The theoretical solutions are obtained for the three-dimensional(3-D)stress field in an infinite isotropic elastic plate with a through-the-thickness circular hole subjected to shear load at far field by using Kane an...The theoretical solutions are obtained for the three-dimensional(3-D)stress field in an infinite isotropic elastic plate with a through-the-thickness circular hole subjected to shear load at far field by using Kane and Mindlin′s assumption based on the stress function method.Based on the present solutions,the characteristics of 3-D stress field are analyzed and the emphasis is placed on the effects of the plate thickness and Poisson′s ratio on the deviation of the present 3-D in-plane stress from the related plane stress solutions,the stress concentration and the out-of-plane constraint.The present solutions show that the stress concentration factor reaches its peak value of about 8.9% which is higher than that of the plane stress solutions.As expected,the out-of-plane stress constraint factor can reach 1on the surface of the hole when the plate is a very thick one.展开更多
In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature...In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature of the substrate,the platen power and the etching intermittence had important influence on the etching rate and the etching morphology of the UHRS.The profiles and morphologies of sidewall were characterized with scanning electron microscopy(SEM).By using an improved three-stage Bosch process,380-μm deep through holes were fabricated on the UHRS with the average etching rate of about 3.14 μm/min.Meanwhile,the fabrication mechanism of deep through holes on the UHRS by using the three-stage Bosch process was illustrated on the basis of the experimental results.展开更多
基金Supported by the National Natural Science Foundation of China(11372269,10902057)
文摘The theoretical solutions are obtained for the three-dimensional(3-D)stress field in an infinite isotropic elastic plate with a through-the-thickness circular hole subjected to shear load at far field by using Kane and Mindlin′s assumption based on the stress function method.Based on the present solutions,the characteristics of 3-D stress field are analyzed and the emphasis is placed on the effects of the plate thickness and Poisson′s ratio on the deviation of the present 3-D in-plane stress from the related plane stress solutions,the stress concentration and the out-of-plane constraint.The present solutions show that the stress concentration factor reaches its peak value of about 8.9% which is higher than that of the plane stress solutions.As expected,the out-of-plane stress constraint factor can reach 1on the surface of the hole when the plate is a very thick one.
基金Project supported by the National Natural Science Foundation of China(Nos.61574108,61574112,61504099)
文摘In this paper,the etching characteristics of the ultra-high resistivity silicon(UHRS) by using the Bosch process were investigated.The experimental results indicated that the sulfur hexafluoride flux,the temperature of the substrate,the platen power and the etching intermittence had important influence on the etching rate and the etching morphology of the UHRS.The profiles and morphologies of sidewall were characterized with scanning electron microscopy(SEM).By using an improved three-stage Bosch process,380-μm deep through holes were fabricated on the UHRS with the average etching rate of about 3.14 μm/min.Meanwhile,the fabrication mechanism of deep through holes on the UHRS by using the three-stage Bosch process was illustrated on the basis of the experimental results.