A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

Optimization of Fixture Number in Large Thin-Walled Parts Assembly Based on IPSO

There are lots of researches on fixture layout optimization for large thin-walled parts.Current researches focus on the positioning problem,i.e.,optimizing the positions of a constant number of fixtures.However,how to determine the number of fixtures is ignored.In most cases,the number of fixtures located on large thin-walled parts is determined based on engineering experience,which leads to huge fixture number and extra waste.Therefore,this paper constructs an optimization model to minimize the number of fixtures.The constraints are set in the optimization model to ensure that the part deformation is within the surface profile tolerance.In addition,the assembly gap between two parts is also controlled.To conduct the optimization,this paper develops an improved particle swarm optimization(IPSO)algorithm by integrating the shrinkage factor and adaptive inertia weight.In the algorithm,particles are encoded according to the fixture position.Each dimension of the particle is assigned to a sub-region by constraining the optional position range of each fixture to improve the optimization efficiency.Finally,a case study on ship curved panel assembly is provided to prove that our method can optimize the number of fixtures while meeting the assembly quality requirements.This research proposes a method to optimize the number of fixtures,which can reduce the number of fixtures and achieve deformation control at the same time.

Development of Fixture Layout Optimization for Thin-Walled Parts:A Review

An increasing number of researchers have researched fixture layout optimization for thin-walled part assembly during the past decades.However,few papers systematically review these researches.By analyzing existing literature,this paper summarizes the process of fixture layout optimization and the methods applied.The process of optimization is made up of optimization objective setting,assembly variation/deformation modeling,and fixture layout optimization.This paper makes a review of the fixture layout for thin-walled parts according to these three steps.First,two different kinds of optimization objectives are introduced.Researchers usually consider in-plane variations or out-of-plane deformations when designing objectives.Then,modeling methods for assembly variation and deformation are divided into two categories:Mechanism-based and data-based methods.Several common methods are discussed respectively.After that,optimization algorithms are reviewed systematically.There are two kinds of optimization algorithms:Traditional nonlinear programming and heuristic algorithms.Finally,discussions on the current situation are provided.The research direction of fixture layout optimization in the future is discussed from three aspects:Objective setting,improving modeling accuracy and optimization algorithms.Also,a new research point for fixture layout optimization is discussed.This paper systematically reviews the research on fixture layout optimization for thin-walled parts,and provides a reference for future research in this field.

Vehicle-oriented ridesharing package delivery in blockchain system

Package delivery via ridesharing provides appealing benefits of lower delivery cost and efficient vehicle usage.Most existing ridesharing systems operate the matching of ridesharing in a centralized manner,which may result in the single point of failure once the controller breaks down or is under attack.To tackle such problems,our goal in this paper is to develop a blockchain-based package delivery ridesharing system,where decentralization is adopted to remove intermediaries and direct transactions between the providers and the requestors are allowed.To complete the matching process under decentralized structure,an Event-Triggered Distributed Deep Reinforcement Learning(ETDDRL)algorithm is proposed to generate/update the real-time ridesharing orders for the new coming ridesharing requests from a local view.Simulation results reveal the vast potential of the ETDDRL matching algorithm under the blockchain framework for the promotion of the ridesharing profits.Finally,we develop an application for Android-based terminals to verify the ETDDRL matching algorithm.

Meter-Scale Thin-Walled Structure with Lattice Infill for Fuel Tank Supporting Component of Satellite:Multiscale Design and Experimental Verification

Lightweight thin-walled structures with lattice infill are widely desired in satellite for their high stiffness-to-weight ratio and superior buckling strength resulting fromthe sandwich effect.Such structures can be fabricated bymetallic additive manufacturing technique,such as selective laser melting(SLM).However,the maximum dimensions of actual structures are usually in a sub-meter scale,which results in restrictions on their appliance in aerospace and other fields.In this work,a meter-scale thin-walled structure with lattice infill is designed for the fuel tank supporting component of the satellite by integrating a self-supporting lattice into the thickness optimization of the thin-wall.The designed structure is fabricated by SLM of AlSi10Mg and cold metal transfer welding technique.Quasi-static mechanical tests and vibration tests are both conducted to verify the mechanical strength of the designed large-scale lattice thin-walled structure.The experimental results indicate that themeter-scale thin-walled structure with lattice infill could meet the dimension and lightweight requirements of most spacecrafts.

Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment

Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits.

An electromagnetic semi-active dynamic vibration absorber for thin-walled workpiece vibration suppression in mirror milling

As critical components of aircraft skins and rocket fuel storage tank shells,large thin-walled workpieces are susceptible to vibration and deformation during machining due to their weak local stiffness.To address these challenges,we propose a novel tunable electromagnetic semi-active dynamic vibration absorber(ESADVA),which integrates with a magnetic suction follower to form a followed ESADVA(follow-ESADVA)for mirror milling.This system combines a tunable magnet oscillator with a follower,enabling real-time vibration absorption and condition feedback throughout the milling process.Additionally,the device supports self-sensing and frequency adjustment by providing feedback to a linear actuator,which alters the distance between magnets.This resolves the traditional issue of being unable to directly monitor vibration at the machining point due to space constraints and tool interference.The frequency shift characteristics and vibration absorption performance are comprehensively investigated.Theoretical and experimental results demonstrate that the prototyped follow-ESADVA achieves frequency synchronization with the milling tool,resulting in a vibration suppression rate of approximately 47.57%.Moreover,the roughness of the machined surface decreases by18.95%,significantly enhancing the surface quality.The results of this work pave the way for higher-quality machined surfaces and a more stable mirror milling process.

DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages

Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects.

Numerical Analysis of Cold-Formed Thin-Walled Steel Short Columns with Pitting Corrosion during Bridge Construction

Pitting corrosion is harmful during bridge construction,which will lead to uneven roughness of steel surfaces and reduce the thickness of steel.Hence,the effect of pitting corrosion on the mechanical properties of cold-formed thin-walled steel stub columns is studied,and the empirical formulas are established through regression fitting to predict the ultimate load of web and flange under pitting corrosion.In detail,the failure modes and load-displacement curves of specimens with different locations,area ratios,and depths are obtained through a large number of non-linear finite element analysis.As for the specimens with pitting corrosion on the web,all the specimens are subject to local buckling failure,and the failure mode will not change with pitting corrosion,but the failure location will change with pitting corrosion location;the size,location,and area ratio of pitting corrosion have little influence on the ultimate load of cold-formed thin-walled steel short columns,but the loss rate of pitting corrosion section area has a greater impact on the ultimate bearing capacity.As for the specimen with flange pitting corrosion,the location and area ratio of pitting corrosion have less influence on the ultimate load of cold-formed thin-walled steel short columns,and the section area loss rate has greater influence on the ultimate bearing capacity;the impact of web pitting corrosion on the ultimate load is greater than that of flange pitting corrosion under the same condition of pitting corrosion section area.The prediction formulas of limit load which are suitable for pitting corrosion of web and flange are established,which can provide a reference for performance evaluation of corroded cold-formed thin-walled steel.

Intervention package on stress management: Improving comprehensive well-being among nurses

Objective:The main objective of this study is to investigate the effectiveness of the stress management intervention package in improving stress-related burnout.Materials and Methods:An experimental study was done on 300 nurses selected by a nonprobability convenience sampling technique and a quasi-experimental one-group pre-and posttest research design was utilized.Modified expanded nurses stress scale and self-structured three-point Likert scale on the challenges that nurses may face following stressful life events utilized to collect information.The nurses signed up for six interactive sessions on various stress-coping methods by utilizing a variety of teaching strategies such as lecture cum discussion,video slides,group work,and direct interaction with the experts to explore stress-related issues.Results:Continuous stress affects both the body and the mind,causing psychosomatic symptoms.Data found that 2%to 10%of nurses frequently suffered with physical symptoms such as exhaustion,backache,acidity,headache,shoulder stiffness,and insomnia.Following the intervention,the number of nurses who had these symptoms frequently and sometimes decreased.Previously,10%of nurses experienced emotional symptoms frequently;however,after intervention,this figure was reduced to<2%.The greatest proportion of nurses(18%)reported frequently worrying,while 1.3%expressed frequent worrying after intervention.Maximum(5%)of nurses had a tendency to eat too little or too much;this has been reduced to 0.3%after the intervention.The intervention package on stress management significantly improved nurses’Conclusion:An intervention package for stress management was helpful in lowering physical,emotional,psychological,and behavioral stress-related symptoms among nurses.

Ex⁃situ Measurement of Internal Deformation in Ball Grid Array Package with Digital Volume Correlation

In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.

Sensitivity of springback and section deformation to process parameters in rotary draw bending of thin-walled rectangular H96 brass tube

In order to study the effects of the process parameters on springback and section deformation, a sensitivity analysis model was established based on the combination use of the multi-parameter sensitivity analysis method and the springback/section deformation prediction finite element model, and by using this model the sensitivities of the springback and the section deformation to process parameters were analyzed and compared. The results show that the most sensitive process conditions for springback angle are the boost speed and the pressure of pressure die, and the most sensitive process condition for section deformation is the number of cores. When the clamp force, the boost speed and the pressure of pressure die are utilized to control section deformation, the effect of these process parameters on springback should be considered. When the process parameters are mainly used to control springback, the effect of these process parameters on the section deformation should be always considered.

VIBRATION IN HIGH-SPEED MILLING OF THIN-WALLED COMPONENTS

To investigate the vibration principle in machining thin-walled components, a dynamic model for end milling of flexible structures is built based on considering the variations in the dynamic chip thickness and the differences between up-milling and down-milling. Two milling experiments verify the model. Experimental results show that the model can predict the milling force and displacements simultaneously in the dynamic milling process.

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Effect of Freshness Protection Package on Storage and Preservation of Chinese Cabbage

The effect of freshness protection package on Chinese cabbage placed in the self-made shelf in ventilated storage was investigated, and the physiological-qual-ity indexes change were determined during the storage period. The results showed that the losses of weight and vitamin C were significantly reduced. The accumula-tion of crude fiber was effectively inhibited. But protein content was maintained at a low level and the rotting more serious of Chinese cabbage at the end of the stor-age packaged with the fresh keeping bags.

Application of wavelet package filtering in the de-noising of fiber optic gyroscopes

To reduce the drift error existing in the output signal of fiber optic gyroscopes （FOG）, a mathematical model of the FOG output signal is set up; the error characteristics of the FOG output signal are analyzed, and semi-soft threshold filtering is chosen based on the comparison of hard threshold and soft threshold filtering. The semi-soft threshold wavelet package filtering method is applied in the filtering of the FOG output signal. Experiments of the stationary and dynamic FOG output signals filtered with the wavelet package analysis are carried out in a lab environment, respectively. Experiments done with the real-time measured FOG signal show that the method of semi-soft threshold wavelet package filtering reduces the mean square error from 5 （°）/h to 1 （°）/h, so it is effective in eliminating the white noises and the fractal noises existing in the FOG. The novel method proposed here is proved valid in reducing the FOG drift error, satisfying the technical demands of high precision and realtime processing.

Integrated power electronics module based on chip scale packaged power devices

High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.

利用Oracle PL/SQL Package实现Dispatcher设计模式

Dispatcher设计模式可以使用各种技术来实现。以社会保险业务处理为基础,有效地利用ORACLEPL/SQLPac-kage语言及支撑环境对面向对象技术的支持,通过定义消息ID、传递消息ID、撰写处理函数、连接消息ID和处理函数来实现Dispatcher设计模式,并且构造出能处理各项社会保险管理业务的Package组件。

Model of gas exchange dynamics for modified-atmosphere packages containing fresh produce

A model for modified-atmosphere packaging （MAP） systems containing fruits and vegetables was developed.The computer simulation was performed to predict the gas mass concentrations inside the packages and was successfully verified by experiments with yellow peaches at 5,15 and 25 ℃ using two types of packaging films.A Michaelis-Menten type respiration model with noncompetitive inhibition mechanism due to CO2 was adopted while the respiration rates were measured with an improved permeable system method suitable for either steady or unsteady state.The applicability of the model in the design of MAP systems was demonstrated with a calculation to evaluate film specification and equilibrium concentrations of O2 and CO2 in the package containing yellow peaches.

利用ORACLE PL/SQL PACKAGE实现DISPATCHER设计模式

以ORACLEPACKAGE语言及支撑环境为基础,有效地利用其对面向对象技术的支持,实现DISPATCHER设计模式。