This paper gives a numerical study on the flow and temperature fields in an induced plasma reactor, which worked in 0.5 ATM with air as a working gas. We employed a two-dimensional mode of an inductively coupled plas...This paper gives a numerical study on the flow and temperature fields in an induced plasma reactor, which worked in 0.5 ATM with air as a working gas. We employed a two-dimensional mode of an inductively coupled plasma to calculate the temperature and flow field of the reactor as well as the generator. The algorithm is based on the solutions of the two-dimensional continuity, momentum, and energy equations in term of vorticity, stream function and enthalpy. An upwind finite-difference scheme was adopted to solve those equations with appropriate boundary conditions. The computed results show that there is a flat region with little parameter change in the reactor, that the diameter of the region is not much larger than that of the generator and that a deep change of parameter exists in the outer side of the region.展开更多
This study investigated the inductively coupled plasma etching reactor and RF coils developed by North Microelectronic Corporation. Full three dimensional simulations were made at different discharge conditions. The s...This study investigated the inductively coupled plasma etching reactor and RF coils developed by North Microelectronic Corporation. Full three dimensional simulations were made at different discharge conditions. The simulations examined and compared the distribution and non-uniformity of several plasma parameters at a fixed position upon the wafer at different pressures and coil currents. These parameters included electron density, electron temperature and power deposition. The results demonstrate that the electron density, power deposition and uniformity increase with either higher pressure or stronger coil currents, while the electron temperature decreases at this condition. Coil number increase can reduce the non-uniformity of parameters in the spatial distribution. The linear relationship between power deposition and electron density does not always exist. The comparison between simulation results and experiment results is also presented in the paper.展开更多
文摘This paper gives a numerical study on the flow and temperature fields in an induced plasma reactor, which worked in 0.5 ATM with air as a working gas. We employed a two-dimensional mode of an inductively coupled plasma to calculate the temperature and flow field of the reactor as well as the generator. The algorithm is based on the solutions of the two-dimensional continuity, momentum, and energy equations in term of vorticity, stream function and enthalpy. An upwind finite-difference scheme was adopted to solve those equations with appropriate boundary conditions. The computed results show that there is a flat region with little parameter change in the reactor, that the diameter of the region is not much larger than that of the generator and that a deep change of parameter exists in the outer side of the region.
基金supported by North Microelectronic Corporation (NMC).
文摘This study investigated the inductively coupled plasma etching reactor and RF coils developed by North Microelectronic Corporation. Full three dimensional simulations were made at different discharge conditions. The simulations examined and compared the distribution and non-uniformity of several plasma parameters at a fixed position upon the wafer at different pressures and coil currents. These parameters included electron density, electron temperature and power deposition. The results demonstrate that the electron density, power deposition and uniformity increase with either higher pressure or stronger coil currents, while the electron temperature decreases at this condition. Coil number increase can reduce the non-uniformity of parameters in the spatial distribution. The linear relationship between power deposition and electron density does not always exist. The comparison between simulation results and experiment results is also presented in the paper.
