed that at annealing temperatures of 175 ℃ and below, microstructural change of the films was mainly manifested by the elimination of voids. At annealing temperatures higher than 175℃, grain coalescence occurred in addition to the void elimination, causing the surface roughness to increase. 展开更多
关键词 Gold films sputterING power ANNEALING Microstructure ROUGHNESS
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Influence of Microwave Power on the Properties of Hydrogenated Diamond-Like Carbon Films Prepared by ECR Plasma Enhanced DC Magnetron Sputtering 被引量:2
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作者 汝丽丽 黄建军 +1 位作者 高亮 齐冰 《Plasma Science and Technology》 SCIE EI CAS CSCD 2010年第5期551-555,共5页
Electron cyclotron resonance (ECR) plasma was applied to enhance the direct current magnetron sputtering to prepare hydrogenated diamond-like carbon (H-DLC) films. For different microwave powers, both argon and hy... Electron cyclotron resonance (ECR) plasma was applied to enhance the direct current magnetron sputtering to prepare hydrogenated diamond-like carbon (H-DLC) films. For different microwave powers, both argon and hydrogen gas are introduced separately as the ECR working gas to investigate the influence of microwave power on the microstructure and electrical property of the H-DLC films deposited on P-type silicon substrates. A series of characterization methods including the Raman spectrum and atomic force microscopy are used. Results show that, within a certain range, the increase in microwave power affects the properties of the thin films, namely the sp3 ratio, the hardness, the nanoparticle size and the resistivity all increase while the roughness decreases with the increase in microwave power. The maximum of resistivity amounts to 1.1×10^9 Ω.cm. At the same time it is found that the influence of microwave power on the properties of H-DLC films is more pronounced when argon gas is applied as the ECR working gas, compared to hydrogen gas. 展开更多
关键词 hydrogenated diamond-like carbon films ECR plasma magnetron sputtering microwave power
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THE EFFECTS OF SPUTTERING POWER ON STRUCTURE AND ELECTRICAL PROPERTIES OF Cu FILMS
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作者 F.P. Wang. P. Wu, L.Q. Pan, Y. Tian and H. Qiu Department of Physics, School of Applied Sciences, University of Science and Technology Beijing, Beijing 100083, China Beijing Keda-Tianyu Microelectronic Material Technology Development Co. Ltd., Beijing 100 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2002年第2期215-220,共6页
Cu films with thickness of about 500nm were deposited on glass substrateswithout heating by DC magnetron sputtering in pure Ar gas of 1.0Pa. The sputtering powers weremaintained at 390V X 0.27A, 430V X 0.70A and 450V ... Cu films with thickness of about 500nm were deposited on glass substrateswithout heating by DC magnetron sputtering in pure Ar gas of 1.0Pa. The sputtering powers weremaintained at 390V X 0.27A, 430V X 0.70A and 450V X l.04A, and the corresponding deposition rates ofCu film reached 35nm/min, l04nm/min and 167nm/min. X-ray diffraction, scanning electron microscopyand atomic force microscopy were used to observe the structural characteristics of the films. Theresistance of the films was measured using four-point probe technique. The amount of larger grainsincreases and the resistivity of the films decreases evidently with an increase in sputtering power.It is considered that the increase in deposition rate with sputtering power mainly weakens theinfluence of residual gas atoms on the growing film, and increases substrate and gas temperatures,resulting in the increase in grain size and the decrease in resistivity of the Cu film. 展开更多
关键词 Cu film DC magnetron sputtering sputtering power STRUCTURE RESISTIVITY
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Synthesis and properties of Cr-Al-Si-N films deposited by hybrid coating system with high power impulse magnetron sputtering (HIPIMS) and DC pulse sputtering 被引量:12
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作者 Min Su KANG Tie-gang WANG +2 位作者 Jung Ho SHIN Roman NOWAK Kwang Ho KIM 《中国有色金属学会会刊:英文版》 CSCD 2012年第S3期729-734,共6页
The CrN and Cr-Al-Si-N films were deposited on Si wafer and SUS 304 substrates by a hybrid coating system with high power impulse magnetron sputtering (HIPIMS) and a DC pulse sputtering using Cr and AlSi targets under... The CrN and Cr-Al-Si-N films were deposited on Si wafer and SUS 304 substrates by a hybrid coating system with high power impulse magnetron sputtering (HIPIMS) and a DC pulse sputtering using Cr and AlSi targets under N2/Ar atmosphere.By varying the sputtering current of the AlSi target in the range of 0-2.5 A,both the Al and Si contents in the films increased gradually from 0 to 19.1% and 11.1% (mole fraction),respectively.The influences of the AlSi cathode DC pulse current on the microstructure,phase constituents,mechanical properties,and oxidation behaviors of the Cr-Al-Si-N films were investigated systematically.The results indicate that the as-deposited Cr-Al-Si-N films possess the typical nanocomposite structure,namely the face centered cubic (Cr,Al)N nano-crystallites are embedded in the amorphous Si3N4 matrix.With increasing the Al and Si contents,the hardness of the film first increases from 20.8 GPa for the CrN film to the peak value of 29.4 GPa for the Cr0.23Al0.14Si0.07 N film,and then decreases gradually.In the meanwhile,the Cr0.23Al0.14Si0.07N film also possesses excellent high-temperature oxidation resistance that is much better than that of the CrN film at 900 or 1000 °C. 展开更多
关键词 Cr-Al-Si-N film high power IMPULSE MAGNETRON sputterING DC pulsed sputterING high-temperature oxidation resistance
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Origin of Initial Current Peak in High Power Impulse Magnetron Sputtering and Verification by Non-Sputtering Discharge
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作者 吴忠振 肖舒 +4 位作者 崔岁寒 傅劲裕 田修波 朱剑豪 潘锋 《Chinese Physics Letters》 SCIE CAS CSCD 2016年第7期110-112,共3页
A non-sputtering discharge is utilized to verify the effect of replacement of gas ions by metallic ions and consequent decrease in the secondary electron emission coefficient in the discharge current curves in high-po... A non-sputtering discharge is utilized to verify the effect of replacement of gas ions by metallic ions and consequent decrease in the secondary electron emission coefficient in the discharge current curves in high-power impulse magnetron sputtering (HiPIMS). In the non-sputtering discharge involving hydrogen, replacement of ions is avoided while the rarefaction still contributes. The initial peak and ensuing decay disappear and all the discharge current curves show a similar feature as the HiPIMS discharge of materials with low sputtering yields such as carbon. The results demonstrate the key effect of ion replacement during sputtering. 展开更多
关键词 of in Origin of Initial Current Peak in High power Impulse Magnetron sputtering and Verification by Non-sputtering Discharge is by
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Microstructure and Oxidation Resistance of V Thin Films Deposited by Magnetron Sputtering at Room Temperature 被引量:2
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作者 ZHANG Song ZHANG Ziyu +5 位作者 LI Jun TU Rong SHEN Qiang WANG Chuanbin LUO Guoqiang ZHANG Lianmeng 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2020年第5期879-884,共6页
Vanadium films were deposited on Si(100)substrates at room temperature by direct current(DC)magnetron sputtering.The microstructure and surface morphology were studied using scanning electron microscopy(SEM)and atomic... Vanadium films were deposited on Si(100)substrates at room temperature by direct current(DC)magnetron sputtering.The microstructure and surface morphology were studied using scanning electron microscopy(SEM)and atomic force microscope(AFM).The oxidation resistance of films in air was studied using X-ray photoelectron spectroscopy(XPS)and transmission electron microscopy(TEM).The results showed that the amorphous vanadium film with a flatter surface had higher oxidation resistance than the crystalline film when exposed to atmosphere.The rapid formation of the thin oxide layer of amorphous vanadium film could protect the film from sustained oxidation,and the relative reasons were discussed. 展开更多
关键词 vanadium films magnetron sputtering sputtering power(Ps) MICROSTRUCTURE oxidation resistance
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A comparison of transmittance properties between ZnO∶Al films for transparent conductors for solar cells deposited by sputtering of AZO and cosputtering of AZO/ZnO 被引量:8
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作者 LEE Chongmu YIM Keunbin +1 位作者 CHO Youngjoon Lee J.G. 《Rare Metals》 SCIE EI CAS CSCD 2006年第z1期105-109,共5页
Aluminum-doped zinc oxide (AZO) thin films were deposited on sapphire (002) and glass substrates by two different sputtering techniques radio frequency magnetron cosputtering of AZO and ZnO targets and sputtering of a... Aluminum-doped zinc oxide (AZO) thin films were deposited on sapphire (002) and glass substrates by two different sputtering techniques radio frequency magnetron cosputtering of AZO and ZnO targets and sputtering of an AZO target. The dependence of the photoluminescence (PL) and transmittance properties of the AZO films deposited by cosputtering and sputtering on the AZO/ZnO target power ratio, R and the O2/Ar flow ratio, r were investigated, respectively. Only a deep level emission peak appears in the PL spectra of cosputtered AZO films whereas both UV emission and deep level emission peaks are observed in the PL spectra of sputtered AZO films. The absorption edges in the transmittance spectra of the AZO films shift to the lower wavelength region as R and r increase. Effects of crystallinity, surface roughness, PL on the transmittance of the AZO films were also explained using the X-ray diffraction (XRD), atomic force microscopy (AFM), and PL analysis results. 展开更多
关键词 Al-doped ZnO (AZO) R.F. magnetron sputtering R.F. power transparent conducting oxide (TCO) TRANSMITTANCE
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氧化锌锡薄膜晶体管的制备与性能研究 被引量:1
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作者 初学峰 胡小军 +2 位作者 张祺 黄林茂 谢意含 《液晶与显示》 CSCD 北大核心 2024年第1期40-47,共8页
为了提高薄膜晶体管的性能,本文基于射频磁控溅射技术,采用氧化锌锡(ZTO)材料作为沟道层,在SiO2/p-Si衬底上制备高性能ZTO薄膜晶体管。采用AFM、XRD、UV-Vis研究了溅射功率对ZTO薄膜的表面形貌和光学性能的影响。使用半导体参数仪对ZTO... 为了提高薄膜晶体管的性能,本文基于射频磁控溅射技术,采用氧化锌锡(ZTO)材料作为沟道层,在SiO2/p-Si衬底上制备高性能ZTO薄膜晶体管。采用AFM、XRD、UV-Vis研究了溅射功率对ZTO薄膜的表面形貌和光学性能的影响。使用半导体参数仪对ZTO薄膜晶体管进行电学性能的测试,利用XPS分析研究溅射功率对ZTO薄膜中元素组成和价态的影响,探索高性能薄膜晶体管的原理机制。实验结果表明,所有ZTO薄膜样品是非晶结构,表面致密,透光率均大于90%。适当增加溅射功率能够改善ZTO薄膜晶体管的电学性能。在90 W溅射功率下制备的薄膜晶体管综合性能较好,其饱和迁移率达到了15.61 cm^(2)/(V·s),亚阈值摆幅为0.30 V/decade,阈值电压为-5.06 V,电流开关比为8.92×10^(9)。 展开更多
关键词 薄膜晶体管 溅射功率 XPS分析 ZTO薄膜
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不同溅射技术制备MoN涂层的结构、力学和摩擦学性能研究
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作者 金玉花 张亨中 +5 位作者 王鹏 赵晓宇 柴利强 马鹏军 于童童 张贝贝 《表面技术》 EI CAS CSCD 北大核心 2024年第21期121-132,共12页
目的沉积条件对MoN涂层的微观结构、力学性能及摩擦学性能的影响至关重要,溅射技术决定了涂层的沉积条件,研究不同溅射技术对MoN涂层的结构及性能的影响。方法采用射频、脉冲和中频反应磁控溅射技术在单晶硅片和W18Cr4V高速钢上制备MoN... 目的沉积条件对MoN涂层的微观结构、力学性能及摩擦学性能的影响至关重要,溅射技术决定了涂层的沉积条件,研究不同溅射技术对MoN涂层的结构及性能的影响。方法采用射频、脉冲和中频反应磁控溅射技术在单晶硅片和W18Cr4V高速钢上制备MoN涂层,利用X射线衍射、能谱仪、场发射扫描电镜、划痕仪、纳米压痕仪和高温摩擦磨损试验机等探究不同溅射技术制备的MoN涂层在显微结构、力学性能和摩擦学性能等方面的差异。结果采用射频电源制备的MoN涂层以六方相δ-MoN为主,采用中频直流电源和脉冲直流电源制备的MoN涂层以面心立方相γ-Mo_(2)N为主。随着氮气流量的增加,采用射频电源制备的MoN涂层的硬度先增加后减小,最大硬度为22 GPa,采用中频直流电源和脉冲直流电源制备的MoN涂层的硬度逐渐减小。采用射频电源制备的MoN具有最高的膜基结合力,临界载荷(FLc_(2))达到20 N以上,采用其他2种电源制备的MoN涂层的膜基结合力较低。在室温下,采用不同电源制备的MoN涂层的摩擦因数均较大。在300℃时,在磨痕内检测到β-MoO_(3),脆性氧化层容易磨损,导致摩擦因数增加。随着温度的升高,涂层表面发生氧化,生成了大量具有润滑作用的α-MoO_(3),摩擦因数逐渐下降。结论溅射技术对MoN涂层的微观结构和力学性能有着重要影响,采用射频电源制备的MoN涂层呈现出最优的力学性能和摩擦学性能。 展开更多
关键词 MoN涂层 溅射电源 微观结构 力学性能 高温摩擦学
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Characteristics of GaN Thin Films Using Magnetron Sputtering System
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作者 Hasina F. Huq Rocio Y. Garza Roman Garcia-Perez 《Journal of Modern Physics》 2016年第15期2028-2037,共10页
The paper presents a polycrystalline GaN thin film with a hexagonal wurtzite structure under the optimized sputtering conditions of 40 W RF power, 5 mT working pressure, using pure nitrogen gas with a substrate temper... The paper presents a polycrystalline GaN thin film with a hexagonal wurtzite structure under the optimized sputtering conditions of 40 W RF power, 5 mT working pressure, using pure nitrogen gas with a substrate temperature of 700&deg;C. The study examines the effects of surface disorders and incorporates it in the thin films characteristics. A radio frequency (RF) Ultra High Vacuum (UHV) Magnetron Sputtering System has been used for the deposition of Gallium Nitride (GaN) on silicon, sapphire and glass substrates with different parameters. The power is varied from 40 W to 50 W, and the pressure from 4 mT to 15 mT. The effects of the RF sputtering powers and gas pressures on the structural properties are investigated experimentally. Sputtering at a lower RF power of 15 W does increase the N atomic percentage, however the deposition rate is substantially slower and the films are amorphous. GaN deposited on both silicon and sapphire wafer resulted in thin films close to stoichiometric once the N2 concentration is 60% or higher. It is also observed that the substrate cooling/heating effects improve the quality of the thin films with fewer defects present at the surface of the GaN epi-structure. 展开更多
关键词 GAN UHV Magnetron sputtering RF power HEMT Thin Film Characterization
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溅射功率对磁控溅射钽铬合金薄膜的影响
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作者 刘姣阳 张伟强 +3 位作者 张武 柳泉 金浩 郭策安 《辽宁化工》 CAS 2024年第8期1160-1163,共4页
利用双靶磁控溅射技术,通过固定铬靶的直流功率,改变钽靶的射频功率,在CrNi3MoVA钢表面制备钽铬合金薄膜,探究溅射功率对钽铬合金薄膜的性能影响。利用扫描电镜/能谱仪和X射线衍射仪分析不同功率(80~120 W)条件下钽铬合金薄膜的沉积速... 利用双靶磁控溅射技术,通过固定铬靶的直流功率,改变钽靶的射频功率,在CrNi3MoVA钢表面制备钽铬合金薄膜,探究溅射功率对钽铬合金薄膜的性能影响。利用扫描电镜/能谱仪和X射线衍射仪分析不同功率(80~120 W)条件下钽铬合金薄膜的沉积速率和物相组成,通过纳米压痕仪和电化学工作站测试薄膜的力学性能和耐腐蚀性能。结果表明,随着溅射功率增大,薄膜中钽元素含量增加,薄膜整体衍射峰强度增强。钽靶溅射功率为90 W时,薄膜拥有最高的硬度(16.45 GPa)、模量(238.4 GPa)和较佳的弹塑性。当钽靶功率为120 W时,薄膜的腐蚀电流为0.99μA·cm^(-2),耐蚀性最佳。 展开更多
关键词 磁控溅射 钽铬合金薄膜 溅射功率
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溅射功率对MoS_(2)涂层结构及其电催化性能影响
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作者 姚明镜 张珂嘉 +4 位作者 张虹 黄熠 唐国庆 但敏 金凡亚 《真空科学与技术学报》 CAS CSCD 北大核心 2024年第12期1084-1090,共7页
以二硫化钼(MoS_(2))为代表的非贵金属产氢电催化剂因较高的催化性能在析氢催化方面引起广泛关注。文章采用磁控溅射法在泡沫镍(NF)基底上制备了MoS_(2)催化涂层,研究了1000 W、1500 W、2000 W和3000 W不同溅射功率对MoS_(2)涂层微观结... 以二硫化钼(MoS_(2))为代表的非贵金属产氢电催化剂因较高的催化性能在析氢催化方面引起广泛关注。文章采用磁控溅射法在泡沫镍(NF)基底上制备了MoS_(2)催化涂层,研究了1000 W、1500 W、2000 W和3000 W不同溅射功率对MoS_(2)涂层微观结构、组织形貌以及电化学起始过电位的影响。结果表明:溅射功率的改变会影响溅射离子能量从而影响MoS_(2)涂层的结构形貌、相结构及电化学性能。不同溅射功率下MoS_(2)涂层都呈现为蠕虫状生长且出现1T相成分,随着功率的升高表面形貌呈现沿(100)晶面择优取向,在1500 W时(100)衍射峰最强,涂层蠕虫状结构出现了很多细小的分支,涂层边缘暴露接触点位最多。通过电化学性能测试结果显示随着溅射功率的增大,MoS_(2)涂层的电化学起始过电位先减小后增大,在1500 W溅射功率下过电位最小,在10 mA/cm^(2)电流密度下其起始过电位值为148.5 mV。 展开更多
关键词 溅射功率 二硫化钼涂层 结构形貌 电催化性能
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溅射功率对直流磁控溅射TiAlN涂层组织和摩擦学性能的影响
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作者 孙琛扬 王疆瑛 +1 位作者 张高会 徐欣 《机械工程材料》 CAS CSCD 北大核心 2024年第5期116-122,共7页
在室温下采用直流磁控溅射技术在304L不锈钢表面制备TiAlN涂层,研究了溅射功率(80,100,120,140,160 W)对TiAlN涂层组织和摩擦学性能的影响。结果表明:TiAlN涂层由面心立方结构的TiAlN相以及少量TiN和AlN相组成。随着溅射功率的增加,TiAl... 在室温下采用直流磁控溅射技术在304L不锈钢表面制备TiAlN涂层,研究了溅射功率(80,100,120,140,160 W)对TiAlN涂层组织和摩擦学性能的影响。结果表明:TiAlN涂层由面心立方结构的TiAlN相以及少量TiN和AlN相组成。随着溅射功率的增加,TiAlN涂层变厚,表面晶粒更加致密,但溅射功率160 W下制备的涂层表面大颗粒较多,晶粒尺寸先变小后变大,结合力先增大后减小,平均摩擦因数和比磨损率均整体呈先减小后增大的趋势;溅射功率140 W下制备的涂层具有最小的晶粒尺寸、最强的结合力、最小的平均摩擦因数和比磨损率,磨痕较平整且仅有少量磨屑,磨损机制为轻微的黏着磨损。 展开更多
关键词 TIALN涂层 直流磁控溅射 溅射功率 摩擦学性能
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磁控溅射法制备的硫化镉缓冲层的铜锌锡硫薄膜太阳电池性能
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作者 陈玉飞 廖华 +2 位作者 周志能 赵永刚 王书荣 《云南师范大学学报(自然科学版)》 2024年第2期18-21,共4页
利用磁控溅射法制备硫化镉薄膜,研究硫化镉薄膜作为缓冲层的铜锌锡硫薄膜太阳电池性能.进一步地,采用双功率溅射的方法,减轻溅射过程对吸收层的损伤,增加了铜锌锡硫薄膜太阳电池的开路电压和填充因子,提高了光电转换效率,最终获得了光... 利用磁控溅射法制备硫化镉薄膜,研究硫化镉薄膜作为缓冲层的铜锌锡硫薄膜太阳电池性能.进一步地,采用双功率溅射的方法,减轻溅射过程对吸收层的损伤,增加了铜锌锡硫薄膜太阳电池的开路电压和填充因子,提高了光电转换效率,最终获得了光电转换效率为7.0%的铜锌锡硫薄膜太阳电池. 展开更多
关键词 铜锌锡硫薄膜太阳电池 硫化镉缓冲层 磁控溅射法 双功率溅射
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射频磁控溅射制备CdS薄膜性质研究
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作者 王昊民 管雪 顾广瑞 《延边大学学报(自然科学版)》 CAS 2024年第2期31-38,共8页
利用射频磁控溅射技术,在玻璃和Si(111)的基板上沉积CdS薄膜,并研究了溅射功率对薄膜的结构、光学和电学特性等影响.X射线衍射结果表明,在不同溅射功率下制备的CdS薄膜样品,均表现为在(002)方向择优生长,其晶粒尺寸和表面粗糙度均随溅... 利用射频磁控溅射技术,在玻璃和Si(111)的基板上沉积CdS薄膜,并研究了溅射功率对薄膜的结构、光学和电学特性等影响.X射线衍射结果表明,在不同溅射功率下制备的CdS薄膜样品,均表现为在(002)方向择优生长,其晶粒尺寸和表面粗糙度均随溅射功率的增大而增大.透射光谱分析表明,CdS薄膜在近红外光区域具有较大的透射率.对Tauc曲线进行分析显示,薄膜的带隙随溅射功率的增大而减小.霍尔效应测试表明,薄膜的电阻率随着溅射功率的增加而降低,而载流子浓度则随着溅射功率的增加而增大.研究结果可为CdS薄膜在光电器件方面的应用提供参考. 展开更多
关键词 CDS薄膜 射频磁控溅射 溅射功率 光学性质 电学性质
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高功率脉冲磁控溅射技术制备ta-C膜及性能改性研究
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作者 冯利民 史敬伟 +2 位作者 何哲秋 李建中 石俊杰 《材料保护》 CAS CSCD 2024年第7期23-29,共7页
硬质合金表面沉积四面体非晶碳膜(ta-C薄膜)的结合力和摩擦性能影响着其在切削刀具和耐磨零部件领域的应用效果。基于高功率脉冲磁控溅射技术(HiPIMS)制备了ta-C薄膜,通过调节C2H2流量对ta-C薄膜进行了改性研究。利用SEM对薄膜厚度进行... 硬质合金表面沉积四面体非晶碳膜(ta-C薄膜)的结合力和摩擦性能影响着其在切削刀具和耐磨零部件领域的应用效果。基于高功率脉冲磁控溅射技术(HiPIMS)制备了ta-C薄膜,通过调节C2H2流量对ta-C薄膜进行了改性研究。利用SEM对薄膜厚度进行观察,通过拉曼和XPS对其结构进行研究,通过纳米压痕对其硬度进行表征,通过纳米划痕对薄膜的结合力进行研究并通过摩擦磨损试验对薄膜的耐磨性进行探究。结果表明,通入C2H2气体可有效改善ta-C薄膜的结构、硬度、结合力和耐磨性能。改变C2H2流量可调控ta-C薄膜的性能,随着C2H2流量的逐渐增大,薄膜的各项性能呈现先增大后减小的趋势,当C2H2流量为15 cm^(3)/min时,薄膜的各项性能都达到较为优异的结果,ta-C薄膜厚度达655.9 nm,硬度提高到43.633 GPa,结合力提升到19.2 N,此时sp3键含量为70.19%,ta-C薄膜表面均匀、致密,且性能优良。 展开更多
关键词 高功率脉冲磁控溅射 四面体非晶碳膜 C2H2 薄膜性能
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带有反向正脉冲的HiPIMS技术制备ta-C膜及性能研究
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作者 何哲秋 冯利民 +2 位作者 李建中 石俊杰 高宣雯 《表面技术》 EI CAS CSCD 北大核心 2024年第13期96-103,共8页
目的提高切削刀具和耐磨零件的表面硬度和摩擦性能,延长工具的使用寿命。方法基于高功率脉冲磁控溅射技术(HiPIMS),在每个脉冲周期尾部施加反向正脉冲,控制ta-C沉积过程,通过电镜测试、拉曼测试、XPS测试、纳米压痕硬度测试、摩擦磨损... 目的提高切削刀具和耐磨零件的表面硬度和摩擦性能,延长工具的使用寿命。方法基于高功率脉冲磁控溅射技术(HiPIMS),在每个脉冲周期尾部施加反向正脉冲,控制ta-C沉积过程,通过电镜测试、拉曼测试、XPS测试、纳米压痕硬度测试、摩擦磨损实验分别分析脉冲频率、反向正脉冲能量对ta-C薄膜沉积速度、膜结构、硬度、结合强度、耐磨性能的影响。结果采用钨钢为基体进行实验,将频率从4000 Hz到1500 Hz依次降低,制备涂层。在频率为4000 Hz的处理条件下制备涂层时,ta-C膜层的厚度为479.2 nm,通过XPS可知,此时sp^(3)的原子数分数达到59.53%,硬度为32.65 GPa,且得到的薄膜在12.7 N时失效,耐磨性较差,摩擦因数约为0.163。在频率为1500 Hz的处理条件下制备涂层时,涂层各项性能均有所提升,ta-C膜层的厚度为488.6 nm,通过XPS可知,此时sp^(3)的原子数分数达到63.74%,硬度为40.485 GPa,且薄膜在14.9 N时失效,耐磨性较优,摩擦因数约为0.138。结论通过调节脉冲频率,可以有效提高ta-C薄膜的沉积效率,改善膜的结构和性能。随着沉积ta-C薄膜频率的降低,薄膜中sp^(3)的含量呈现增大趋势,摩擦因数也随之降低,有效改善了ta-C膜的耐磨性。 展开更多
关键词 高功率脉冲磁控溅射技术 类金刚石膜 脉冲频率 结合力 硬度 耐磨性
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掺硅类金刚石薄膜的HiPIMS-MFMS共沉积制备及其高温摩擦学行为研究
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作者 陈彦军 苏峰华 +3 位作者 孙建芳 陈泽达 林松盛 李助军 《摩擦学学报(中英文)》 EI CAS CSCD 北大核心 2024年第1期18-29,共12页
元素掺杂是提高类金刚石(DLC)薄膜高温耐摩擦性能的重要途径.本文中采用高功率脉冲磁控溅射(HiPIMS)和中频磁控溅射(MFMS)复合技术在304不锈钢表面沉积具有不同Si含量的掺硅类金刚石(Si-DLC)薄膜,利用原子力显微镜、扫描电子显微镜(SEM)... 元素掺杂是提高类金刚石(DLC)薄膜高温耐摩擦性能的重要途径.本文中采用高功率脉冲磁控溅射(HiPIMS)和中频磁控溅射(MFMS)复合技术在304不锈钢表面沉积具有不同Si含量的掺硅类金刚石(Si-DLC)薄膜,利用原子力显微镜、扫描电子显微镜(SEM)、X射线衍射(XRD)、拉曼光谱(Raman)、纳米压痕和UMT-TriboLab摩擦试验机等系统分析了Si含量对Si-DLC薄膜的结构、力学性能及不同温度下的摩擦学性能的影响,重点探讨了Si-DLC薄膜在高温下摩擦磨损机制.结果表明:Si-DLC薄膜中Si以四面体碳化硅的形式随机分布于无定型DLC基体中,增强薄膜的韧性.同时,Si掺杂使DLC薄膜向金刚石结构发生转变并显著提高了薄膜的硬度.摩擦结果表明,当Si原子分数为15.38%时,Si-DLC薄膜在常温下的摩擦系数和磨损率最低,同时该薄膜在300℃下能维持在较低的摩擦系数(约0.1),主要是由于Si-DLC薄膜中的四面体碳化硅结构能够提升sp^(3)键的稳定性.此外,Si-DLC薄膜中的Si在高温摩擦时会在对偶球表面形成1层SiO_(2)保护层,减缓Si-DLC薄膜和过渡层的氧化,使得薄膜能够在高温下持续润滑.当Si含量进一步增加时,Si-DLC薄膜的力学性能显著提升,然而其摩擦学性能发生明显降低,主要是当DLC薄膜中的硅含量过高时,大气环境下的高温摩擦使得薄膜内的氧化加剧,过量氧化硅的生成破坏了薄膜结构从而导致摩擦性能下降. 展开更多
关键词 高功率脉冲磁控溅射 类金刚石薄膜 元素掺杂 高温 摩擦磨损
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铝薄膜的制备及其性能研究
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作者 杨正华 符姣姣 姚世鹏 《科技创新与应用》 2024年第27期90-92,96,共4页
采用直流磁控溅射法沉积铝薄膜,利用扫描电子显微镜(SEM)、四探针电阻测试仪和红外发射率测试仪对其形貌和性能进行表征,研究溅射功率(70、90、110、130 W)对铝薄膜的沉积速率、表面形貌、电学性能和红外发射率的影响规律。结果表明,随... 采用直流磁控溅射法沉积铝薄膜,利用扫描电子显微镜(SEM)、四探针电阻测试仪和红外发射率测试仪对其形貌和性能进行表征,研究溅射功率(70、90、110、130 W)对铝薄膜的沉积速率、表面形貌、电学性能和红外发射率的影响规律。结果表明,随溅射功率的增大,铝薄膜的沉积速率逐渐增大,表面晶粒尺寸逐渐增大;铝薄膜的电阻率先降低后升高,其红外发射率呈现相同趋势。当溅射功率为110 W时,铝薄膜的红外发射率最低(<0.12)。 展开更多
关键词 磁控溅射 铝薄膜 溅射功率 红外发射率 电学性能
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磁控溅射沉积ZnS薄膜及其性能研究
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作者 戴永喜 郑天亮 +2 位作者 王娇 赵凯 李乾 《红外》 CAS 2024年第12期40-44,共5页
采用磁控溅射技术在硅衬底上制备ZnS薄膜,探究了溅射功率对ZnS薄膜沉积速率、表面粗糙度和表面形貌的影响。采用台阶仪、原子力显微镜(Atomic Force Microscope,AFM)、扫描电子显微镜(Scanning Electron Microscope,SEM)、椭偏仪等表征... 采用磁控溅射技术在硅衬底上制备ZnS薄膜,探究了溅射功率对ZnS薄膜沉积速率、表面粗糙度和表面形貌的影响。采用台阶仪、原子力显微镜(Atomic Force Microscope,AFM)、扫描电子显微镜(Scanning Electron Microscope,SEM)、椭偏仪等表征薄膜的表面形貌、微观结构和光学性能。结果表明,ZnS薄膜的沉积速率与溅射功率有关,随溅射功率的增加而线性增加;表面粗糙度与溅射功率相关,随溅射功率的增大呈现先增大后减小的趋势。在微观结构方面,薄膜晶粒尺寸也呈现先变大后减小的趋势。随着溅射功率的增大,ZnS膜层的折射率先减小后增大。因此,溅射功率对膜层生长具有重要的作用。 展开更多
关键词 磁控溅射 ZNS薄膜 沉积速率 溅射功率 微观结构
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