A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging

A transformer-in-package(TiP)isolated direct current-direct current(DC-DC)converter using glass-based fan-out wafer-level packaging(FOWLP)is proposed.By using 3-layer redistribution layers(RDLs),both the transformer and interconnections are built without an additional transformer chip,and the converter only has 2 dies:a transmitter(TX)chip and a receiver(RX)chip.The proposed solution results in a significant reduction in the cost and makes major improvements in the form factor and power density.Moreover,the transformer built by the RDLs achieves a high quality factor(Q)and high coupling factor(k),and the efficiency of the converter is thus improved.The TX and RX chips were implemented in a 0.18μm Biopolar CMOS DMOS(BCD)process and embedded in a compact package with a size of 5 mm×5 mm.With an output capacitance of 10μF,the converter achieves a peak efficiency of 46.5%at 0.3 W output power and a maximum delivery power of 1.25 W,achieving a maximum power density of 50 mW/mm2.

基于SIP的FPGA驱动电压补偿测试研究

在基于SIP的现场可编程门阵列(FPGA)性能参数验证测试时,驱动电压测试会受到多种因素的影响,如PCB线阻、插座信号损耗以及测试温度等,这些因素导致ATE测试的实测值与真实值之间存在偏差。为了提高驱动电压的测试精度,提出一种基于卷积神经网络(CNN)与长短时记忆(LSTM)网络的误差补偿方法。将PCB线长、测试温度等参数作为特征输入到CNN-LSTM模型中,模型经过训练迭代后能够预测出驱动电压的误差值;再将预测的误差值应用于ATE测试机中,对实测值进行补偿和修正,从而使得测试结果更加接近真实值。实验结果表明,所提方法能够有效地减小测试误差,提高FPGA驱动电压测试的准确性。

Vehicle-oriented ridesharing package delivery in blockchain system

Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may result in the single point of failure once the controller breaks down or is under attack.To tackle such problems,our goal in this paper is to develop a blockchain-based package delivery ridesharing system,where decentralization is adopted to remove intermediaries and direct transactions between the providers and the requestors are allowed.To complete the matching process under decentralized structure,an Event-Triggered Distributed Deep Reinforcement Learning(ETDDRL)algorithm is proposed to generate/update the real-time ridesharing orders for the new coming ridesharing requests from a local view.Simulation results reveal the vast potential of the ETDDRL matching algorithm under the blockchain framework for the promotion of the ridesharing profits.Finally,we develop an application for Android-based terminals to verify the ETDDRL matching algorithm.

Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment

Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits.

DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages

Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects.

Intervention package on stress management: Improving comprehensive well-being among nurses

Objective:The main objective of this study is to investigate the effectiveness of the stress management intervention package in improving stress-related burnout.Materials and Methods:An experimental study was done on 300 nurses selected by a nonprobability convenience sampling technique and a quasi-experimental one-group pre-and posttest research design was utilized.Modified expanded nurses stress scale and self-structured three-point Likert scale on the challenges that nurses may face following stressful life events utilized to collect information.The nurses signed up for six interactive sessions on various stress-coping methods by utilizing a variety of teaching strategies such as lecture cum discussion,video slides,group work,and direct interaction with the experts to explore stress-related issues.Results:Continuous stress affects both the body and the mind,causing psychosomatic symptoms.Data found that 2%to 10%of nurses frequently suffered with physical symptoms such as exhaustion,backache,acidity,headache,shoulder stiffness,and insomnia.Following the intervention,the number of nurses who had these symptoms frequently and sometimes decreased.Previously,10%of nurses experienced emotional symptoms frequently;however,after intervention,this figure was reduced to<2%.The greatest proportion of nurses(18%)reported frequently worrying,while 1.3%expressed frequent worrying after intervention.Maximum(5%)of nurses had a tendency to eat too little or too much;this has been reduced to 0.3%after the intervention.The intervention package on stress management significantly improved nurses’Conclusion:An intervention package for stress management was helpful in lowering physical,emotional,psychological,and behavioral stress-related symptoms among nurses.

Ex⁃situ Measurement of Internal Deformation in Ball Grid Array Package with Digital Volume Correlation

In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.

Study on the Package Design Effect on Low-Calorie Snacks: Analyzing the Basic Behavior of Emotional Design in Low-Calorie Snacks Focused on Delight Project

Healthcare is an important issue,and obesity has become one of the main causes of health problems.Therefore,reasonable and healthy diet has entered the public agenda,and low calories have become an important choice for consumers.Low-calorie snack brands are emerging in endlessly at the top of the market.This article analyzes the packaging effect of low-calorie snacks,and uses emotional design to analyze the psychological impact of low-calorie package design on points of purchase.Emphasis is placed on the design of colors,cultural codes,and layout to analyze and discuss the emotional and behavioral responses of consumers,considering the interplay between visual packaging and emotional responses.Finally,by analyzing the effect of low-calorie snack packaging,this study emphasizes the empathy contained in the design,and summarizes the necessity of its emotional design and how to promote the innovation and development of low-calorie brands.

面向高密度数字SiP应用的封装工艺研究

面向高密度数字系统级封装(SiP)应用,采用多芯片一体化封装技术,在系统内部集成了数字信号处理器(DSP)以及外围的DDR3、SPI Flash、Nor Flash、Nand Flash、低压差稳压器(LDO)等多颗芯片,并基于高密度陶瓷封装基板及表面多层薄膜工艺实现了各芯片之间的高速互连。此外,利用无硅通孔转接板工艺完成了DDR芯片从引线键合到倒装的封装形式的重构,在保证传输距离的同时也保证了芯片封装尺寸的最小化。在35 mm×40 mm的封装尺寸内实现了一个具备数字信号处理功能的最小系统。所涉及到的技术为通用基础技术,可广泛应用于其他高密度封装产品中。

基于SiP的半导体激光器恒温控制及驱动系统设计

恒定的温度环境及稳定的电流注入是半导体激光器稳定工作的重要条件。传统恒温控制系统和光源电流驱动系统采用电压基准源、运放、功率三极管、MOSFET等分立器件实现,大量分立器件导致了系统电路复杂、可靠性低等问题。利用系统级封装(SiP)技术,将恒温控制系统与光源电流驱动系统进行高密度集成,实现了小型化、集成化、低成本的设计。通过系统级电路和热仿真分析,确保器件设计的可靠性。测试结果表明,该器件的参数满足要求。

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Effect of Freshness Protection Package on Storage and Preservation of Chinese Cabbage

The effect of freshness protection package on Chinese cabbage placed in the self-made shelf in ventilated storage was investigated, and the physiological-qual-ity indexes change were determined during the storage period. The results showed that the losses of weight and vitamin C were significantly reduced. The accumula-tion of crude fiber was effectively inhibited. But protein content was maintained at a low level and the rotting more serious of Chinese cabbage at the end of the stor-age packaged with the fresh keeping bags.

Application of wavelet package filtering in the de-noising of fiber optic gyroscopes

To reduce the drift error existing in the output signal of fiber optic gyroscopes （FOG）, a mathematical model of the FOG output signal is set up; the error characteristics of the FOG output signal are analyzed, and semi-soft threshold filtering is chosen based on the comparison of hard threshold and soft threshold filtering. The semi-soft threshold wavelet package filtering method is applied in the filtering of the FOG output signal. Experiments of the stationary and dynamic FOG output signals filtered with the wavelet package analysis are carried out in a lab environment, respectively. Experiments done with the real-time measured FOG signal show that the method of semi-soft threshold wavelet package filtering reduces the mean square error from 5 （°）/h to 1 （°）/h, so it is effective in eliminating the white noises and the fractal noises existing in the FOG. The novel method proposed here is proved valid in reducing the FOG drift error, satisfying the technical demands of high precision and realtime processing.

Integrated power electronics module based on chip scale packaged power devices

High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.

34 GHz Bandpass Filter for Low-temperature Co-fired Ceramic System-in-Package Application

Modern electronic circuit requires compact,multifunctional technology in communication systems.However,it is very difficult due to the limitations in passive component miniaturization and the complication of fabrication process.The bandpass filter is one of the most important passive components in millimeter（mm）-wave communication system,attracting significant interest in three-dimension（3D） miniaturized design,which is few reported.In this paper,a bandpass filter structure using low-temperature co-fired ceramic（LTCC） technology,which is fully integrated in a system-in package（SIP） communication module,is presented for miniaturized and high reliable mm-wave application.The bandpass filter with 3D end-coupled microstrip resonators is implemented in order to achieve a high performance bandwidth characteristic.Specifically,all of the resonators are embedded into different ceramic layers to decrease the insertion loss and enhance the out-of-band rejection performance by optimizing the coupling coefficient and the coupling strength.A fence structure,which is formed by metal-filled via array with the gap less than quarter wavelength,is placed around the embedded bandpass filter to avoid electromagnetic（EM） interference problem in multilayer structure.This structural model is validated through actual LTCC process.The bandpass filter is successfully manufactured by modifying the co-fireablity characteristics,adjusting the sintering profile,releasing the interfacial stress,and reducing the shrinkage mismatch with different materials.Measured results show good performance and agree well with the high frequency EM full wave simulation.The influence of layer thickness and dielectric constant on the frequency response in fabricated process is analyzed,where thicker ceramic sheets let the filter response shift to higher frequency.Moreover,measured S-parameters denote the center frequency is also strongly influenced by the variation of ceramic material＇s dielectric constants.By analyzing the relationship between the characteristics of the ceramic tape and the center frequency of the filter,both theoretical and experimental data are accumulated for broadening application filed.With the coupling resonators embedded into the ceramic layers,the bandpass filter exhibits advantages of small size and high reliability compared to conventional planar filter structure,which makes the bandpass filter suitable for SIP communicational application.

利用Oracle PL/SQL Package实现Dispatcher设计模式

Dispatcher设计模式可以使用各种技术来实现。以社会保险业务处理为基础,有效地利用ORACLEPL/SQLPac-kage语言及支撑环境对面向对象技术的支持,通过定义消息ID、传递消息ID、撰写处理函数、连接消息ID和处理函数来实现Dispatcher设计模式,并且构造出能处理各项社会保险管理业务的Package组件。

Model of gas exchange dynamics for modified-atmosphere packages containing fresh produce

A model for modified-atmosphere packaging （MAP） systems containing fruits and vegetables was developed.The computer simulation was performed to predict the gas mass concentrations inside the packages and was successfully verified by experiments with yellow peaches at 5,15 and 25 ℃ using two types of packaging films.A Michaelis-Menten type respiration model with noncompetitive inhibition mechanism due to CO2 was adopted while the respiration rates were measured with an improved permeable system method suitable for either steady or unsteady state.The applicability of the model in the design of MAP systems was demonstrated with a calculation to evaluate film specification and equilibrium concentrations of O2 and CO2 in the package containing yellow peaches.

利用ORACLE PL/SQL PACKAGE实现DISPATCHER设计模式

以ORACLEPACKAGE语言及支撑环境为基础,有效地利用其对面向对象技术的支持,实现DISPATCHER设计模式。

澳大利亚Training Package对机电一体化技术专业教学标准建设的启示

开发、制订专业教学标准是贯彻落实科学发展观,落实《教育规划纲要》要求,完善教育质量国家标准体系,推进现代职业教育体系建设的重要措施.从澳大利亚职业培训包的制度中吸取有益经验,立足于我国实际,分析了机电一体化技术专业的现状和改革中遇到的问题,结合教育部加强专业教学标准建设推进工作提出了机电一体化技术专业教学标准建设的相关建议.