Vehicle-oriented ridesharing package delivery in blockchain system

Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may result in the single point of failure once the controller breaks down or is under attack.To tackle such problems,our goal in this paper is to develop a blockchain-based package delivery ridesharing system,where decentralization is adopted to remove intermediaries and direct transactions between the providers and the requestors are allowed.To complete the matching process under decentralized structure,an Event-Triggered Distributed Deep Reinforcement Learning(ETDDRL)algorithm is proposed to generate/update the real-time ridesharing orders for the new coming ridesharing requests from a local view.Simulation results reveal the vast potential of the ETDDRL matching algorithm under the blockchain framework for the promotion of the ridesharing profits.Finally,we develop an application for Android-based terminals to verify the ETDDRL matching algorithm.

Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment

Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits.

DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages

Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects.

Intervention package on stress management: Improving comprehensive well-being among nurses

Objective:The main objective of this study is to investigate the effectiveness of the stress management intervention package in improving stress-related burnout.Materials and Methods:An experimental study was done on 300 nurses selected by a nonprobability convenience sampling technique and a quasi-experimental one-group pre-and posttest research design was utilized.Modified expanded nurses stress scale and self-structured three-point Likert scale on the challenges that nurses may face following stressful life events utilized to collect information.The nurses signed up for six interactive sessions on various stress-coping methods by utilizing a variety of teaching strategies such as lecture cum discussion,video slides,group work,and direct interaction with the experts to explore stress-related issues.Results:Continuous stress affects both the body and the mind,causing psychosomatic symptoms.Data found that 2%to 10%of nurses frequently suffered with physical symptoms such as exhaustion,backache,acidity,headache,shoulder stiffness,and insomnia.Following the intervention,the number of nurses who had these symptoms frequently and sometimes decreased.Previously,10%of nurses experienced emotional symptoms frequently;however,after intervention,this figure was reduced to<2%.The greatest proportion of nurses(18%)reported frequently worrying,while 1.3%expressed frequent worrying after intervention.Maximum(5%)of nurses had a tendency to eat too little or too much;this has been reduced to 0.3%after the intervention.The intervention package on stress management significantly improved nurses’Conclusion:An intervention package for stress management was helpful in lowering physical,emotional,psychological,and behavioral stress-related symptoms among nurses.

34 GHz Bandpass Filter for Low-temperature Co-fired Ceramic System-in-Package Application

Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.

Research and Development of Multimedia Teaching Management System Based on SIP ＆ P2P

Multimedia teaching managemem system based on SIP ＆ P2P is proposed on account of the existing deficiency on video teaching of distance education. The designed P2P-SIP system applies SIP protocol to realize the underlying DHT, which guarantees zero-configuration, robustness and adaptability in P2P system. And maximum improvement in performance of the networks for multimedia system can be implemented by rapid networking and information sharing technology of the underlying P2P networks as well as fast call and location technology of SIP system. Experiments indicates that multimedia teaching management system based on SIP ＆ P2P could meet the requirement of system design on data latency and calling location.

Signal and Power Integrity Challenges for High Density System-on-Package

As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself,as the case for system-on-package(SoP),has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining,let alone improving,reliability and performance.The fundamental signal,power,and thermal integrity issues are discussed in detail,along with published techniques from around the industry to mitigate these issues in SoP applications.

基于JAIN SIP／JMF的IP组播视频会议系统的设计与实现

针对集中式视频会议系统服务器负载过重的问题,讨论在NIST-SIP协议栈基础上对基于SIP及IP组播的桌面视频会议系统的设计,利用JAIN SIP技术进行SIP信令集中处理,同时利用JMF技术实现音视频媒体流分布传输,改善了太多会议参与者同时接收网络多媒体音视频流时可能带来的过长网络延时和抖动问题,减轻了服务器的负担。

Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications

A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Effect of Freshness Protection Package on Storage and Preservation of Chinese Cabbage

The effect of freshness protection package on Chinese cabbage placed in the self-made shelf in ventilated storage was investigated, and the physiological-qual-ity indexes change were determined during the storage period. The results showed that the losses of weight and vitamin C were significantly reduced. The accumula-tion of crude fiber was effectively inhibited. But protein content was maintained at a low level and the rotting more serious of Chinese cabbage at the end of the stor-age packaged with the fresh keeping bags.

Application of wavelet package filtering in the de-noising of fiber optic gyroscopes

To reduce the drift error existing in the output signal of fiber optic gyroscopes （FOG）, a mathematical model of the FOG output signal is set up; the error characteristics of the FOG output signal are analyzed, and semi-soft threshold filtering is chosen based on the comparison of hard threshold and soft threshold filtering. The semi-soft threshold wavelet package filtering method is applied in the filtering of the FOG output signal. Experiments of the stationary and dynamic FOG output signals filtered with the wavelet package analysis are carried out in a lab environment, respectively. Experiments done with the real-time measured FOG signal show that the method of semi-soft threshold wavelet package filtering reduces the mean square error from 5 （°）/h to 1 （°）/h, so it is effective in eliminating the white noises and the fractal noises existing in the FOG. The novel method proposed here is proved valid in reducing the FOG drift error, satisfying the technical demands of high precision and realtime processing.

Integrated power electronics module based on chip scale packaged power devices

High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.

使用JAINSIP开发基于SIP协议的应用

会话发起协议(SIP)将在 3G网络中发挥重要的作用,而JAINSIP是用Java语言实现的SIP类库。简要介绍了SIP协议的规范,详细分析了JAINSIP的体系结构和实现机制,并用代码片断和交互图的方式描述了基于SIP协议应用的开发过程。用JAINSIP开发基于SIP协议的应用不仅可以提高开发效率,而且将使应用程序获得较高的可靠性和较好的移植性。

Model of gas exchange dynamics for modified-atmosphere packages containing fresh produce

A model for modified-atmosphere packaging （MAP） systems containing fruits and vegetables was developed.The computer simulation was performed to predict the gas mass concentrations inside the packages and was successfully verified by experiments with yellow peaches at 5,15 and 25 ℃ using two types of packaging films.A Michaelis-Menten type respiration model with noncompetitive inhibition mechanism due to CO2 was adopted while the respiration rates were measured with an improved permeable system method suitable for either steady or unsteady state.The applicability of the model in the design of MAP systems was demonstrated with a calculation to evaluate film specification and equilibrium concentrations of O2 and CO2 in the package containing yellow peaches.

澳大利亚Training Package对机电一体化技术专业教学标准建设的启示

开发、制订专业教学标准是贯彻落实科学发展观,落实《教育规划纲要》要求,完善教育质量国家标准体系,推进现代职业教育体系建设的重要措施.从澳大利亚职业培训包的制度中吸取有益经验,立足于我国实际,分析了机电一体化技术专业的现状和改革中遇到的问题,结合教育部加强专业教学标准建设推进工作提出了机电一体化技术专业教学标准建设的相关建议.

基于JAIN SIP的SIP实现技术

SIP(SessionInitiationProtocol会话启动协议 )是一种IP电话信令协议 ,而JAINSIP规范描述了JAVA和SIP两种技术的综合。本文通过对SIP协议和JAINSIP规范的研究 。

利用JAINSIP构建SIP服务器

SIP协议是应用层的会话控制协议,具有简单、可扩展和分布式功能等优点。文章简要介绍了SIP协议,随后详细研究了SUN公司JainSipAPI的规范和接口,提出了实现SIP通信的模型,并用其JainSip规范实现了SIP代理服务器模块的功能。

基于JAIN SIP的SIP呼叫控制的实现

为了实现基于JAIN SIP的SIP呼叫控制,应用JAIN SIP APIs研究了会话的建立和拆除过程,并根据生成的日志对会话过程进行了分析,对实现结果进行了模拟.其结果显示对开发基于JAIN SIP协议栈的业务具有参考作用.

基于JAIN SIP的用户代理软件设计

会话初始化协议(SIP)是下一代网络中应用层的信令控制协议。JAIN SIP是用于实现SIP应用而提供的一套标准Java接口。提出了一个基于JAIN SIP的用户代理软件框架,包括图形用户界面(GUI)、SIP消息处理模块、媒体处理模块和SIP协议栈,并对各个功能模块进行了详细分析。用JAIN SIP来开发基于SIP协议的应用不仅可以提高开发效率,而且将使应用程序获得较高的可靠性和较好的移植性。