An electro-absorption(EA)modulator is one of key components for optical fiber communications due to the high speed,small size,low voltage and integration ability with other semiconductor devices.A 40 Gb/s InGaAsP/InP ...An electro-absorption(EA)modulator is one of key components for optical fiber communications due to the high speed,small size,low voltage and integration ability with other semiconductor devices.A 40 Gb/s InGaAsP/InP multiplequantum-well(MQW)EA modulator monolithically integrated with a semiconductor optical amplifier(SOA)was fabricated for digital communications.The modulator capacitance was reduced to obtain 40 GHz bandwidth,and the SOA section helped reduce the insertion loss from 18 dB to 3 dB.InGaAlAs/InP MQW EA modulators have also been fabricated and characterized for analog optical fiber communications.A low driving voltage of 2.7 V and high spurious free dynamic range of 107 dB·Hz2/3 were estimated by static and dynamic measurements.展开更多
In this paper, the design and verification process of an automobile-engine-fan control system on chip （SoC） are introduced. The SoC system, SHU-MV08, reuses four new intellectual property （IP） cores and the design...In this paper, the design and verification process of an automobile-engine-fan control system on chip （SoC） are introduced. The SoC system, SHU-MV08, reuses four new intellectual property （IP） cores and the design flow is accomplished with 0.35 btm chartered CMOS technology. Some special functions of IP cores, the detailed integration scheme of four IP cores, and the verification method of the entire SoC are presented. To settle the verification problems brought by analog IP cores, NanoSim based chip-level mixed-signal verification method is introduced. The verification time is greatly reduced and the first tape-out achieves success which proves the validity of our design.展开更多
This paper presents a novel genetic algorithm for analog module placement based on a generalization of the two-dimensional bin packing problem. The genetic encoding and operators assure that all problem constraints ar...This paper presents a novel genetic algorithm for analog module placement based on a generalization of the two-dimensional bin packing problem. The genetic encoding and operators assure that all problem constraints are always satisfied. Thus the potential problems of adding penalty terms to the cost function are eliminated so that the search configuration space is drastically decreased. The dedicated cost function is based on the special requirements of analog integrated circuits. A fractional factorial experiment was conducted using an orthogonal array to study the algorithm parameters. A meta-GA was applied to determine the optimal parameter values. The algorithm was tested with several local benchmark circuits. The experimental results show that the algorithm has better performance than the simulated annealing approach with satisfactory results comparable to manual placement. This study demonstrates the effectiveness of the genetic algorithm in the analog module placement problem. The algorithm has been successfully used in a layout synthesis tool.展开更多
This paper describes an analog front-end （AFE） intended for portable audio application, which operates at 1 V and consumes only 410 μW. The AFE consists of a 30 dB-gain programmable gain amplifier （PGA） and a 2nd...This paper describes an analog front-end （AFE） intended for portable audio application, which operates at 1 V and consumes only 410 μW. The AFE consists of a 30 dB-gain programmable gain amplifier （PGA） and a 2nd-order 3-bit sigma-delta modulator. The PGA with single input and on-chip common-mode bias voltage shows good noise-reduction performance. The modulator makes use of data weighted averaging to reduce the linearity requirements of the digital-to-analog converter in the feedback loop. The AFE is implemented in the SMIC 0.13μm 1PSM CMOS process. The measurement results show that in a 1 V power supply, at 200 mVp-p, between 100 Hz and 20 kHz, the maximal signal-to-noise ratio is 70 dB, and the total power is 410 μW.展开更多
基金supported by National ScienceFoundation Programs(60536020,60723002)"973"State Key Basic Research Programs(2006CB302800,2006CB921106)
文摘An electro-absorption(EA)modulator is one of key components for optical fiber communications due to the high speed,small size,low voltage and integration ability with other semiconductor devices.A 40 Gb/s InGaAsP/InP multiplequantum-well(MQW)EA modulator monolithically integrated with a semiconductor optical amplifier(SOA)was fabricated for digital communications.The modulator capacitance was reduced to obtain 40 GHz bandwidth,and the SOA section helped reduce the insertion loss from 18 dB to 3 dB.InGaAlAs/InP MQW EA modulators have also been fabricated and characterized for analog optical fiber communications.A low driving voltage of 2.7 V and high spurious free dynamic range of 107 dB·Hz2/3 were estimated by static and dynamic measurements.
基金Project supported by the IC Special Foundation of Shanghai Municipal Commission of Science and Technology (Grant No.09706201300)the Shanghai Municipal Commission of Economic and Information (Grant No.090344)the Shanghai High-Tech Industrialization of New Energy Vehicles (Grant No.09625029),and the Graduate Innovation Foundation of Shanghai University
文摘In this paper, the design and verification process of an automobile-engine-fan control system on chip （SoC） are introduced. The SoC system, SHU-MV08, reuses four new intellectual property （IP） cores and the design flow is accomplished with 0.35 btm chartered CMOS technology. Some special functions of IP cores, the detailed integration scheme of four IP cores, and the verification method of the entire SoC are presented. To settle the verification problems brought by analog IP cores, NanoSim based chip-level mixed-signal verification method is introduced. The verification time is greatly reduced and the first tape-out achieves success which proves the validity of our design.
基金Supported by the State of Saxony Anhalt and Siemens AG(No.2577A/0027B)in Germany
文摘This paper presents a novel genetic algorithm for analog module placement based on a generalization of the two-dimensional bin packing problem. The genetic encoding and operators assure that all problem constraints are always satisfied. Thus the potential problems of adding penalty terms to the cost function are eliminated so that the search configuration space is drastically decreased. The dedicated cost function is based on the special requirements of analog integrated circuits. A fractional factorial experiment was conducted using an orthogonal array to study the algorithm parameters. A meta-GA was applied to determine the optimal parameter values. The algorithm was tested with several local benchmark circuits. The experimental results show that the algorithm has better performance than the simulated annealing approach with satisfactory results comparable to manual placement. This study demonstrates the effectiveness of the genetic algorithm in the analog module placement problem. The algorithm has been successfully used in a layout synthesis tool.
基金Project supported by the National Natural Science Foundation of China(No.61001052)the Beijing Natural Science Foundation(No.4123096)
文摘This paper describes an analog front-end （AFE） intended for portable audio application, which operates at 1 V and consumes only 410 μW. The AFE consists of a 30 dB-gain programmable gain amplifier （PGA） and a 2nd-order 3-bit sigma-delta modulator. The PGA with single input and on-chip common-mode bias voltage shows good noise-reduction performance. The modulator makes use of data weighted averaging to reduce the linearity requirements of the digital-to-analog converter in the feedback loop. The AFE is implemented in the SMIC 0.13μm 1PSM CMOS process. The measurement results show that in a 1 V power supply, at 200 mVp-p, between 100 Hz and 20 kHz, the maximal signal-to-noise ratio is 70 dB, and the total power is 410 μW.
