Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.

MICROSTRUCTURE CHARACTERISTICS AT THE BOND INTERFACE

Lift-off and section characteristics at the interface of thermosonic bond are observed by using scanning electron microscope （KYKY2800） with EDS-test. Results show that the peeling underdeveloped bonds simulate atorns （or doughnut） with an unbonded central region and ridged peripheral region is bonded hardly, Inside roundness at flip chip bonding center are discovered. Bond strength is located between the severely ridged periphery and the non-adhering central area of the bond. For constant force and time, the ridged area of the bond pattern increases when more power is applied. For constant force and power, the ridged location of the bonded region moves closer to the bond center with time. Results of EDS-tests at Au-Al and Au-Ag interfaces show that Kirkendall diffusibility at Au-Ag interface occur and the diffusing speed of Au-atomic is faster than that of Ag, and that intermetallic compounds at Au-Al interface is generated possibly. And these would be helpful for further research about thermosonic bonding.

Calculation Model for the Steady-State Vibration Amplitude of a New Type of Cascaded Composite Structure-Based Ultrasonic Transducer

The steady-state vibration amplitude is an important performance indicator of high-frequency ultrasonic transducers for ultrasonically assisted manipulating,machining,and manufacturing.This work aimed to develop a calculation model for the steady-state vibration amplitude of a new type of dual-branch cascaded composite structure-based ultrasonic transducer that can be used in the packaging of microelectronic chips.First,the steady-state vibration amplitude of the piezoelectric vibrator of the transducer was derived from the piezoelectric equation.Second,the vibration transfer matrices of the tapered ultrasonic horns were obtained by combining the vibration equation,the continuous condition of the displacement,and the equilibrium condition of the force.Calculation models for the steady-state vibration amplitude of the two working ends of the transducer were then developed.A series of exciting trials were carried out to test the performance of the models.Comparison between the calculated and measured results for steady-state vibration amplitude showed that the maximum deviation was 0.0221μm,the minimum deviation was 0.0013μm,the average deviation was 0.0097μm,and the standard deviation was 0.0046μm.These values indicated good calculation accuracy,laying a good foundation for the practical application of the proposed transducer.