In this paper, thermoelastic problem of onedimensional copper rod under thermal shock is simulated using molecular dynamics method by adopting embedded atom method potential. The rod is on axis x, the left outermost s...In this paper, thermoelastic problem of onedimensional copper rod under thermal shock is simulated using molecular dynamics method by adopting embedded atom method potential. The rod is on axis x, the left outermost surface of which is traction free and the right outermost surface is fixed. Free boundary condition is imposed on the outermost surfaces in direction y and z. The left and right ends of the rod are subjected to hot and cold baths, respectively. Temperature, displacement and stress distributions are obtained along the rod at different moments, which are shown to be limited in the mobile region, indicating that the heat propagation speed is limited rather than infinite. This is consistent with the prediction given by generalized thermoelastic theory. From simulation results we find that the speed of heat conduction is the same as the speed of thermal stress wave. In the present paper, the simulations are conducted using the large-scale atomic/molecular massively parallel simulator and completed visualization software.展开更多
Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid-liquid cast-rolling bonding(SLCRB) process. The solid-liquid bonding zone was assumed to be below t...Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid-liquid cast-rolling bonding(SLCRB) process. The solid-liquid bonding zone was assumed to be below the kiss point(KP). The deformation resistance of the liquid zone was ignored. Then, the calculation model was derived. A 2D thermal-flow coupled simulation was established to provide a basis for the parameters in the model, and then the rolling forces of the Cu/Al clad strip at different rolling speeds were calculated. Meanwhile, through measurement experiments, the accuracy of the model was verified. The influence of the rolling speed, the substrate strip thickness, and the material on the rolling force was obtained. The results indicate that the rolling force decreases with the increase of the rolling speed and increases with the increase of the thickness and thermal conductivity of the substrate strip. The rolling force is closely related to the KP height. Therefore, the formulation of reasonable process parameters to control the KP height is of great significance to the stability of cast-rolling forming.展开更多
基金supported by the National Natural Science Foundation of China (10872158)
文摘In this paper, thermoelastic problem of onedimensional copper rod under thermal shock is simulated using molecular dynamics method by adopting embedded atom method potential. The rod is on axis x, the left outermost surface of which is traction free and the right outermost surface is fixed. Free boundary condition is imposed on the outermost surfaces in direction y and z. The left and right ends of the rod are subjected to hot and cold baths, respectively. Temperature, displacement and stress distributions are obtained along the rod at different moments, which are shown to be limited in the mobile region, indicating that the heat propagation speed is limited rather than infinite. This is consistent with the prediction given by generalized thermoelastic theory. From simulation results we find that the speed of heat conduction is the same as the speed of thermal stress wave. In the present paper, the simulations are conducted using the large-scale atomic/molecular massively parallel simulator and completed visualization software.
基金The authors are grateful for the financial supports from the National Natural Science Foundation of China(51974278)the Distinguished Young Fund of Natural Science Foundation of Hebei Province,China(E2018203446).
文摘Based on twin-roll casting, a cast-rolling force model was proposed to predict the rolling force in the bimetal solid-liquid cast-rolling bonding(SLCRB) process. The solid-liquid bonding zone was assumed to be below the kiss point(KP). The deformation resistance of the liquid zone was ignored. Then, the calculation model was derived. A 2D thermal-flow coupled simulation was established to provide a basis for the parameters in the model, and then the rolling forces of the Cu/Al clad strip at different rolling speeds were calculated. Meanwhile, through measurement experiments, the accuracy of the model was verified. The influence of the rolling speed, the substrate strip thickness, and the material on the rolling force was obtained. The results indicate that the rolling force decreases with the increase of the rolling speed and increases with the increase of the thickness and thermal conductivity of the substrate strip. The rolling force is closely related to the KP height. Therefore, the formulation of reasonable process parameters to control the KP height is of great significance to the stability of cast-rolling forming.