Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy ...Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials.Compared to the conventional thermal management materials,flexible thermally conductive films with high in-plane thermal conductivity,as emerging candidates,have aroused greater interest in the last decade,which show great potential in thermal management applications of next-generation devices.However,a comprehensive review of flexible thermally conductive films is rarely reported.Thus,we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity,with deep understandings of heat transfer mechanism,processing methods to enhance thermal conductivity,optimization strategies to reduce interface thermal resistance and their potential applications.Lastly,challenges and opportunities for the future development of flexible thermally conductive films are also discussed.展开更多
Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)va...Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.展开更多
As global warming intensifies, researchers worldwide strive to develop effective ways to reduce heat transfer. Among the natural fiber composites studied extensively in recent decades, bamboo has emerged as a prime ca...As global warming intensifies, researchers worldwide strive to develop effective ways to reduce heat transfer. Among the natural fiber composites studied extensively in recent decades, bamboo has emerged as a prime candidate for reinforcement. This woody plant offers inherent strengths, biodegradability, and abundant availability. Due to its high cellulose content, its low thermal conductivity establishes bamboo as a thermally resistant material. Its low thermal conductivity, enhanced by a NaOH solution treatment, makes it an excellent thermally resistant material. Researchers incorporated Hollow Glass Microspheres (HGM) and Kaolin fillers into the epoxy matrix to improve the insulating properties of bamboo composites. These fillers substantially enhance thermal resistance, limiting heat transfer. Various compositions, like (30% HGM + 25% Bamboo + 65% Epoxy) and (30% Kaolin + 25% Bamboo + 45% Epoxy), were compared to identify the most efficient thermal insulator. Using Vacuum Assisted Resin Transfer Molding (VARTM) ensures uniform distribution of fillers and resin, creating a structurally sound thermal barrier. These reinforced composites, evaluated using the TOPSIS method, demonstrated their potential as high-performance materials combating heat transfer, offering a promising solution in the battle against climate change.展开更多
The microporous corundum material was prepared using alumina micro-powder as the main raw material, alumina sol and starch as binders by a wet process, achieving the bulk density of 3.05 g · cm^-3, the apparent p...The microporous corundum material was prepared using alumina micro-powder as the main raw material, alumina sol and starch as binders by a wet process, achieving the bulk density of 3.05 g · cm^-3, the apparent porosity of 9. 1%, the closed porosity of 12.3%, the median pore diameter of 0. 43 μm, and the thermal conductivity of 6. 5 W· m^-1· K^-1 at 800 ℃ which is 41.6% lower than that of common corundum. The slag resistance of the microporous corundum material was studied by immersion and compared with that of the common corundum aggregate, and the slag resistant mechanism of microporous corundum material was revealed. The results show that the slag resistance of the microporous corundum material is superior to that of the common corundum aggregate, the SEM and EDX show that on the reaction interface between microporous corundum and molten, slag, a continuous isolation layer with a large quantity of CA2 and CA6 columnar crystals is formed; while the common corundum aggregate reacts with the molten slag interface to form a discontinuous isolation layer of columnar crystals, through which a lot of molten slag corrodes or permeates into the aggregate. The mechanism is mainly that the microporous structure is more advantageous to nucleation and growth of CA2 and CA6 columnar crystals; in the reaction with the aggregate, the molten slag gets saturated and the critical solution thickness of the microporous corundum and the common corundum is 0. 16 μm and 0. 34 μm, respectively, this is caused by the smaller microporous corundum aggregate pores; and the smaller pores also increase the second phase ripening rate of microporous corundum, which is 9. 7 times of that of the common corundum.展开更多
High thermal conductivity dense silica bricks have the higher thermal conductivity than ordinary silica bricks,which is conducive to the realization of energy saving and emission reduction in the iron and steel indust...High thermal conductivity dense silica bricks have the higher thermal conductivity than ordinary silica bricks,which is conducive to the realization of energy saving and emission reduction in the iron and steel industry.The performance of ordinary silica bricks and high thermal conductivity dense silica bricks was compared,and the high thermal conductivity mechanism was analyzed.The results show that(1)compared with ordinary silica bricks,high thermal conductivity dense silica bricks have the characteristics of higher thermal conductivity,lower apparent porosity,higher tridymite content,higher compressive strength,and higher thermal expansion;(2)by increasing the tridymite content and reducing the porosity,the close packing of honeycombα-tridymite improves the density and continuity of the SiO_(2)frame structure of the silica bricks,and the larger area perpendicular to the heat transfer direction improves the thermal conductivity of the bricks;(3)the densification of the silica bricks also increases the thermal expansion of the bricks,but they still meet the standard requirements.展开更多
The two-dimensional(2D)material-based thermal switch is attracting attention due to its novel applications,such as energy conversion and thermal management,in nanoscale devices.In this paper,we observed that the rever...The two-dimensional(2D)material-based thermal switch is attracting attention due to its novel applications,such as energy conversion and thermal management,in nanoscale devices.In this paper,we observed that the reversible 2H–1T′phase transition in MoTe_(2)is associated with about a fourfold/tenfold change in thermal conductivity along the X/Y direction by using first-principles calculations.This phenomenon can be profoundly understood by comparing the Mo–Te bonding strength between the two phases.The 2H-MoTe_(2)has one stronger bonding type,while 1T′-MoTe_(2)has three weaker types of bonds,suggesting bonding inhomogeneity in 1T′-MoTe_(2).Meanwhile,the bonding inhomogeneity can induce more scattering of vibration modes.The weaker bonding indicates a softer structure,resulting in lower phonon group velocity,a shorter phonon relaxation lifetime and larger Gr¨uneisen constants.The impact caused by the 2H to 1T′phase transition in MoTe_(2)hinders the propagation of phonons,thereby reducing thermal conductivity.Our study describes the possibility for the provision of the MoTe_(2)-based controllable and reversible thermal switch device.展开更多
Mg-Zn-Ca-Mn series alloys are developed as promising candidates of 5G communication devices with excellent thermal conductivities,great ductility,and acceptable strength.In present paper,Mg-x Zn-0.4Ca-0.2Mn(x=2wt%,4wt...Mg-Zn-Ca-Mn series alloys are developed as promising candidates of 5G communication devices with excellent thermal conductivities,great ductility,and acceptable strength.In present paper,Mg-x Zn-0.4Ca-0.2Mn(x=2wt%,4wt%,6wt%)alloys were prepared by a near-solidus extrusion and the effect of Zn content on mechanical and thermal properties were investigated.The results showed that the addition of minor Ca led to the formation of Ca_(2)Mg_(6)Zn_(3) eutectic phase at grain boundaries.A type of bimodal microstructure occurred in the as-extruded alloys,where elongated coarse deformed grains were embedded in refined recrystallized grains matrix.Correspondingly,both yield strength and ductility of the alloys were significantly enhanced after extrusion due to the great grain refinement.Specially,higher Zn content led to the increment in yield strength and a slight reduction in elongation due to the larger fractions of second phase particles.The room temperature thermal conductivity of as-extruded alloys was also improved compared with that of as-cast counterparts.The increment of Zn content decreased the thermal conductivity of both as-cast and as-extruded alloys,which was due to the increased second phase fraction and solution atoms in the matrix,that hindering the motion of electrons.The as-extruded Mg-2Zn-0.4Ca-0.2Mn(wt%)alloy exhibited the highest elongation of 27.7% and thermal conductivity of 139.2 W/(m·K),combined with an acceptable ultimate tensile strength of 244.0 MPa.The present paper provides scientific guidance for the preparation of lightweight materials with high ductility and high thermal conductivity.展开更多
Polymer-derived ceramic(PDC) thin films are promising wear-resistant coatings for protecting metals and carbon-carbon composites from corrosion and oxidation.However,the high pyrolysis temperature hinders the applicat...Polymer-derived ceramic(PDC) thin films are promising wear-resistant coatings for protecting metals and carbon-carbon composites from corrosion and oxidation.However,the high pyrolysis temperature hinders the applications on substrate materials with low melting points.We report a new synthesis route for PDC coatings using initiated chemical vapor deposited poly(1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane)(pV_3D_3) as the precurs or.We investigated the changes in siloxane moieties and the network topology,and proposed a three-stage mechanism for the thermal annealing process.The rise of the connectivity number for the structures obtained at increased annealing temperatures was found with strong correlation to the enhanced mechanical properties and thermal conductivity.Our PDC films obtained via annealing at 850℃ exhibit at least 14.6% higher hardness than prior reports for PDCs synthesized below 1100℃.Furthermore,thermal conductivity up to 1.02 W(mK)^(-1) was achieved at the annealing temperature as low as 700℃,which is on the same order of magnitude as PDCs obtained above 1100℃.Using minimum thermal conductivity models,we found that the thermal transport is dominated by diffusons in the films below the percolation of rigidity,while ultra-short mean-free path phonons contribute to the thermal conductivity of the films above the percolation threshold.The findings of this work provide new insights for the development of wear-resistant and thermally conductive PDC thin films for durable protection coatings.展开更多
The present work evaluated the properties of modified concrete using polyethylene terephthalate (PET) bottle waste as a partial replacement for coarse aggregate. Modified concrete samples were designed using a water/c...The present work evaluated the properties of modified concrete using polyethylene terephthalate (PET) bottle waste as a partial replacement for coarse aggregate. Modified concrete samples were designed using a water/cement (W/C) ratio of 0.50 and varying percentages of PET replacement (3%, 7%, 10%, and 15% by volume). Dreux Gorisse’s formulation approach was used to make the final products, and the mechanical properties of the samples were determined using Controlab presses. This modified concrete with PET chips has shown that with a 10% replacement of PET chips, the fresh density decreases by 3.56%, and the hardened state density decreases by 2.01%. The water absorption and thermal conductivity of the formulated concretes decreased. However, the results showed that the slump of these fresh concretes increased as the percentage of plastic aggregate replacement increased. Based on the results, incorporating PET aggregates into concrete contributes to good workability, and lightweight concrete structures, and provides some thermal comfort in concrete structures.展开更多
热界面材料是解决现代高功率和高集成化电子器件热量聚集和耗散的有效手段。基于三维网络结构调控导热性能的策略,以三聚氰胺泡沫(MF)为骨架,采用化学表面改性制备碳纳米管三维网络结构(CNT),并采用真空浸润法制备碳纳米管/天然橡胶热...热界面材料是解决现代高功率和高集成化电子器件热量聚集和耗散的有效手段。基于三维网络结构调控导热性能的策略,以三聚氰胺泡沫(MF)为骨架,采用化学表面改性制备碳纳米管三维网络结构(CNT),并采用真空浸润法制备碳纳米管/天然橡胶热界面复合材料(CNT/NR),研究CNT含量对材料微观结构、导热性能和热管理性能的影响。结果表明,当CNT的含量为2.2%(质量分数)时,CNT可附着于MF骨架并呈现完整连续的三维网络结构,其热界面复合材料垂直面外的导热率为1.58 W m^(-1) K^(-1),拉伸强度为12.9 MPa,断裂伸长率为489%,并具有显著的热管理性能,这表明CNT/NR热界面复合材料有望成为一种机具应用价值的热管理材料。展开更多
基金funded by the National Natural Science Foundation of China (NNSFC grant nos. 52103034, 51873126, 52175331 and 52003170)Shandong Provincial Natural Science Foundation (ZR2021QE014, ZR2020ZD04)
文摘Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree,operation frequency and power density,and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials.Compared to the conventional thermal management materials,flexible thermally conductive films with high in-plane thermal conductivity,as emerging candidates,have aroused greater interest in the last decade,which show great potential in thermal management applications of next-generation devices.However,a comprehensive review of flexible thermally conductive films is rarely reported.Thus,we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity,with deep understandings of heat transfer mechanism,processing methods to enhance thermal conductivity,optimization strategies to reduce interface thermal resistance and their potential applications.Lastly,challenges and opportunities for the future development of flexible thermally conductive films are also discussed.
基金National Natural Science Foundation of China(51773169 and 51973173)Guangdong Basic and Applied Basic Research Foundation(2019B1515120093)+2 种基金Technological Base Scientific Research ProjectsNatural Science Basic Research Plan for Distinguished Young Scholars in Shaanxi Province(2019JC-11)Polymer Electromagnetic Functional Materials Innovation Team of Shaanxi Sanqin Scholars.
文摘Rapid development of energy,electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites.However,the thermal conductivity coefficient(λ)values of prepared thermally conductive polymer composites are still difficult to achieve expectations,which has become the bottleneck in the fields of thermally conductive polymer composites.Aimed at that,based on the accumulation of the previous research works by related researchers and our research group,this paper proposes three possible directions for breaking through the bottlenecks:(1)preparing and synthesizing intrinsically thermally conductive polymers,(2)reducing the interfacial thermal resistance in thermally conductive polymer composites,and(3)establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization.Also,the future development trends of the three above-mentioned directions are foreseen,hoping to provide certain basis and guidance for the preparation,researches and development of thermally conductive polymers and their composites.
文摘As global warming intensifies, researchers worldwide strive to develop effective ways to reduce heat transfer. Among the natural fiber composites studied extensively in recent decades, bamboo has emerged as a prime candidate for reinforcement. This woody plant offers inherent strengths, biodegradability, and abundant availability. Due to its high cellulose content, its low thermal conductivity establishes bamboo as a thermally resistant material. Its low thermal conductivity, enhanced by a NaOH solution treatment, makes it an excellent thermally resistant material. Researchers incorporated Hollow Glass Microspheres (HGM) and Kaolin fillers into the epoxy matrix to improve the insulating properties of bamboo composites. These fillers substantially enhance thermal resistance, limiting heat transfer. Various compositions, like (30% HGM + 25% Bamboo + 65% Epoxy) and (30% Kaolin + 25% Bamboo + 45% Epoxy), were compared to identify the most efficient thermal insulator. Using Vacuum Assisted Resin Transfer Molding (VARTM) ensures uniform distribution of fillers and resin, creating a structurally sound thermal barrier. These reinforced composites, evaluated using the TOPSIS method, demonstrated their potential as high-performance materials combating heat transfer, offering a promising solution in the battle against climate change.
基金Financial supports from the National Natural Science Foundation of China(Nos.51474165 and 51204126)
文摘The microporous corundum material was prepared using alumina micro-powder as the main raw material, alumina sol and starch as binders by a wet process, achieving the bulk density of 3.05 g · cm^-3, the apparent porosity of 9. 1%, the closed porosity of 12.3%, the median pore diameter of 0. 43 μm, and the thermal conductivity of 6. 5 W· m^-1· K^-1 at 800 ℃ which is 41.6% lower than that of common corundum. The slag resistance of the microporous corundum material was studied by immersion and compared with that of the common corundum aggregate, and the slag resistant mechanism of microporous corundum material was revealed. The results show that the slag resistance of the microporous corundum material is superior to that of the common corundum aggregate, the SEM and EDX show that on the reaction interface between microporous corundum and molten, slag, a continuous isolation layer with a large quantity of CA2 and CA6 columnar crystals is formed; while the common corundum aggregate reacts with the molten slag interface to form a discontinuous isolation layer of columnar crystals, through which a lot of molten slag corrodes or permeates into the aggregate. The mechanism is mainly that the microporous structure is more advantageous to nucleation and growth of CA2 and CA6 columnar crystals; in the reaction with the aggregate, the molten slag gets saturated and the critical solution thickness of the microporous corundum and the common corundum is 0. 16 μm and 0. 34 μm, respectively, this is caused by the smaller microporous corundum aggregate pores; and the smaller pores also increase the second phase ripening rate of microporous corundum, which is 9. 7 times of that of the common corundum.
文摘High thermal conductivity dense silica bricks have the higher thermal conductivity than ordinary silica bricks,which is conducive to the realization of energy saving and emission reduction in the iron and steel industry.The performance of ordinary silica bricks and high thermal conductivity dense silica bricks was compared,and the high thermal conductivity mechanism was analyzed.The results show that(1)compared with ordinary silica bricks,high thermal conductivity dense silica bricks have the characteristics of higher thermal conductivity,lower apparent porosity,higher tridymite content,higher compressive strength,and higher thermal expansion;(2)by increasing the tridymite content and reducing the porosity,the close packing of honeycombα-tridymite improves the density and continuity of the SiO_(2)frame structure of the silica bricks,and the larger area perpendicular to the heat transfer direction improves the thermal conductivity of the bricks;(3)the densification of the silica bricks also increases the thermal expansion of the bricks,but they still meet the standard requirements.
基金the China Scholarship Council(Grant No.202107000030)RIE2020 Advanced Manufacturing and Engineering(AME)Programmatic(Grant No.A1898b0043)A*STAR Aerospace Programme(Grant No.M2115a0092)。
文摘The two-dimensional(2D)material-based thermal switch is attracting attention due to its novel applications,such as energy conversion and thermal management,in nanoscale devices.In this paper,we observed that the reversible 2H–1T′phase transition in MoTe_(2)is associated with about a fourfold/tenfold change in thermal conductivity along the X/Y direction by using first-principles calculations.This phenomenon can be profoundly understood by comparing the Mo–Te bonding strength between the two phases.The 2H-MoTe_(2)has one stronger bonding type,while 1T′-MoTe_(2)has three weaker types of bonds,suggesting bonding inhomogeneity in 1T′-MoTe_(2).Meanwhile,the bonding inhomogeneity can induce more scattering of vibration modes.The weaker bonding indicates a softer structure,resulting in lower phonon group velocity,a shorter phonon relaxation lifetime and larger Gr¨uneisen constants.The impact caused by the 2H to 1T′phase transition in MoTe_(2)hinders the propagation of phonons,thereby reducing thermal conductivity.Our study describes the possibility for the provision of the MoTe_(2)-based controllable and reversible thermal switch device.
基金supported by the Natural Science Basic Research Program of Shaanxi,China(Nos.2022JQ-305 and2022JQ-326)the Qin Chuang Yuan Platform High-Level Talent Project of Innovation and Entrepreneurship(No.QCYRCXM-2023-020)。
文摘Mg-Zn-Ca-Mn series alloys are developed as promising candidates of 5G communication devices with excellent thermal conductivities,great ductility,and acceptable strength.In present paper,Mg-x Zn-0.4Ca-0.2Mn(x=2wt%,4wt%,6wt%)alloys were prepared by a near-solidus extrusion and the effect of Zn content on mechanical and thermal properties were investigated.The results showed that the addition of minor Ca led to the formation of Ca_(2)Mg_(6)Zn_(3) eutectic phase at grain boundaries.A type of bimodal microstructure occurred in the as-extruded alloys,where elongated coarse deformed grains were embedded in refined recrystallized grains matrix.Correspondingly,both yield strength and ductility of the alloys were significantly enhanced after extrusion due to the great grain refinement.Specially,higher Zn content led to the increment in yield strength and a slight reduction in elongation due to the larger fractions of second phase particles.The room temperature thermal conductivity of as-extruded alloys was also improved compared with that of as-cast counterparts.The increment of Zn content decreased the thermal conductivity of both as-cast and as-extruded alloys,which was due to the increased second phase fraction and solution atoms in the matrix,that hindering the motion of electrons.The as-extruded Mg-2Zn-0.4Ca-0.2Mn(wt%)alloy exhibited the highest elongation of 27.7% and thermal conductivity of 139.2 W/(m·K),combined with an acceptable ultimate tensile strength of 244.0 MPa.The present paper provides scientific guidance for the preparation of lightweight materials with high ductility and high thermal conductivity.
基金funding from the National Natural Science Foundation of China (22178301,21938011,51876186and 52150410417)the funding from the Natural Science Foundation of Zhejiang Province (LR21B060003 and LZ19E060002)+1 种基金grant from Science Technology Department of Zhejiang Province (2023C01182)supported by Shanxi Institute of Zhejiang University for New Materials and Chemical Industry(2022SZ-TD005)。
文摘Polymer-derived ceramic(PDC) thin films are promising wear-resistant coatings for protecting metals and carbon-carbon composites from corrosion and oxidation.However,the high pyrolysis temperature hinders the applications on substrate materials with low melting points.We report a new synthesis route for PDC coatings using initiated chemical vapor deposited poly(1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane)(pV_3D_3) as the precurs or.We investigated the changes in siloxane moieties and the network topology,and proposed a three-stage mechanism for the thermal annealing process.The rise of the connectivity number for the structures obtained at increased annealing temperatures was found with strong correlation to the enhanced mechanical properties and thermal conductivity.Our PDC films obtained via annealing at 850℃ exhibit at least 14.6% higher hardness than prior reports for PDCs synthesized below 1100℃.Furthermore,thermal conductivity up to 1.02 W(mK)^(-1) was achieved at the annealing temperature as low as 700℃,which is on the same order of magnitude as PDCs obtained above 1100℃.Using minimum thermal conductivity models,we found that the thermal transport is dominated by diffusons in the films below the percolation of rigidity,while ultra-short mean-free path phonons contribute to the thermal conductivity of the films above the percolation threshold.The findings of this work provide new insights for the development of wear-resistant and thermally conductive PDC thin films for durable protection coatings.
文摘The present work evaluated the properties of modified concrete using polyethylene terephthalate (PET) bottle waste as a partial replacement for coarse aggregate. Modified concrete samples were designed using a water/cement (W/C) ratio of 0.50 and varying percentages of PET replacement (3%, 7%, 10%, and 15% by volume). Dreux Gorisse’s formulation approach was used to make the final products, and the mechanical properties of the samples were determined using Controlab presses. This modified concrete with PET chips has shown that with a 10% replacement of PET chips, the fresh density decreases by 3.56%, and the hardened state density decreases by 2.01%. The water absorption and thermal conductivity of the formulated concretes decreased. However, the results showed that the slump of these fresh concretes increased as the percentage of plastic aggregate replacement increased. Based on the results, incorporating PET aggregates into concrete contributes to good workability, and lightweight concrete structures, and provides some thermal comfort in concrete structures.
文摘热界面材料是解决现代高功率和高集成化电子器件热量聚集和耗散的有效手段。基于三维网络结构调控导热性能的策略,以三聚氰胺泡沫(MF)为骨架,采用化学表面改性制备碳纳米管三维网络结构(CNT),并采用真空浸润法制备碳纳米管/天然橡胶热界面复合材料(CNT/NR),研究CNT含量对材料微观结构、导热性能和热管理性能的影响。结果表明,当CNT的含量为2.2%(质量分数)时,CNT可附着于MF骨架并呈现完整连续的三维网络结构,其热界面复合材料垂直面外的导热率为1.58 W m^(-1) K^(-1),拉伸强度为12.9 MPa,断裂伸长率为489%,并具有显著的热管理性能,这表明CNT/NR热界面复合材料有望成为一种机具应用价值的热管理材料。
