This paper proposes an oxide filled extended trench gate super junction （SJ） MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, ne...This paper proposes an oxide filled extended trench gate super junction （SJ） MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, new structure has the smaller input and output capacitances, and the remarkable improvements in the breakdown voltage, on-resistance and switching speed. Furthermore, the SJ in the new structure can be realized by the existing trench etching and shallow angle implantation, which offers more freedom to SJ MOSFET device design and fabrication.展开更多
超结MOSFET具有优越的静态直流特性。在已有成功设计600 V超结VDMOS经验的基础上,提出了相应的工艺方法。利用TCAD仿真软件,对主要的工艺参数和器件电学参数进行仿真优化,得到击穿电压为929 V、比导通电阻为23.67 m Ω·cm2的超结VD...超结MOSFET具有优越的静态直流特性。在已有成功设计600 V超结VDMOS经验的基础上,提出了相应的工艺方法。利用TCAD仿真软件,对主要的工艺参数和器件电学参数进行仿真优化,得到击穿电压为929 V、比导通电阻为23.67 m Ω·cm2的超结VDMOS。展开更多
Power semiconductor devices are the key technology driver for all power electronic system engineering.The main development trend for power devices is going towards higher power handling capability at even smaller Sivo...Power semiconductor devices are the key technology driver for all power electronic system engineering.The main development trend for power devices is going towards higher power handling capability at even smaller Sivolume, faster switching performance,advanced ruggedness and reliability at elevated operating temperature and extended SOA diagrams.To cover all applications in the various fields of industry,consumer,computing and automotive the device optimization is different for low voltage power MOSFET,for high voltage MOSFET,for plasma modulated devices and components based on wide bandgap(WB) material.In the paper,the main development trends will be described and discussed.展开更多
A novel buffer super-junction （S J） lateral double-diffused MOSFET （LDMOS） with an N-type buried layer （NB） is proposed. An N- buffer layer is implemented under the SJ region and an N-type layer is buried in the...A novel buffer super-junction （S J） lateral double-diffused MOSFET （LDMOS） with an N-type buried layer （NB） is proposed. An N- buffer layer is implemented under the SJ region and an N-type layer is buried in the P substrate. Firstly, the new electric field peak introduced by the p-n junction of the P substrate and the N-type buried layer modulates the surface electric field distribution. Secondly, the N-buffer layer suppresses the substrate assisted depletion effect. Both of them improve the breakdown voltage （BV）. Finally, because of the shallow depth of the SJ region, the NB buffer SJ-LDMOS is compatible with Bi-CMOS technology. Simulation results indicate that the average value of the surface lateral electric field strength of the NB buffer SJ-LDMOS reaches 23 V/μm at 15/μm drift length which results in a BV of 350 V and a specific on-resistance of 21 mΩ·cm2.展开更多
基金supported by the Doctor Scientific Research Start-up Foundation of Xi'an University of Technology of China
文摘This paper proposes an oxide filled extended trench gate super junction （SJ） MOSFET structure to meet the need of higher frequency power switches application. Compared with the conventional trench gate SJ MOSFET, new structure has the smaller input and output capacitances, and the remarkable improvements in the breakdown voltage, on-resistance and switching speed. Furthermore, the SJ in the new structure can be realized by the existing trench etching and shallow angle implantation, which offers more freedom to SJ MOSFET device design and fabrication.
文摘Power semiconductor devices are the key technology driver for all power electronic system engineering.The main development trend for power devices is going towards higher power handling capability at even smaller Sivolume, faster switching performance,advanced ruggedness and reliability at elevated operating temperature and extended SOA diagrams.To cover all applications in the various fields of industry,consumer,computing and automotive the device optimization is different for low voltage power MOSFET,for high voltage MOSFET,for plasma modulated devices and components based on wide bandgap(WB) material.In the paper,the main development trends will be described and discussed.
基金supported by the National Science and Technology Major Project of the Ministry of Science and Technology of China(No.2010ZX02201)the National Natural Science Foundation of China(No.61176069)the National Defense Pre-Research of China(No.51308020304)
文摘A novel buffer super-junction （S J） lateral double-diffused MOSFET （LDMOS） with an N-type buried layer （NB） is proposed. An N- buffer layer is implemented under the SJ region and an N-type layer is buried in the P substrate. Firstly, the new electric field peak introduced by the p-n junction of the P substrate and the N-type buried layer modulates the surface electric field distribution. Secondly, the N-buffer layer suppresses the substrate assisted depletion effect. Both of them improve the breakdown voltage （BV）. Finally, because of the shallow depth of the SJ region, the NB buffer SJ-LDMOS is compatible with Bi-CMOS technology. Simulation results indicate that the average value of the surface lateral electric field strength of the NB buffer SJ-LDMOS reaches 23 V/μm at 15/μm drift length which results in a BV of 350 V and a specific on-resistance of 21 mΩ·cm2.
