The accurate monitoring of optical thin-film thickness is a key technique for depositing optical thin-film. For existing coating equipments, which are low precision and automation level on monitoring thin-film thickne...The accurate monitoring of optical thin-film thickness is a key technique for depositing optical thin-film. For existing coating equipments, which are low precision and automation level on monitoring thin-film thickness, a new photoelectric control and analysis system has been developed. In the new system, main techniques include a photoelectric system with dual-light path, a dual-lock-phase circuit system and a comprehensive digital processing-control-analysis system.The test results of new system show that the static and dynamic stabilities and the control precision of thin-film thickness are extremely increased. The standard deviation of thin-film thickness, which indicates the duplication of thin-film thickness monitoring, is equal to or less than 0.72%. The display resolution limit on reflectivity is 0.02 %. In the system, the linearity of drift is very high, and the static drift ratio approaches zero.展开更多
This article is dealing with a development of custom chip expander platform with the possibility of accurate temperature control and integration of additional silicon-based features. Such platform may serve as a usefu...This article is dealing with a development of custom chip expander platform with the possibility of accurate temperature control and integration of additional silicon-based features. Such platform may serve as a useful tool which facilitates the burdens connected with measurement and analysis tasks of experimental semiconductor structures. The devised solution provides the functionality of carrier substrate (Al2O3 compound) with CTE compatibility to the experimental silicon chip and is fully customizable with respect to a particular chip. It also allows achieving an easy fan-out of small-diameter chip terminals into a larger, more convenient area and placement of chip specimens conveniently into space-constrained chamber of the AFM microscopes, probe stations, etc. Real application of the developed chip expander platform is demonstrated in context of digital reconfigurable circuits based on polymorphic electronics. In this case the chip expander with attached polymorphic chip REPOMO is thermally stabilized at an ambient temperature level up to approximately 135。C and its sensitivity to this phenomenon is demonstrated.展开更多
基金Sponsored by the Ordnance Industry Scientific Research Fund(ZZ9682-3).
文摘The accurate monitoring of optical thin-film thickness is a key technique for depositing optical thin-film. For existing coating equipments, which are low precision and automation level on monitoring thin-film thickness, a new photoelectric control and analysis system has been developed. In the new system, main techniques include a photoelectric system with dual-light path, a dual-lock-phase circuit system and a comprehensive digital processing-control-analysis system.The test results of new system show that the static and dynamic stabilities and the control precision of thin-film thickness are extremely increased. The standard deviation of thin-film thickness, which indicates the duplication of thin-film thickness monitoring, is equal to or less than 0.72%. The display resolution limit on reflectivity is 0.02 %. In the system, the linearity of drift is very high, and the static drift ratio approaches zero.
文摘This article is dealing with a development of custom chip expander platform with the possibility of accurate temperature control and integration of additional silicon-based features. Such platform may serve as a useful tool which facilitates the burdens connected with measurement and analysis tasks of experimental semiconductor structures. The devised solution provides the functionality of carrier substrate (Al2O3 compound) with CTE compatibility to the experimental silicon chip and is fully customizable with respect to a particular chip. It also allows achieving an easy fan-out of small-diameter chip terminals into a larger, more convenient area and placement of chip specimens conveniently into space-constrained chamber of the AFM microscopes, probe stations, etc. Real application of the developed chip expander platform is demonstrated in context of digital reconfigurable circuits based on polymorphic electronics. In this case the chip expander with attached polymorphic chip REPOMO is thermally stabilized at an ambient temperature level up to approximately 135。C and its sensitivity to this phenomenon is demonstrated.
