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Research on high-voltage 4H-SiC P-i-N diode with planar edge junction termination techniques 被引量:1
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作者 张发生 李欣然 《Chinese Physics B》 SCIE EI CAS CSCD 2011年第6期366-371,共6页
The planar edge termination techniques of junction termination extension (JTE) and offset field plates and fieldlimiting rings for the 4H-SiC P i-N diode were investigated and optimized by using a two-dimensional de... The planar edge termination techniques of junction termination extension (JTE) and offset field plates and fieldlimiting rings for the 4H-SiC P i-N diode were investigated and optimized by using a two-dimensional device simulator ISE-TCAD10.0. By experimental verification, a good consistency between simulation and experiment can be observed. The results show that the reverse breakdown voltage for the 4H-SiC P-i-N diode with optimized JTE edge termination can accomplish near ideal breakdown voltage and much lower leakage current. The breakdown voltage can be near 1650 V, which achieves more than 90 percent of ideal parallel plane junction breakdown voltage and the leakage current density can be near 3 ×10^-5 A/cm2. 展开更多
关键词 silicon carbide P-i-N diode junction termination technique simulation breakdown voltage
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A simulation study of field plate termination in Ga2O3 Schottky barrier diodes 被引量:2
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作者 Hui Wang Ling-Li Jiang +2 位作者 Xin-Peng Lin Si-Qi Lei Hong-Yu Yu 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第12期455-460,共6页
In this work, the field plate termination is studied for Ga2O3Schottky barrier diodes(SBDs) by simulation. The influence of field plate overlap, dielectric material and thickness on the termination electric field dist... In this work, the field plate termination is studied for Ga2O3Schottky barrier diodes(SBDs) by simulation. The influence of field plate overlap, dielectric material and thickness on the termination electric field distribution are demonstrated.It is found that the optimal thickness increases with reverse bias increasing for all the three dielectrics of SiO2, Al2O3, and HfO2. As the thickness increases, the maximum electric field intensity decreases in SiO2and Al2O3, but increases in HfO2.Furthermore, it is found that SiO2and HfO2are suitable for the 600 V rate Ga2O3SBD, and Al2O3is suitable for both600 V and 1200 V rate Ga2O3SBD. In addition, the comparison of Ga2O3SBDs between the SiC and GaN counterpart reveals that for Ga2O3, the breakdown voltage bottleneck is the dielectric. While, for SiC and GaN, the bottleneck is mainly the semiconductor itself. 展开更多
关键词 Ga_2O_3 Schottky barrier diode field plate termination technique
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