Aiming at the problems that the simulation accuracy which is reduced due to the simplification of the model,a three-dimensional simulation method based on solid modeling is being proposed.By analyzing the motion relat...Aiming at the problems that the simulation accuracy which is reduced due to the simplification of the model,a three-dimensional simulation method based on solid modeling is being proposed.By analyzing the motion relationship and positional relationship between the caries knife and the workpiece,the coordinate system of the caries machining was established.With the MATLAB software,the cutting edge model and the blade sweeping surface model of the boring cutter are sequentially established.Boolean operation is performed on the blade swept surface formed by the tooth cutter teeth with time t and the workpiece tooth geometry as well as the undeformed three-dimensional chip geometry model and the instantaneous cogging geometry model are obtained at different times.Through the compare between gear end face simulation tooth profile and the theoretical inner arc tooth profile,we verified the accuracy and rationality of the proposed method.展开更多
Twisting the stacking of layered materials leads to rich new physics. A three-dimensional topological insulator film hosts two-dimensional gapless Dirac electrons on top and bottom surfaces, which, when the film is be...Twisting the stacking of layered materials leads to rich new physics. A three-dimensional topological insulator film hosts two-dimensional gapless Dirac electrons on top and bottom surfaces, which, when the film is below some critical thickness, will hybridize and open a gap in the surface state structure. The hybridization gap can be tuned by various parameters such as film thickness and inversion symmetry, according to the literature. The three-dimensional strong topological insulator Bi(Sb)Se(Te) family has layered structures composed of quintuple layers(QLs) stacked together by van der Waals interaction. Here we successfully grow twistedly stacked Sb_2Te_3 QLs and investigate the effect of twist angels on the hybridization gaps below the thickness limit. It is found that the hybridization gap can be tuned for films of three QLs, which may lead to quantum spin Hall states.Signatures of gap-closing are found in 3-QL films. The successful in situ application of this approach opens a new route to search for exotic physics in topological insulators.展开更多
In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is bu...In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure factors.An algorithm for testing cost and testing order optimization is proposed,and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as constraints.To prove the influence of the optimal stacking order on testing costs,two baselines stacked in sequential either in pyramid type or in inverted pyramid type are compared.Based on the benchmarks from ITC 02,experimental results show that for a 5-layer 3D IC,under different constraints,the optimal stacking order can reduce the test costs on average by 13%and 62%,respectively,compared to the pyramid type and inverted pyramid type.Furthermore,with the increase of the stack size,the test costs of the optimized stack order can be decreased.展开更多
A novel complex, (H 3O) 2[Ni(2,6-pydc) 2]·2H 2O was synthesized in an aqueous solution and characterized by means of single-crystal X-ray diffraction, elemental analyses and IR spectra. The X-ray structural a...A novel complex, (H 3O) 2[Ni(2,6-pydc) 2]·2H 2O was synthesized in an aqueous solution and characterized by means of single-crystal X-ray diffraction, elemental analyses and IR spectra. The X-ray structural analysis revealed that the novel compound forms three-dimensional(3D) networks by both π-π stacking and hydrogen-bonding interactions. The crystal data for the complex are a=13.853(3) nm, b=9.6892(19) nm, c=13.732(3) nm, α=90.00°, β=115.52(3)°, γ=90.00°, Z=3, R 1=0.0786, wR 2=0.1522.展开更多
Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more ph...Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more physical and electrical issues being caused by package-induced stress in SCSP were reported recently.The effect of structural factors,including die thickness,die attach film thickness,die attach film type,and spacer size on package induced stress,was investigated.Analyses were given based on simulation results and provide important suggestion for package design.展开更多
Metastasis is the leading cause of most cancer deaths, as opposed to dysregulated cell growth of the primary tumor. Molecular mechanisms of metastasis have been studied for decades and the findings have evolved our un...Metastasis is the leading cause of most cancer deaths, as opposed to dysregulated cell growth of the primary tumor. Molecular mechanisms of metastasis have been studied for decades and the findings have evolved our understanding of the progression of malignancy. However, most of the molecular mechanisms fail to address the causes of cancer and its evolutionary origin, demonstrating an inability to find a solution for complete cure of cancer. After being a neglected area of tumor biology for quite some time, recently several studies have focused on the impact of the tumor microenvironment on cancer growth. The importance of the tumor microenvironment is gradually gaining attention, particularly from the per- spective of biophysics. In vitro three-dimensional （3-D） metastatic models are an indispensable platform for investigating the tumor microenvironment, as they mimic the in vivo tumor tissue. In 3-D metastatic in vitro models, static factors such as the mechanical properties, biochemical factors, as well as dynamic factors such as cell-cell, cell-ECM interactions, and fluid shear stress can be studied quantitatively. With increasing focus on basic cancer research and drug development, the in vitro 3-D models offer unique advantages in fundamental and clinical biomedical studies.展开更多
A three-dimensional complex [Cu（3-ampy）（HEO）4]（SO4）·（H2O） （3-ampy = 3-amino- pyridine） has been synthesized. Crystallographic data： C5H16CuN2O9S, Mr = 343.80, triclinic, space group P1, a = 7.675（2）,...A three-dimensional complex [Cu（3-ampy）（HEO）4]（SO4）·（H2O） （3-ampy = 3-amino- pyridine） has been synthesized. Crystallographic data： C5H16CuN2O9S, Mr = 343.80, triclinic, space group P1, a = 7.675（2）, b = 8.225（3）, c = 10.845（3）A, α= 86.996（4）, β = 76.292（4）, γ= 68.890（4）°, V = 620.0（3）A^3, Z = 2, Dc = 1.841 g/cm^3, F（000） = 354 and μ = 1.971 mm^-1. The structure was refined to R = 0.0269 and wR = 0.0659 for 1838 observed reflections （I 〉 2a（/））. The structure consists of [Cu（3-ampy）（H2O）4]^2＋ cations, SO4^2- anions and lattice water molecules. 3-Ampy acting as a bidentate bridging ligand generates a 1D covalent chain. A supramolecular 2D framework is formed through π-π stacking of pyridine rings. The lattice water molecules and SO4^2- anions are located between the adjacent 2D frameworks. The hydrogen bonding interactions from lattice water molecules and SO4^2- anions to coordinate water extend the 2D framework into a 3D network.展开更多
Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of lightwaves, which provides a degree of freedom to expand data transmission capacity. Various techniques basedon bulky op...Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of lightwaves, which provides a degree of freedom to expand data transmission capacity. Various techniques basedon bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, theirinherent large size, extra loss, and precise alignment requirements make these techniques relativelydifficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips withcompact size and low loss provide a promising miniaturized candidate for tailoring light in the spatialdimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnectsthat are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonicchips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on theplatform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing,and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnectsusing OAM modes are demonstrated in the experiment with favorable performance. This work paves the wayto flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile opticalinterconnects and other emerging applications with spatial modes.展开更多
We demonstrate the direct loading of cold atoms into a microchip 2-mm Z-trap, where the evaporative cooling can be performed efficiently, from a macroscopic quadrupole magnetic trap with a high loading efficiency. The...We demonstrate the direct loading of cold atoms into a microchip 2-mm Z-trap, where the evaporative cooling can be performed efficiently, from a macroscopic quadrupole magnetic trap with a high loading efficiency. The macroscopic quadrupole magnetic trap potential is designed to be moveable by controlling the currents of the two pairs of anti-Helrnholtz coils. The cold atoms are initially prepared in a standard six-beam magneto-optical trap and loaded into the macroscopic quadrupole magnetic trap, and then transported to the atom chip surface by moving the macroscopic trap potential. By means of a three-dimensional absorption imaging system, we are able to optimize the position alignment of the atom cloud in the macroscopic trap and the microchip Z-shaped wire. Consequently, with a proper magnetic transfer scheme, we load the cold atoms into the microchip Z-trap directly and efficiently. The loading efficiency is measured to be about 50%. This approach can be used to generate appropriate ultracold atoms sources, for example, for a magnetically guided atom interferometer based on atom chip.展开更多
Mapping of three-dimensional network on chip is a key problem in the research of three-dimensional network on chip. The quality of the mapping algorithm used di- rectly affects the communication efficiency between IP ...Mapping of three-dimensional network on chip is a key problem in the research of three-dimensional network on chip. The quality of the mapping algorithm used di- rectly affects the communication efficiency between IP cores and plays an important role in the optimization of power consumption and throughput of the whole chip. In this paper, ba- sic concepts and related work of three-dimensional network on chip are introduced. Quantum-behaved particle swarm op- timization algorithm is applied to the mapping problem of three-dimensional network on chip for the first time. Sim- ulation results show that the mapping algorithm based on quantum-behaved particle swarm algorithm has faster con- vergence speed with much better optimization performance compared with the mapping algorithm based on particle swarm algorithm. It also can effectively reduce the power consumption of mapping of three-dimensional network on chip.展开更多
基金The National Natural Science Foundation of China (No.52165060,12272189)Program for Young Talents of Science and Technology in Universities of Inner Mongolia Autonomous Region: (NJYT23022)+2 种基金Science and Technology Projects of Inner Mongolia Autonomous Region: (2021GG0432)Central Guiding Local Science and Technology Development Plan (2022ZY0013)Basic research business fee project for universities directly under Inner Mongolia Autonomous Region (GXKY22046).
文摘Aiming at the problems that the simulation accuracy which is reduced due to the simplification of the model,a three-dimensional simulation method based on solid modeling is being proposed.By analyzing the motion relationship and positional relationship between the caries knife and the workpiece,the coordinate system of the caries machining was established.With the MATLAB software,the cutting edge model and the blade sweeping surface model of the boring cutter are sequentially established.Boolean operation is performed on the blade swept surface formed by the tooth cutter teeth with time t and the workpiece tooth geometry as well as the undeformed three-dimensional chip geometry model and the instantaneous cogging geometry model are obtained at different times.Through the compare between gear end face simulation tooth profile and the theoretical inner arc tooth profile,we verified the accuracy and rationality of the proposed method.
基金Supported by the National Natural Science Foundation of China (Grant Nos.61804056 and 92065102)。
文摘Twisting the stacking of layered materials leads to rich new physics. A three-dimensional topological insulator film hosts two-dimensional gapless Dirac electrons on top and bottom surfaces, which, when the film is below some critical thickness, will hybridize and open a gap in the surface state structure. The hybridization gap can be tuned by various parameters such as film thickness and inversion symmetry, according to the literature. The three-dimensional strong topological insulator Bi(Sb)Se(Te) family has layered structures composed of quintuple layers(QLs) stacked together by van der Waals interaction. Here we successfully grow twistedly stacked Sb_2Te_3 QLs and investigate the effect of twist angels on the hybridization gaps below the thickness limit. It is found that the hybridization gap can be tuned for films of three QLs, which may lead to quantum spin Hall states.Signatures of gap-closing are found in 3-QL films. The successful in situ application of this approach opens a new route to search for exotic physics in topological insulators.
基金The National Natural Science Foundation of China(No.61674048,61574052,61474036,61371025)the Project of Anhui Institute of Economics and Management(No.YJKT1417T01)
文摘In order to solve the problem that the testing cost of the three-dimensional integrated circuit(3D IC)is too high,an optimal stacking order scheme is proposed to reduce the mid-bond test cost.A new testing model is built with the general consideration of both the test time for automatic test equipment(ATE)and manufacturing failure factors.An algorithm for testing cost and testing order optimization is proposed,and the minimum testing cost and optimized stacking order can be carried out by taking testing bandwidth and testing power as constraints.To prove the influence of the optimal stacking order on testing costs,two baselines stacked in sequential either in pyramid type or in inverted pyramid type are compared.Based on the benchmarks from ITC 02,experimental results show that for a 5-layer 3D IC,under different constraints,the optimal stacking order can reduce the test costs on average by 13%and 62%,respectively,compared to the pyramid type and inverted pyramid type.Furthermore,with the increase of the stack size,the test costs of the optimized stack order can be decreased.
基金Supported by the National Natural Science Foundation of China(No.2 0 1710 10)
文摘A novel complex, (H 3O) 2[Ni(2,6-pydc) 2]·2H 2O was synthesized in an aqueous solution and characterized by means of single-crystal X-ray diffraction, elemental analyses and IR spectra. The X-ray structural analysis revealed that the novel compound forms three-dimensional(3D) networks by both π-π stacking and hydrogen-bonding interactions. The crystal data for the complex are a=13.853(3) nm, b=9.6892(19) nm, c=13.732(3) nm, α=90.00°, β=115.52(3)°, γ=90.00°, Z=3, R 1=0.0786, wR 2=0.1522.
文摘Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more physical and electrical issues being caused by package-induced stress in SCSP were reported recently.The effect of structural factors,including die thickness,die attach film thickness,die attach film type,and spacer size on package induced stress,was investigated.Analyses were given based on simulation results and provide important suggestion for package design.
基金supported by the National Basic Research Program of China(Grant No.2013CB837200)the National Natural Science Foundation of China(Grant No.11474345)the Beijing Natural Science Foundation,China(Grant No.7154221)
文摘Metastasis is the leading cause of most cancer deaths, as opposed to dysregulated cell growth of the primary tumor. Molecular mechanisms of metastasis have been studied for decades and the findings have evolved our understanding of the progression of malignancy. However, most of the molecular mechanisms fail to address the causes of cancer and its evolutionary origin, demonstrating an inability to find a solution for complete cure of cancer. After being a neglected area of tumor biology for quite some time, recently several studies have focused on the impact of the tumor microenvironment on cancer growth. The importance of the tumor microenvironment is gradually gaining attention, particularly from the per- spective of biophysics. In vitro three-dimensional （3-D） metastatic models are an indispensable platform for investigating the tumor microenvironment, as they mimic the in vivo tumor tissue. In 3-D metastatic in vitro models, static factors such as the mechanical properties, biochemical factors, as well as dynamic factors such as cell-cell, cell-ECM interactions, and fluid shear stress can be studied quantitatively. With increasing focus on basic cancer research and drug development, the in vitro 3-D models offer unique advantages in fundamental and clinical biomedical studies.
基金the Natural Science Found Council of China (Nos. 20671011, 20331010, 90406002 and 90406024) the Key Laboratory of Structural Chemistry Foundation (No. 060017)
文摘A three-dimensional complex [Cu（3-ampy）（HEO）4]（SO4）·（H2O） （3-ampy = 3-amino- pyridine） has been synthesized. Crystallographic data： C5H16CuN2O9S, Mr = 343.80, triclinic, space group P1, a = 7.675（2）, b = 8.225（3）, c = 10.845（3）A, α= 86.996（4）, β = 76.292（4）, γ= 68.890（4）°, V = 620.0（3）A^3, Z = 2, Dc = 1.841 g/cm^3, F（000） = 354 and μ = 1.971 mm^-1. The structure was refined to R = 0.0269 and wR = 0.0659 for 1838 observed reflections （I 〉 2a（/））. The structure consists of [Cu（3-ampy）（H2O）4]^2＋ cations, SO4^2- anions and lattice water molecules. 3-Ampy acting as a bidentate bridging ligand generates a 1D covalent chain. A supramolecular 2D framework is formed through π-π stacking of pyridine rings. The lattice water molecules and SO4^2- anions are located between the adjacent 2D frameworks. The hydrogen bonding interactions from lattice water molecules and SO4^2- anions to coordinate water extend the 2D framework into a 3D network.
基金This work was supported by the National Natural Science Foundation of China(Grant Nos.62125503 and 62261160388)the Key R&D Program of Hubei Province of China(Grant Nos.2020BAB001 and 2021BAA024)+2 种基金the Key R&D Program of Guangdong Province(Grant No.2018B030325002)the Shenzhen Science and Technology Program(Grant No.JCYJ20200109114018750)the Innovation Project of Optics Valley Laboratory(Grant No.OVL2021BG004).
文摘Explosive growth in demand for data traffic has prompted exploration of the spatial dimension of lightwaves, which provides a degree of freedom to expand data transmission capacity. Various techniques basedon bulky optical devices have been proposed to tailor light waves in the spatial dimension. However, theirinherent large size, extra loss, and precise alignment requirements make these techniques relativelydifficult to implement in a compact and flexible way. In contrast, three-dimensional (3D) photonic chips withcompact size and low loss provide a promising miniaturized candidate for tailoring light in the spatialdimension. Significantly, they are attractive for chip-assisted short-distance spatial mode optical interconnectsthat are challenging to bulky optics. Here, we propose and fabricate femtosecond laser-inscribed 3D photonicchips to tailor orbital angular momentum (OAM) modes in the spatial dimension. Various functions on theplatform of 3D photonic chips are experimentally demonstrated, including the generation, (de)multiplexing,and exchange of OAM modes. Moreover, chip-chip and chip–fiber–chip short-distance optical interconnectsusing OAM modes are demonstrated in the experiment with favorable performance. This work paves the wayto flexibly tailor light waves on 3D photonic chips and offers a compact solution for versatile opticalinterconnects and other emerging applications with spatial modes.
基金Project supported by the National Natural Science Foundation of China(Grant No.11604348)
文摘We demonstrate the direct loading of cold atoms into a microchip 2-mm Z-trap, where the evaporative cooling can be performed efficiently, from a macroscopic quadrupole magnetic trap with a high loading efficiency. The macroscopic quadrupole magnetic trap potential is designed to be moveable by controlling the currents of the two pairs of anti-Helrnholtz coils. The cold atoms are initially prepared in a standard six-beam magneto-optical trap and loaded into the macroscopic quadrupole magnetic trap, and then transported to the atom chip surface by moving the macroscopic trap potential. By means of a three-dimensional absorption imaging system, we are able to optimize the position alignment of the atom cloud in the macroscopic trap and the microchip Z-shaped wire. Consequently, with a proper magnetic transfer scheme, we load the cold atoms into the microchip Z-trap directly and efficiently. The loading efficiency is measured to be about 50%. This approach can be used to generate appropriate ultracold atoms sources, for example, for a magnetically guided atom interferometer based on atom chip.
文摘Mapping of three-dimensional network on chip is a key problem in the research of three-dimensional network on chip. The quality of the mapping algorithm used di- rectly affects the communication efficiency between IP cores and plays an important role in the optimization of power consumption and throughput of the whole chip. In this paper, ba- sic concepts and related work of three-dimensional network on chip are introduced. Quantum-behaved particle swarm op- timization algorithm is applied to the mapping problem of three-dimensional network on chip for the first time. Sim- ulation results show that the mapping algorithm based on quantum-behaved particle swarm algorithm has faster con- vergence speed with much better optimization performance compared with the mapping algorithm based on particle swarm algorithm. It also can effectively reduce the power consumption of mapping of three-dimensional network on chip.
