Single-event-effect propagation investigation on nanoscale system on chip by applying heavy-ion microbeam and event tree analysis

The propagation of single-event effects(SEEs)on a Xilinx Zynq-7000 system on chip(SoC)was inves-tigated using heavy-ion microbeam radiation.The irradia-tion results reveal several functional blocks’sensitivity locations and cross sections,for instance,the arithmetic logic unit,register,D-cache,and peripheral,while irradi-ating the on-chip memory(OCM)region.Moreover,event tree analysis was executed based on the obtained microbeam irradiation results.This study quantitatively assesses the probabilities of SEE propagation from the OCM to other blocks in the SoC.

Integration and verification case of IP-core based system on chip design

In this paper, the design and verification process of an automobile-engine-fan control system on chip （SoC） are introduced. The SoC system, SHU-MV08, reuses four new intellectual property （IP） cores and the design flow is accomplished with 0.35 btm chartered CMOS technology. Some special functions of IP cores, the detailed integration scheme of four IP cores, and the verification method of the entire SoC are presented. To settle the verification problems brought by analog IP cores, NanoSim based chip-level mixed-signal verification method is introduced. The verification time is greatly reduced and the first tape-out achieves success which proves the validity of our design.

Delay Optimized Architecture for On-Chip Communication

Networks-on-chip （NoC）, a new system on chip （SoC） paradigm, has become a great focus of research by many groups during the last few years. Among all the NoC architectures that have been proposed until now, 2D-Mesh has proved to be the best architecture for implementation due to its regular and simple interconnection structure. In this paper, we propose a new interconnect architecture called 2D-diagonal mesh （2DDgl-Mesh） for on-chip communication. The 2DDglMesh is almost similar to traditional 2D-Mesh in aspects of cost, area, and implementation, but it can outperform the later in delay. The both architectures are compared by using NS-2 （a network simulator） and CINS1M （a component based interconnection simulator） under the same traffic models and parametric conditions. The results of comparison show that under the proposed architecture, the packets can almost always be routed to their destinations in less time. In addition, our archi- tecture can sometimes perform better than 2D-Mesh in drop ratio for special fixed traffic models.

Tire Pressure Monitoring System Using SoC and Low Power Design

This paper presents the tire pressure monitoring system (TPMS) by using the system on chip (SoC) mixed signals with the help of Bluetooth transmission and in advantage of low power consumption design. This is to monitor the variations in temperature and pressure of the vehicle’s tire, and the TPMS system is involved. It improves the driver’s safety by automatically detecting the tire pressure and temperature and then warning signal is sent to driver to take a measure, which prevents from accident. The proposed system of tire pressure monitoring system using SoC increases the speed of indication time to the driver by using mixed signals. The inflation of the tire can be avoided by preventing from high temperature and high pressure. Limitation of temperature and pressure in the previous system is also elongated i.e. temperature from 40℃ to 125℃ and pressure from 0 to 750 Kpa. Sensors, wireless communication (Bluetooth dongle) and SoC unit are used to design the low power TPMS. Quantitative results are taken and the analogy between temperature and pressure is also verified. The tested results proved by need of the practical system. Signal conditioning voltage and SoC unit is the trace for low power design TPMS. Finally, the performance of the system is tested and executed by using proteus software given as a real time application.

Signal and Power Integrity Challenges for High Density System-on-Package

As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself,as the case for system-on-package(SoP),has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining,let alone improving,reliability and performance.The fundamental signal,power,and thermal integrity issues are discussed in detail,along with published techniques from around the industry to mitigate these issues in SoP applications.

Energy-Efficient Scheduling Based on Task Migration Policy Using DPM for Homogeneous MPSoCs

Increasing the life span and efficiency of Multiprocessor System on Chip(MPSoC)by reducing power and energy utilization has become a critical chip design challenge for multiprocessor systems.With the advancement of technology,the performance management of central processing unit(CPU)is changing.Power densities and thermal effects are quickly increasing in multi-core embedded technologies due to shrinking of chip size.When energy consumption reaches a threshold that creates a delay in complementary metal oxide semiconductor(CMOS)circuits and reduces the speed by 10%–15%because excessive on-chip temperature shortens the chip’s life cycle.In this paper,we address the scheduling&energy utilization problem by introducing and evaluating an optimal energy-aware earliest deadline first scheduling(EA-EDF)based technique formultiprocessor environments with task migration that enhances the performance and efficiency in multiprocessor systemon-chip while lowering energy and power consumption.The selection of core andmigration of tasks prevents the system from reaching itsmaximumenergy utilization while effectively using the dynamic power management(DPM)policy.Increase in the execution of tasks the temperature and utilization factor(u_(i))on-chip increases that dissipate more power.The proposed approach migrates such tasks to the core that produces less heat and consumes less power by distributing the load on other cores to lower the temperature and optimizes the duration of idle and sleep times across multiple CPUs.The performance of the EA-EDF algorithm was evaluated by an extensive set of experiments,where excellent results were reported when compared to other current techniques,the efficacy of the proposed methodology reduces the power and energy consumption by 4.3%–4.7%on a utilization of 6%,36%&46%at 520&624 MHz operating frequency when particularly in comparison to other energy-aware methods for MPSoCs.Tasks are running and accurately scheduled to make an energy-efficient processor by controlling and managing the thermal effects on-chip and optimizing the energy consumption of MPSoCs.

Implementation of advanced peripheral bus interface for MV10 MCU

MV10 is an MCU which consists of PWM, ADC,CAN and some other function blocks. It is designed for car body＇s control. Advanced peripheral bus （APB） is a low speed AMBA bus connecting low-power peripherals. This paper presents an implementation of APB interface for MV10 MCU. After that, MV10 can be integrated into any AMBA system on chips （SoCs） easily. We have built a multi-core system with ABMA to verify this design, In this system ARM9 is a main processor mounted on AHB and MV10 acts as a low-power and low-speed slaver on APB. Before building this system, some operations are encapsulated into a task with dedicated ID. MV10 works as a co-processor with ARM by acquiring task ID from ARM. The result of simulation indicates that MCU can work well as expected. Based on our design, MV10 can be mounted on any AMBA system from now on.

基于PLC的塑料挤出机远程监控系统设计

为了保证塑料挤出机稳定运行,提高企业生产效率,对生产设备进行远程监控,设计开发了基于可编程逻辑控制器(PLC)的塑料挤出机远程监控系统。该系统由数据采集模块与生产监控平台两部分构成。其中,数据采集模块主要以树莓派单片机为基础,从PLC中读取数据再发送到云服务器,生产监控平台可以远程对塑料挤出机的挤出量、电流、转速与机筒温度进行监控,记录设备保养信息,提供设备报警等功能。该塑料挤出机远程监控系统操作简单,实用性强,确保了挤出机的安全、稳定、高效运行。

An Optimal DPM Based Energy-Aware Task Scheduling for Performance Enhancement in Embedded MPSoC

Minimizing the energy consumption to increase the life span and performance of multiprocessor system on chip(MPSoC)has become an integral chip design issue for multiprocessor systems.The performance measurement of computational systems is changing with the advancement in technology.Due to shrinking and smaller chip size power densities onchip are increasing rapidly that increasing chip temperature in multi-core embedded technologies.The operating speed of the device decreases when power consumption reaches a threshold that causes a delay in complementary metal oxide semiconductor(CMOS)circuits because high on-chip temperature adversely affects the life span of the chip.In this paper an energy-aware dynamic power management technique based on energy aware earliest deadline first(EA-EDF)scheduling is proposed for improving the performance and reliability by reducing energy and power consumption in the system on chip(SOC).Dynamic power management(DPM)enables MPSOC to reduce power and energy consumption by adopting a suitable core configuration for task migration.Task migration avoids peak temperature values in the multicore system.High utilization factor(ui)on central processing unit(CPU)core consumes more energy and increases the temperature on-chip.Our technique switches the core bymigrating such task to a core that has less temperature and is in a low power state.The proposed EA-EDF scheduling technique migrates load on different cores to attain stability in temperature among multiple cores of the CPU and optimized the duration of the idle and sleep periods to enable the low-temperature core.The effectiveness of the EA-EDF approach reduces the utilization and energy consumption compared to other existing methods and works.The simulation results show the improvement in performance by optimizing 4.8%on u_(i) 9%,16%,23%and 25%at 520 MHz operating frequency as compared to other energy-aware techniques for MPSoCs when the least number of tasks is in running state and can schedule more tasks to make an energy-efficient processor by controlling and managing the energy consumption of MPSoC.

基于触觉感知的自行车后视系统

为了在自行车转向或变道时,实现无需左右回头观察即可了解后方路况,设计了一套便于骑行者感知车后具体情况的自行车后视系统.该系统可分为车尾探测装置与终端反应手套,主要由USB摄像头与执行模块构成,并采用了you only look once(YOLO)v4目标检测算法.通过在自行车车尾安装检测设备,与骑手的特制手套进行无线通信,从而传递车后方探测到的有关安全状况的紧急信息.实验结果表明:该系统能够对后方的行进车辆进行多目标检测及警告优先级目标,并在足够的安全距离内识别率较高.

浅论嵌入式系统

介绍了嵌入式系统的概念、构成和特点,以及它的发展过程和应用领域。

射击训练自动控制系统

介绍一种应用于实弹射击训练的自动控制系统 .该系统由 PC机主控机和若干分控机组成 ,并采用微机管理、单片机控制和无线通信 .可实现实弹射击训练中的示靶、检靶、报靶自动化 ,以及成绩实时记录显示和成绩的查询统计工作 .样机经实际使用表明 ,系统功能强、自动化程度高 ,能符合实弹射击训练的要求 .文中同时给出系统组成 。

自动抄表系统中几种传感器的应用

简要介绍了自动抄表系统的基本原理和采集部分的设计思路,着重介绍了光电传感器、霍尔传感器和零功耗磁敏传感器及其检测电路在自动抄表系统中的应用,并对它们的优缺点进行了比较。

微系统研究的思考和单芯片RF-MEMS研究进展

微光机电一体化系统简称微系统 ,是当今技术发展的前沿领域之一。微系统技术的发展将大大地促进许多产品或装置微型化、集成化和智能化 ,成倍地提高器件和系统的功能密度、信息密度与互连密度 ,大幅度地节能降耗 ,有广阔的应用领域和市场。文章阐述了微系统研究的意义以及微系统基础研究的重要性 ,概述了用于无线通信设备的MEMS器件的性能 ,指出了MEMS技术是最终实现单芯片机电一体化无线收发系统的根本途径之一 ,介绍了用于无线通信网络的单芯片机电一体化的微系统研究进展情况。

小型变流量电磁泵控制系统的设计与实现

主要介绍用MCS-51单片机控制小型变流量电磁泵,讲述其工作原理,同时介绍其硬件配置和软件设计。实验结果表明:通过调整电磁泵脉动电源的电压或频率都可以实现流量的无级调节。

单片机语音处理系统的研制

介绍了利用单片机处理语音的设计思路,语音处理系统硬件设计及软件实现,AT89C51单片机与ISD1420语音组合精灵板硬件的连接。

PIC单片机实现交通灯控制系统

介绍了应用 PIC单片机实现交通灯管制的控制系统 ,以及该系统软、硬件设计方法 ,实验证明系统实现简单、经济 ,具有较实用的价值。

智能喷灌系统的设计

通过农业与林业生产领域有关间歇性喷灌问题的控制需求分析,建立智能喷灌系统的数学模型,介绍了以AT89C51为核心的智能喷灌系统的硬件结构与软件的编程、"存储管理"的编程思想、应用前景.

基于单片机控制红外线遥控的编码实现

介绍一种用MCS51单片机和红外遥控技术实现近距离无线通信的软硬件系统。为了使受控设备识别信号,设计一种数字信号编码系统,利用红外线将数字信号调制,而数据的解码则通过单片机完成。系统的抗干扰性能好,实现简单。

基于CAN总线的分布式控制系统设计

介绍了一种基于CAN总线的分布式控制系统的设计方法。系统为多主站分布控制网络,分布式节点采用CAN控制器和嵌入式单片机技术,并对CAN2.0B协议进行裁减和优化,移植到MCU。最后介绍主要硬件电路设计和程序模块设计。该系统应用于自行研发的电子模块控制中,现场运行良好,具有很好的实用价值。