The interfacial microstructure of ternary-boride-based hard cladding material (YF-2) has been studied using scanning electron microanalyser (SEM), X-ray diffraction (XRD) and energy disperse spectroscopy (EDS). Result...The interfacial microstructure of ternary-boride-based hard cladding material (YF-2) has been studied using scanning electron microanalyser (SEM), X-ray diffraction (XRD) and energy disperse spectroscopy (EDS). Results show that there are chemical reactions and elements diffusion in the interfacial zone, which make the interface bonding well and bonding strength ideal at the interface. The results gotten by studying of crack produced by Vickers indentation technique in the interfacial zone show that it is difficult to produce crack in the interface, the crack length in the cladding layer is longer than that to the interface, the crack which propagate to the interface stops at the interface rather than propagates along the interface. This suggests negligible residual stresses have developed because of thermal expansion mismatch. The bonding strength of the interface is 550MPa, which has been gotten by cutting test. The result gotten by analyzing the fracture surface shows that the fracture occurs at the side of cladding layer, which confirms that the bonding strength at the interface is higher than that in the cladding layer.展开更多
基金supported by National Natural Science Foundation of China(No.59975054).
文摘The interfacial microstructure of ternary-boride-based hard cladding material (YF-2) has been studied using scanning electron microanalyser (SEM), X-ray diffraction (XRD) and energy disperse spectroscopy (EDS). Results show that there are chemical reactions and elements diffusion in the interfacial zone, which make the interface bonding well and bonding strength ideal at the interface. The results gotten by studying of crack produced by Vickers indentation technique in the interfacial zone show that it is difficult to produce crack in the interface, the crack length in the cladding layer is longer than that to the interface, the crack which propagate to the interface stops at the interface rather than propagates along the interface. This suggests negligible residual stresses have developed because of thermal expansion mismatch. The bonding strength of the interface is 550MPa, which has been gotten by cutting test. The result gotten by analyzing the fracture surface shows that the fracture occurs at the side of cladding layer, which confirms that the bonding strength at the interface is higher than that in the cladding layer.
