Mechanical and thermo-physical properties of rapidly solidified Al-50Si-Cu(Mg) alloys for thermal management application

Al-high Si alloys were designed by the addition of Cu or Mg alloying elements to improve the mechanical properties. It is found that the addition of 1 wt.% Cu or 1 wt.% Mg as strengthening elements significantly improves the tensile strength by 27.2% and 24.5%, respectively. This phenomenon is attributed to the formation of uniformly dispersed fine particles(Al2Cu and Mg2Si secondary phases) in the Al matrix during hot press sintering of the rapidly solidified(gas atomization) powder. The thermal conductivity of the Al-50 Si alloys is reduced with the addition of Cu or Mg, by only 7.3% and 6.8%, respectively. Therefore, the strength of the Al-50 Si alloys is enhanced while maintaining their excellent thermo-physical properties by adding 1% Cu(Mg).

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films

While boron nitride(BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties,a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interracial interaction causing severe phonon scattering.Here,we report a novel surface modification strategy called the "self-modified nanointerface" using BN nanocrystals(BNNCs) to efficiently link the interface between BN and the polymer matrix.Combining with ice-press assembly method,an only 25 wt% BNembedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m-1K-1but also,more importantly,achieve a through-plane thermal conductivity as high as 21.3 W m-1K-1,which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers,the strong interaction between the self-modified fillers and polymer matrix,as well as ladder-structured BN skeleton.The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU.This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites.

Enhancing the thermal conductivity of nanofibrillated cellulose films with 1D BN belts formed by in-situ generation and sintering of BN nanosheets

The rapid miniaturization and high integration of modern electronic devices have brought an increasing demand for polymer-based thermal management materials with higher thermal conductivity.Boron nitride nanosheets(BNNs)have been widely used as thermally conductive fillers benefiting from the extremely high intrinsic thermal conductivity.However,the small lateral size and weak interface bonding of BNNs enabled them to only form thermally conductive networks through physical overlap,resulting in high interfacial thermal resistance.To address this issue,an innovative strategy based on interface engineering was proposed in this study.High-aspect-ratio boron nitride belts(BNbs)were successfully synthesized by carbon thermal reduction nitridation method through the in-situ generation and sintering of BNNs.The surface of BNb showed the sintering of numerous smaller-sized BNNs,which precisely addresses the issue of weak interfacial bonding between BNNs.On this basis,the as-synthesized BNbs were combined with nano-fibrillated cellulose(NFC)to prepare NFC/BNb composite films through a facile vacuum filtration process.Due to the thermally conductive network formed by the horizontal oriented arrangement of BNb and their particular morphological advantages,the NFC/BNb films demonstrated significantly higher in-plane thermal conductivity than that of NFC/BNNs films,achieving the highest value of 19.119 W·m^(−1)·K^(−1) at a 20 wt%filling fraction.In addition,the NFC/BNb films also exhibited superior thermal stability,mechanical strength,flexibility,and electrical insulation performance,suggesting the significant application potential of the designed BNb fillers in the thermal management field.

A Spiral Graphene Framework Containing Highly Ordered Graphene Microtubes for Polymer Composites with Superior Through-Plane Thermal Conductivity

As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management issues.Due to the ultra-high intrinsic thermal conductivity,graphene is considered a very promising filler to improve the thermal conductivity of polymers.However,graphene-based polymer composites prepared by the conventional mixing method generally have limited thermal conductivity,even under high graphene loading,due to the failure to construct efficient heat transfer pathways in the polymer matrix.Here,a spiral graphene framework(SGF)containing continuous and highly ordered graphene microtubes was developed based on a modified CVD method.After embedding into the epoxy(EP)matrix,the graphene microtubes can act as efficient heat pathways,endowing the SGF/EP composites with a high through-plane thermal conductivity of 1.35 W·m^(-1)·K^(-1) at an ultralow graphene loading of 0.86 wt%.This result gives a thermal conductivity enhancement per 1 wt%filler loading of 710%,significantly outperforming various graphene structures as fillers.In addition,we demonstrated the practical application of the SGF/EP composite as a thermal interface material for efficient thermal man-agement of the light-emitting diode(LED).