In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point con...In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.展开更多
Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of packaging.However,the thermal resistance model considering the structure of each part of the chip is still ...Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of packaging.However,the thermal resistance model considering the structure of each part of the chip is still ambiguous and rare,but it is quite desirable in engineering.In this work,we propose a detailed thermal resistance network model,and describe it by using thermal conduction resistance and thermal spreading resistance.For a striking FCBGA case,we calculated the thermal resistance of each part of the structure according to the temperature field simulated by COMSOL.The thermal resistance network can be used to predict the temperatures in the chip under different conditions.For example,when the power changes by 40%,the relative error of junction temperature prediction is only 0.24%.The function of the detailed thermal resistance network in evaluating the optimization space and determining the optimization direction is clarified.This work illustrates a potential thermal resistance analysis method for electronic devices such as FCBGA.展开更多
This work focuses on the efficiency of the LED acting as the heat sink containing Phase Change Material(PCM). Three different heat sink configurations(H-1, H-2, and H-3) are used in this study. Input power and the num...This work focuses on the efficiency of the LED acting as the heat sink containing Phase Change Material(PCM). Three different heat sink configurations(H-1, H-2, and H-3) are used in this study. Input power and the number of fins are altered to find their effect on junction temperatures, luminous flux, and thermal resistance. The junction temperature of heat sink H-3 with PCM decreased by 3.1 % when compared with heat sink devoid of PCM at 10 W. The thermal resistance of the heat sink H-3 is reduced by 18.2 % when compared to its counterpart devoid of PCM at 10 W. The luminous flux of the PCM filled heat sink H-3 is found to increase by 12.15 % against the PCM not filled heat sink H-1 at 10 W. The H-3 heat sink with PCM showed superior performance because of the enhanced natural convection and conduction in bulk PCM with fins, and with added high latent heat capacity of PCM.展开更多
基金Sponsored by the Heilongjiang Provincial Project(Grant No.12511121)the Harbin City Innovation Talent Project(Grant No.2011RFXXG019)the National Science and Technology Support Project(Grant No.2012BAH28F02)
文摘In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.
基金supported by the National Natural Science Foundation of China (NSFC) (Grants.52176078, and 51827807)the Research Foundation of Zhongxing Telecom Equipment Corporation (Analysis and optimization of internal thermal resistance of FCBGA chip)the Tsinghua University Initiative Scientific Research Program。
文摘Using thermal models to describe the heat dissipation process of FCBGA is a significant topic in the field of packaging.However,the thermal resistance model considering the structure of each part of the chip is still ambiguous and rare,but it is quite desirable in engineering.In this work,we propose a detailed thermal resistance network model,and describe it by using thermal conduction resistance and thermal spreading resistance.For a striking FCBGA case,we calculated the thermal resistance of each part of the structure according to the temperature field simulated by COMSOL.The thermal resistance network can be used to predict the temperatures in the chip under different conditions.For example,when the power changes by 40%,the relative error of junction temperature prediction is only 0.24%.The function of the detailed thermal resistance network in evaluating the optimization space and determining the optimization direction is clarified.This work illustrates a potential thermal resistance analysis method for electronic devices such as FCBGA.
文摘This work focuses on the efficiency of the LED acting as the heat sink containing Phase Change Material(PCM). Three different heat sink configurations(H-1, H-2, and H-3) are used in this study. Input power and the number of fins are altered to find their effect on junction temperatures, luminous flux, and thermal resistance. The junction temperature of heat sink H-3 with PCM decreased by 3.1 % when compared with heat sink devoid of PCM at 10 W. The thermal resistance of the heat sink H-3 is reduced by 18.2 % when compared to its counterpart devoid of PCM at 10 W. The luminous flux of the PCM filled heat sink H-3 is found to increase by 12.15 % against the PCM not filled heat sink H-1 at 10 W. The H-3 heat sink with PCM showed superior performance because of the enhanced natural convection and conduction in bulk PCM with fins, and with added high latent heat capacity of PCM.
