Previously,a single data-path stack was adequate for data-path chips,and the complexity and size of the data-path was comparatively small.As current data-path chips,such as system-on-a-chip (SOC),become more complex,m...Previously,a single data-path stack was adequate for data-path chips,and the complexity and size of the data-path was comparatively small.As current data-path chips,such as system-on-a-chip (SOC),become more complex,multiple data-path stacks are required to implement the entire data-path.As more data-path stacks are integrated into SOC,data-path is becoming a critical part of the whole giga-scale integrated circuits (GSI) design.The traditional physical design methodology can not satisfy the data-path performance requirements,because it can not accommodate the data-path bit-sliced structure and the strict performance (such as timing,coupling,and crosstalk) constraints.Challenges in the data-path physical design are addressed.The fundamental problems and key technologies in data-path physical design are analysed.The corresponding researches and solutions in this research field are also discussed.展开更多
This paper presents a new test data compression/decompression method for SoC testing,called hybrid run length codes. The method makes a full analysis of the factors which influence test parameters:compression ratio,t...This paper presents a new test data compression/decompression method for SoC testing,called hybrid run length codes. The method makes a full analysis of the factors which influence test parameters:compression ratio,test application time, and area overhead. To improve the compression ratio, the new method is based on variable-to-variable run length codes,and a novel algorithm is proposed to reorder the test vectors and fill the unspecified bits in the pre-processing step. With a novel on-chip decoder, low test application time and low area overhead are obtained by hybrid run length codes. Finally, an experimental comparison on ISCAS 89 benchmark circuits validates the proposed method展开更多
A hardware-software co-simulation method for system on chip (SOC) design is discussed. It is based on an instruction set simulator (ISS) and an event-driven hardware simulator, and a bus interface model that is descri...A hardware-software co-simulation method for system on chip (SOC) design is discussed. It is based on an instruction set simulator (ISS) and an event-driven hardware simulator, and a bus interface model that is described in C language provides the interface between the two. The bus interface model and the ISS are linked into a singleton program--the software simulator, which communicate with the hardware simulator through Windows sockets. The implementation of the bus interface model and the synchronization between hardware and software simulator are discussed in detail. Co-simulation control of the hardware simulator is also discussed.展开更多
This paper presents a test resource partitioning technique based on anefficient response compaction design called quotient compactor(q-Compactor). Because q-Compactor isa single-output compactor, high compaction ratio...This paper presents a test resource partitioning technique based on anefficient response compaction design called quotient compactor(q-Compactor). Because q-Compactor isa single-output compactor, high compaction ratios can be obtained even for chips with a small numberof outputs. Some theorems for the design of q-Compactor are presented to achieve full diagnosticability, minimize error cancellation and handle unknown bits in the outputs of the circuit undertest (CUT). The q-Compactor can also be moved to the load-board, so as to compact the outputresponse of the CUT even during functional testing. Therefore, the number of tester channelsrequired to test the chip is significantly reduced. The experimental results on the ISCAS ''89benchmark circuits and an MPEG 2 decoder SoC show that the proposed compaction scheme is veryefficient.展开更多
With the wide application of electronic hardware in aircraft such as air-to-ground communication,satellite communication,positioning system and so on,aircraft hardware is facing great secure pressure.Focusing on the s...With the wide application of electronic hardware in aircraft such as air-to-ground communication,satellite communication,positioning system and so on,aircraft hardware is facing great secure pressure.Focusing on the secure problem of aircraft hardware,this paper proposes a supervisory control architecture based on secure System-on-a-Chip(So C)system.The proposed architecture is attack-immune and trustworthy,which can support trusted escrow application and Dynamic Integrity Measurement(DIM)without interference.This architecture is characterized by a Trusted Monitoring System(TMS)hardware isolated from the Main Processor System(MPS),a secure access channel from TMS to the running memory of the MPS,and the channel is unidirectional.Based on this architecture,the DIM program running on TMS is used to measure and call the Lightweight Measurement Agent(LMA)program running on MPS.By this method,the Operating System(OS)kernel,key software and data of the MPS can be dynamically measured without disturbance,which makes it difficult for adversaries to attack through software.Besides,this architecture has been fully verified on FPGA prototype system.Compared with the existing systems,our architecture achieves higher security and is more efficient on DIM,which can fully supervise the running of application and aircraft hardware OS.展开更多
It is often the case that in the development of a system-on-a-chip(SoC)design,a family of SystemC transaction level models(TLM)is created.TLMs in the same family often share common functionalities but differ in their ...It is often the case that in the development of a system-on-a-chip(SoC)design,a family of SystemC transaction level models(TLM)is created.TLMs in the same family often share common functionalities but differ in their timing,implementation,configuration and performance in various SoC developing phases.In most cases,all the TLMs in a family must be verified for the follow-up design activities.In our previous work,we proposed to call such family TLM product line(TPL),and proposed feature-oriented(FO)design methodology for efficient TPL development.However,developers can only verify TLM in a family one by one,which causes large portion of duplicated verification overhead.Therefore,in our proposed methodology,functional verification of TPL has become a bottleneck.In this paper,we proposed a novel TPL verification method for FO designs.In our method,for the given property,we can exponentially reduce the number of TLMs to be verified by identifying mutefeature-modules(MFM),which will avoid duplicated veri-fication.The proposed method is presented in informal and formal way,and the correctness of it is proved.The theoretical analysis and experimental results on a real design show the correctness and efficiency of the proposed method.展开更多
A novel amperometric immunosensor based on the micro electromechanical systems (MEMS) technology, using protein A and self-assembled monolayers (SAMs) for the orientation-controlled immobilization of antibodies, h...A novel amperometric immunosensor based on the micro electromechanical systems (MEMS) technology, using protein A and self-assembled monolayers (SAMs) for the orientation-controlled immobilization of antibodies, has been developed. Using MEMS technology, an "Au, Pt, Pt" three-microelectrode system enclosed in a SU-8 micro pool was fabricated. Employing SAMs, a monolayer of protein A was immobilized on the cysteamine modified Au electrode to achieve the orientation-controlled immobilization of the human immunoglobulin (HIgG) antibody. The immunosensor aimed at low unit cost, small dimension, high level of integration and the prospect of a biosensor system-on-a-chip. Cyclic voltammetry and chronoamperometry were conducted to characterize the immunosensor. Compared with the traditional immunosensor using bulky gold electrode or screen-printed electrode and the procedure directly binding protein A to electrode for immobilization of antibodies, it had attractive advantages, such as miniaturization, compatibility with CMOS technology, fast response (30 s), broad linear range (50-400 pg/L) and low detection limit (10 pg/L) for HIgG. In addition, this immunosensor was easy to be designed into micro array and to realize the simultaneously multi-parameter detection.展开更多
文摘Previously,a single data-path stack was adequate for data-path chips,and the complexity and size of the data-path was comparatively small.As current data-path chips,such as system-on-a-chip (SOC),become more complex,multiple data-path stacks are required to implement the entire data-path.As more data-path stacks are integrated into SOC,data-path is becoming a critical part of the whole giga-scale integrated circuits (GSI) design.The traditional physical design methodology can not satisfy the data-path performance requirements,because it can not accommodate the data-path bit-sliced structure and the strict performance (such as timing,coupling,and crosstalk) constraints.Challenges in the data-path physical design are addressed.The fundamental problems and key technologies in data-path physical design are analysed.The corresponding researches and solutions in this research field are also discussed.
文摘This paper presents a new test data compression/decompression method for SoC testing,called hybrid run length codes. The method makes a full analysis of the factors which influence test parameters:compression ratio,test application time, and area overhead. To improve the compression ratio, the new method is based on variable-to-variable run length codes,and a novel algorithm is proposed to reorder the test vectors and fill the unspecified bits in the pre-processing step. With a novel on-chip decoder, low test application time and low area overhead are obtained by hybrid run length codes. Finally, an experimental comparison on ISCAS 89 benchmark circuits validates the proposed method
文摘A hardware-software co-simulation method for system on chip (SOC) design is discussed. It is based on an instruction set simulator (ISS) and an event-driven hardware simulator, and a bus interface model that is described in C language provides the interface between the two. The bus interface model and the ISS are linked into a singleton program--the software simulator, which communicate with the hardware simulator through Windows sockets. The implementation of the bus interface model and the synchronization between hardware and software simulator are discussed in detail. Co-simulation control of the hardware simulator is also discussed.
基金国家自然科学基金,the Sci. & Technol. Project of Beijing,中国科学院资助项目,Synopsys公司资助项目
文摘This paper presents a test resource partitioning technique based on anefficient response compaction design called quotient compactor(q-Compactor). Because q-Compactor isa single-output compactor, high compaction ratios can be obtained even for chips with a small numberof outputs. Some theorems for the design of q-Compactor are presented to achieve full diagnosticability, minimize error cancellation and handle unknown bits in the outputs of the circuit undertest (CUT). The q-Compactor can also be moved to the load-board, so as to compact the outputresponse of the CUT even during functional testing. Therefore, the number of tester channelsrequired to test the chip is significantly reduced. The experimental results on the ISCAS ''89benchmark circuits and an MPEG 2 decoder SoC show that the proposed compaction scheme is veryefficient.
基金supported by the National Key Research and Development Program of China(No.2017YFB0802502)by the Aeronautical Science Foundation(No.2017ZC51038)+4 种基金by the National Natural Science Foundation of China(Nos.62002006,61702028,61672083,61370190,61772538,61532021,61472429,and 61402029)by the Foundation of Science and Technology on Information Assurance Laboratory(No.1421120305162112006)by the National Cryptography Development Fund(No.MMJJ20170106)by the Defense Industrial Technology Development Program(No.JCKY2016204A102)by the Liaoning Collaboration Innovation Center For CSLE,China。
文摘With the wide application of electronic hardware in aircraft such as air-to-ground communication,satellite communication,positioning system and so on,aircraft hardware is facing great secure pressure.Focusing on the secure problem of aircraft hardware,this paper proposes a supervisory control architecture based on secure System-on-a-Chip(So C)system.The proposed architecture is attack-immune and trustworthy,which can support trusted escrow application and Dynamic Integrity Measurement(DIM)without interference.This architecture is characterized by a Trusted Monitoring System(TMS)hardware isolated from the Main Processor System(MPS),a secure access channel from TMS to the running memory of the MPS,and the channel is unidirectional.Based on this architecture,the DIM program running on TMS is used to measure and call the Lightweight Measurement Agent(LMA)program running on MPS.By this method,the Operating System(OS)kernel,key software and data of the MPS can be dynamically measured without disturbance,which makes it difficult for adversaries to attack through software.Besides,this architecture has been fully verified on FPGA prototype system.Compared with the existing systems,our architecture achieves higher security and is more efficient on DIM,which can fully supervise the running of application and aircraft hardware OS.
基金The work was supported by the National Key R&D Program of China(2018YFB1004202)by Laboratory of Software Engineering for Complex Systems.
文摘It is often the case that in the development of a system-on-a-chip(SoC)design,a family of SystemC transaction level models(TLM)is created.TLMs in the same family often share common functionalities but differ in their timing,implementation,configuration and performance in various SoC developing phases.In most cases,all the TLMs in a family must be verified for the follow-up design activities.In our previous work,we proposed to call such family TLM product line(TPL),and proposed feature-oriented(FO)design methodology for efficient TPL development.However,developers can only verify TLM in a family one by one,which causes large portion of duplicated verification overhead.Therefore,in our proposed methodology,functional verification of TPL has become a bottleneck.In this paper,we proposed a novel TPL verification method for FO designs.In our method,for the given property,we can exponentially reduce the number of TLMs to be verified by identifying mutefeature-modules(MFM),which will avoid duplicated veri-fication.The proposed method is presented in informal and formal way,and the correctness of it is proved.The theoretical analysis and experimental results on a real design show the correctness and efficiency of the proposed method.
基金supported by the National Natural Science Foundation of China(Grant No.90307014).
文摘A novel amperometric immunosensor based on the micro electromechanical systems (MEMS) technology, using protein A and self-assembled monolayers (SAMs) for the orientation-controlled immobilization of antibodies, has been developed. Using MEMS technology, an "Au, Pt, Pt" three-microelectrode system enclosed in a SU-8 micro pool was fabricated. Employing SAMs, a monolayer of protein A was immobilized on the cysteamine modified Au electrode to achieve the orientation-controlled immobilization of the human immunoglobulin (HIgG) antibody. The immunosensor aimed at low unit cost, small dimension, high level of integration and the prospect of a biosensor system-on-a-chip. Cyclic voltammetry and chronoamperometry were conducted to characterize the immunosensor. Compared with the traditional immunosensor using bulky gold electrode or screen-printed electrode and the procedure directly binding protein A to electrode for immobilization of antibodies, it had attractive advantages, such as miniaturization, compatibility with CMOS technology, fast response (30 s), broad linear range (50-400 pg/L) and low detection limit (10 pg/L) for HIgG. In addition, this immunosensor was easy to be designed into micro array and to realize the simultaneously multi-parameter detection.