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Analysis of Light Load Efficiency Characteristics of a Dual Active Bridge Converter Using Wide Band-Gap Devices
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作者 Bongwoo Kwak 《Energy and Power Engineering》 2023年第10期340-352,共13页
In this paper, the zero voltage switching (ZVS) region of a dual active bridge (DAB) converter with wide band-gap (WBG) power semiconductor device is analyzed. The ZVS region of a DAB converter varies depending on out... In this paper, the zero voltage switching (ZVS) region of a dual active bridge (DAB) converter with wide band-gap (WBG) power semiconductor device is analyzed. The ZVS region of a DAB converter varies depending on output power and voltage ratio. The DAB converters operate with hard switching at light loads, it is difficult to achieve high efficiency. Fortunately, WBG power semiconductor devices have excellent hard switching characteristics and can increase efficiency compared to silicon (Si) devices. In particular, WBG devices can achieve ZVS at low load currents due to their low parasitic output capacitance (C<sub>o,tr</sub>) characteristics. Therefore, in this paper, the ZVS operating resion is analyzed based on the characteristics of Si, silicon carbide (SiC) and gallium nitride (GaN). Power semiconductor devices. WBG devices with low C<sub>o,tr</sub> operate at ZVS at lower load currents compared to Si devices. To verify this, experiments are conducted and the results are analyzed using a 3 kW DAB converter. For Si devices, ZVS is achieved above 1.4 kW. For WBG devices, ZVS is achieved at 700 W. Due to the ZVS conditions depending on the switching device, the DAB converter using Si devices achieves a power conversion efficiency of 91% at 1.1 kW output. On the other hand, in the case of WBG devices, power conversion efficiency of more than 98% is achieved under 11 kW conditions. In conclusion, it is confirmed that the WBG device operates in ZVS at a lower load compared to the Si device, which is advantageous in increasing light load efficiency. 展开更多
关键词 Dual Active Bridge (DAB) Converter Zero Voltage Switching (ZVS) ZVS Region Wide band-gap Power semiconductor Parasitic Output Capacitance
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RF performance evaluation of p-type NiO-pocket based β-Ga_(2)O_(3)/ black phosphorous heterostructure MOSFET
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作者 Narendra Yadava Shivangi Mani R.K.Chauhan 《Journal of Semiconductors》 EI CAS CSCD 2020年第12期101-106,共6页
The radio-frequency (RF) performance of the p-type NiO-pocket based β-Ga_(2)O_(3)/black phosphorous heterostructureMOSFET has been evaluated. The key figure of merits (FOMs) for device performance evaluation include ... The radio-frequency (RF) performance of the p-type NiO-pocket based β-Ga_(2)O_(3)/black phosphorous heterostructureMOSFET has been evaluated. The key figure of merits (FOMs) for device performance evaluation include the transconductance(gm) gate dependent intrinsic-capacitances (Cgd and Cgs), cutoff frequency (fT), gain bandwidth (GBW) product and output-conductance(gd). Similarly, power-gain (Gp), power added efficiency (PAE), and output power (POUT) are also investigated for largesignalcontinuous-wave (CW) RF performance evaluation. The motive behind the study is to improve the β-Ga_(2)O_(3) MOS deviceperformance along with a reduction in power losses and device associated leakages. To show the applicability of the designeddevice in RF applications, its RF FOMs are analyzed. With the outline characteristics of the ultrathin black phosphorous layer belowthe β-Ga_(2)O_(3) channel region, the proposed device results in 1.09 times improvement in fT, with 0.7 times lower Cgs, and 3.27dB improved GP in comparison to the NiO-GO MOSFET. The results indicate that the designed NiO-GO/BP MOSFET has betterRF performance with improved power gain and low leakages. 展开更多
关键词 wide band-gap semiconductor RF FOMs Ga_(2)O_(3) black phosphorus
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第三代半导体发展现状及未来展望
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作者 高爽 郑宇亭 张志国 《科技导报》 CAS CSCD 北大核心 2024年第8期29-38,共10页
在分析第三代半导体重要战略意义的基础上,讨论了中国在相关领域技术和产业化能力的发展状况,阐述了“大尺寸、降成本”是当前碳化硅及氮化镓技术的发展重心,并探讨了第三代半导体行业企业发展模式以及可能存在的问题及风险。尽管中国... 在分析第三代半导体重要战略意义的基础上,讨论了中国在相关领域技术和产业化能力的发展状况,阐述了“大尺寸、降成本”是当前碳化硅及氮化镓技术的发展重心,并探讨了第三代半导体行业企业发展模式以及可能存在的问题及风险。尽管中国已具备良好基础,但仍存在不足,建议在国家政策的指导下,以应用牵引实现发展,加大产线的持续支持力度,系统地丰富产品形态,促进第三代半导体产业高质量发展,把握未来应用新机遇。 展开更多
关键词 第三代半导体 碳化硅 氮化镓 5G通讯 企业模式
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