The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wh...The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wheels respectively,are analyzed.In addition,considering the effects of grain size and grinding depth on surface grinding temperature during these two grinding processes,significant results and conclusions are obtained from experimental research.展开更多
（TiCp＋ TiBw）/Ti-6Al-4V titanium matrix composites（PTMCs） have broad application prospects in the aviation and nuclear field. However, it is a typical difficult-to-cut material due to high hardness of the reinforc...（TiCp＋ TiBw）/Ti-6Al-4V titanium matrix composites（PTMCs） have broad application prospects in the aviation and nuclear field. However, it is a typical difficult-to-cut material due to high hardness of the reinforcements, high strength and low thermal conductivity of Ti-6Al-4V alloy matrix. Grinding experiments with vitrified CBN wheels were conducted to analyze comparatively the grinding performance of PTMCs and Ti-6Al-4V alloy. Grinding force and force ratios, specific grinding energy, grinding temperature, surface roughness, ground surface appearance were discussed. The results show that the normal grinding force and the force ratios of PTMCs are much larger than that of Ti-6Al-4V alloy. Low depth of cut and high workpiece speed are generally beneficial to achieve the precision ground surface for PTMCs. The hard reinforcements of PTMCs are mainly removed in the ductile mode during grinding. However, the removal phenomenon of the reinforcements due to brittle fracture still exists, which contributes to the lower specific grinding energy and grinding temperature of PTMCs than Ti-6Al-4V alloy.展开更多
基金Supported by the Open L ab.Foundation of Educational Ministryof China
文摘The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.Rudimentally,the properties of the surface grinding temperature generated by two grinding methods,ground by straight and cup wheels respectively,are analyzed.In addition,considering the effects of grain size and grinding depth on surface grinding temperature during these two grinding processes,significant results and conclusions are obtained from experimental research.
基金co-supported by the National Natural Science Foundation of China (Nos. 51235004, 51375235)the Fundamental Research Funds for the Central Universities (No. NE2014103) of ChinaPriority Academic Program Development of Jiangsu Higher Education Institutions (PAPD) of China
文摘（TiCp＋ TiBw）/Ti-6Al-4V titanium matrix composites（PTMCs） have broad application prospects in the aviation and nuclear field. However, it is a typical difficult-to-cut material due to high hardness of the reinforcements, high strength and low thermal conductivity of Ti-6Al-4V alloy matrix. Grinding experiments with vitrified CBN wheels were conducted to analyze comparatively the grinding performance of PTMCs and Ti-6Al-4V alloy. Grinding force and force ratios, specific grinding energy, grinding temperature, surface roughness, ground surface appearance were discussed. The results show that the normal grinding force and the force ratios of PTMCs are much larger than that of Ti-6Al-4V alloy. Low depth of cut and high workpiece speed are generally beneficial to achieve the precision ground surface for PTMCs. The hard reinforcements of PTMCs are mainly removed in the ductile mode during grinding. However, the removal phenomenon of the reinforcements due to brittle fracture still exists, which contributes to the lower specific grinding energy and grinding temperature of PTMCs than Ti-6Al-4V alloy.
