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Research on Cutting Force of Ultrasonic Diamond Wire Saw 被引量:5
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作者 张辽远 李鑫 《Defence Technology(防务技术)》 SCIE EI CAS 2010年第2期114-118,共5页
Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutti... Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further. 展开更多
关键词 machinofature technique and equipment mechanics manufacturing process hard and brittle material electroplated diamond wire saw ultrasonic machining
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An Investigation on a Tin Fixed Abrasive Polishing Pad with Phyllotactic Pattern for Polishing Wafer 被引量:2
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作者 吕玉山 刘电飞 寇智慧 《Defence Technology(防务技术)》 SCIE EI CAS 2012年第3期174-180,共7页
In order to improve the polishing ability of polishing pads, a kind of polishing pad with the tin fixed abrasive blocks, which are arranged based on the phyllotaxis theory of biology, was designed and fabricated by th... In order to improve the polishing ability of polishing pads, a kind of polishing pad with the tin fixed abrasive blocks, which are arranged based on the phyllotaxis theory of biology, was designed and fabricated by the use of electroplating technology, and also its polishing ability for JGS-2 wafer was investigated by polishing experiments. The research results show that the phyllotactic parameters of the polishing pad influence the arrangement density of the tin fixed abrasive blocks, the polishing pad with phyllotactic pattern is feasibly fabricated by the use of electroplating technology, and the good polishing result can be obtained by using the polishing pad with phyllotactic pattern to polish a wafer when the diameter D of the tin fixed abrasive block is between Φ1.3 mm and Φ1.4 mm, and the phyllotactic coefficient k between 1.0 and 1.1,respectively. 展开更多
关键词 machinofature technique and equipment POLISHING polishing pad phyllotactic pattern
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Research on Machined Surface Veins Based on Turn-milling Technology
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作者 金成哲 《Defence Technology(防务技术)》 SCIE EI CAS 2009年第4期241-245,共5页
Turn-milling which history dates from the end of the 20th century is one of the advanced metal cutting technologies. It could precisely machine hard materials as an alternative to turning for certain limitations. A se... Turn-milling which history dates from the end of the 20th century is one of the advanced metal cutting technologies. It could precisely machine hard materials as an alternative to turning for certain limitations. A series of orthogonal turn-milling surface veins experiments have been done on the turn-milling machining center by machining aluminum alloy,and then the nexus between the surface veins and the cutting regimes is studied. The mathematical model for surface vein direction angle is established,also the forming mechanics of surface vein direction is analyzed. Its variety regulation presents decreasing trend with as axial feed and cutter rotary speed increasing. For different eccentric distance of orthogonal turn-milling,the surface veins are different. 展开更多
关键词 machinofature technique and equipment axial feed cutter rotary speed eccentric distance surface veins TURN-MILLING
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Research on Cutting Trajectory of Electroplated Diamond Wire Saw
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作者 张辽远 王超 +1 位作者 王建光 杨勇 《Defence Technology(防务技术)》 CAS 2012年第2期124-128,共5页
The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite elem... The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters. 展开更多
关键词 manufacturing technique and equipment electroplated diamond wire saw sawing trajectory stress analysis trajectory equation
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