The three-dimensional numerical manifold method(3D-NMM),which is based on the derivation of Galerkin's variation,is a powerful calculation tool that uses two cover systems.The 3D-NMM can be used to handle continue...The three-dimensional numerical manifold method(3D-NMM),which is based on the derivation of Galerkin's variation,is a powerful calculation tool that uses two cover systems.The 3D-NMM can be used to handle continue-discontinue problems and extend to THM coupling.In this study,we extended the 3D-NMM to simulate both steady-state and transient heat conduction problems.The modelling was carried out using the raster methods(RSM).For the system equation,a variational method was employed to drive the discrete equations,and the crucial boundary conditions were solved using the penalty method.To solve the boundary integral problem,the face integral of scalar fields and two-dimensional simplex integration were used to accurately describe the integral on polygonal boundaries.Several numerical examples were used to verify the results of 3D steady-state and transient heat-conduction problems.The numerical results indicated that the 3D-NMM is effective for handling 3D both steadystate and transient heat conduction problems with high solution accuracy.展开更多
A class of two-level explicit difference schemes are presented for solving three-dimensional heat conduction equation. When the order of truncation error is 0(Deltat + (Deltax)(2)), the stability condition is mesh rat...A class of two-level explicit difference schemes are presented for solving three-dimensional heat conduction equation. When the order of truncation error is 0(Deltat + (Deltax)(2)), the stability condition is mesh ratio r = Deltat/(Deltax)(2) = Deltat/(Deltay)(2) = Deltat/(Deltaz)(2) less than or equal to 1/2, which is better than that of all the other explicit difference schemes. And when the order of truncation error is 0((Deltat)(2) + (Deltax)(4)), the stability condition is r less than or equal to 1/6, which contains the known results.展开更多
Based on constructal theory,the constructs of three "volume-point" heat conduction models with three-dimensional cylindrical element and rectangular and triangular elements on microscale and nanoscale are op...Based on constructal theory,the constructs of three "volume-point" heat conduction models with three-dimensional cylindrical element and rectangular and triangular elements on microscale and nanoscale are optimized by taking minimum entransy dissipation rate as optimization objective.The optimal constructs of the three "volume-point" heat conduction models with minimum dimensionless equivalent thermal resistance are obtained.The results show that the optimal constructs of the three-dimensional cylindrical assembly based on the minimizations of dimensionless equivalent thermal resistance and dimensionless maximum thermal resistance are different,which is obviously different from the comparison between those of the corresponding two-dimensional rectangular assembly based on the minimizations of these two objectives.The optimal constructs based on rectangular and triangular elements on microscale and nanoscale when the size effect takes effect are obviously different from those when the size effect does not take effect.Because the thermal current density in the high conductivity channel of the rectangular and triangular second order assemblies are not linear with the length,the optimal constructs of these assemblies based on the minimization of entransy dissipation rate are different from those based on the minimization of maximum temperature difference.The dimensionless equivalent thermal resistance defined based on entransy dissipation rate reflects the average heat transfer performance of the construct.The studies on "volume-point" heat conduction constructal problems at three-dimensional conditions and microscale and nanoscale by taking minimum entransy dissipation rate as optimization objective extend the application range of the entransy dissipation extremum principle.展开更多
The mathematical model of the semiconductor device of heat conduction has been described by a system of four equations. The optimal order estimates in L2 norm are derived for the error in the approximates solution, pu...The mathematical model of the semiconductor device of heat conduction has been described by a system of four equations. The optimal order estimates in L2 norm are derived for the error in the approximates solution, putting fotward a kind of characteristic finite difference fractional step methods.展开更多
The dynamics of unsteady magnetohydrodynamic convective fluid flow with radiation and thermophoresis of particles past a vertical porous plate moving through a binary mixture in an optically thin environment is invest...The dynamics of unsteady magnetohydrodynamic convective fluid flow with radiation and thermophoresis of particles past a vertical porous plate moving through a binary mixture in an optically thin environment is investigated. The approximate form of the radiative heat flux is considered as the fourth power of temperature. Chemical reaction that occurs as the chemically reacting fluid flow through binary mixture is accounted for in energy and species concentration equations. Exponential space dependent heat source is introduced to generate additional heat energy across the fluid domain. The corresponding influence of heat energy is properly accounted for. It is assumed that viscosity and thermal conductivity vary as a linear function of temperature. The governing boundary layer equations are converted to nonlinear ordinary differential equations using similarity variables. A novel method of obtaining root finding starting with three guesses in shooting techniques is presented. The corresponding nonlinear coupled ordinary differential equations is solved numerically by shooting technique along with quadratic interpolation scheme. Graphical results of the dimensionless velocity, temperature and concentration distributions are shown for certain pertinent parameters controlling the fluid flow. The quadratic interpolation method is found to produce better estimated values of , which satisfy the degree of accuracy and proportional to the physical quantities.展开更多
The formula of the thickness of the heat-insulating layer is deduced via heat transfer analysis,according to the principle of heat transfer in limited space.Polishing experiments are carried out using the same technol...The formula of the thickness of the heat-insulating layer is deduced via heat transfer analysis,according to the principle of heat transfer in limited space.Polishing experiments are carried out using the same technological parameters.Compared with the polishing experimental results,the heat transfer model is proved to be correct.As validated by the experimental results,polyurethane heat-insulating layer can effectively improve the service life of the ice fixed abrasive pad and alleviate the melting rate in the polishing process to improve the polishing quality proposed.The heat transfer model provides theoretical basis for research of temperature field of ice fixed abrasive polishing.展开更多
The exact variational formulation of the extended unsteady heat conduction equation with finite propagation speed (the 2nd sound speed) of hyperbolic type is derived herein via a systematic and natural way. Moreover...The exact variational formulation of the extended unsteady heat conduction equation with finite propagation speed (the 2nd sound speed) of hyperbolic type is derived herein via a systematic and natural way. Moreover, the boundary- and the physically acceptable initial-value conditions are accommodated in the variational principle by a novel method suggested just recently. In this way a perfect justification of the variational theory of transient heat conduction and a rigorous theoretical basis for the finite element analysis of heat conduction are provided.展开更多
The numerical simulation of a three-dimensional semiconductor device is a fundamental problem in information science. The mathematical model is defined by an initialboundary nonlinear system of four partial differenti...The numerical simulation of a three-dimensional semiconductor device is a fundamental problem in information science. The mathematical model is defined by an initialboundary nonlinear system of four partial differential equations: an elliptic equation for electric potential, two convection-diffusion equations for electron concentration and hole concentration, and a heat conduction equation for temperature. The first equation is solved by the conservative block-centered method. The concentrations and temperature are computed by the block-centered upwind difference method on a changing mesh, where the block-centered method and upwind approximation are used to discretize the diffusion and convection, respectively. The computations on a changing mesh show very well the local special properties nearby the P-N junction. The upwind scheme is applied to approximate the convection, and numerical dispersion and nonphysical oscillation are avoided. The block-centered difference computes concentrations, temperature, and their adjoint vector functions simultaneously.The local conservation of mass, an important rule in the numerical simulation of a semiconductor device, is preserved during the computations. An optimal order convergence is obtained. Numerical examples are provided to show efficiency and application.展开更多
This new work aims to develop a full coupled thermomechanical method including both the temperature profile and displacements as primary unknowns of the model.This generic full coupled 3D exact shell model permits the...This new work aims to develop a full coupled thermomechanical method including both the temperature profile and displacements as primary unknowns of the model.This generic full coupled 3D exact shell model permits the thermal stress investigation of laminated isotropic,composite and sandwich structures.Cylindrical and spherical panels,cylinders and plates are analyzed in orthogonal mixed curved reference coordinates.The 3D equilibrium relations and the 3D Fourier heat conduction equation for spherical shells are coupled and they trivially can be simplified in those for plates and cylindrical panels.The exponential matrix methodology is used to find the solutions of a full coupled model based on coupled differential relations with respect to the thickness coordinate.The analytical solution is based on theories of simply supported edges and harmonic relations for displacement components and sovra-temperature.The sovra-temperature magnitudes are directly applied at the outer faces through static state hypotheses.As a consequence,the sovra-temperature description is assumed to be an unknown variable of themodel and it is calculated in the sameway as the three displacements.The final systemis based on a set of coupled homogeneous differential relations of second order in the thickness coordinate.This system is reduced in a first order differential relation system by redoubling the number of unknowns.Therefore,the exponential matrix methodology is applied to calculate the solution.The temperature field effects are evaluated in the static investigation of shells and plates in terms of displacement and stress components.After an appropriate preliminary validation,new benchmarks are discussed for several thickness ratios,geometrical data,lamination sequences,materials and sovra-temperature values imposed at the outer faces.Results make evident the accordance between the uncoupled thermo-mechanical model and this new full coupled thermo-mechanical model without the need to separately solve the Fourier heat conduction relation.Both effects connected with the thickness layer and the related embedded materials are included in the conducted thermal stress analysis.展开更多
基金supported by the National Natural Science Foundation of China(Grant Nos.42277165,41920104007,and 41731284)the Fundamental Research Funds for the Central Universities,China University of Geosciences(Wuhan)(Grant Nos.CUGCJ1821 and CUGDCJJ202234)the National Overseas Study Fund(Grant No.202106410040)。
文摘The three-dimensional numerical manifold method(3D-NMM),which is based on the derivation of Galerkin's variation,is a powerful calculation tool that uses two cover systems.The 3D-NMM can be used to handle continue-discontinue problems and extend to THM coupling.In this study,we extended the 3D-NMM to simulate both steady-state and transient heat conduction problems.The modelling was carried out using the raster methods(RSM).For the system equation,a variational method was employed to drive the discrete equations,and the crucial boundary conditions were solved using the penalty method.To solve the boundary integral problem,the face integral of scalar fields and two-dimensional simplex integration were used to accurately describe the integral on polygonal boundaries.Several numerical examples were used to verify the results of 3D steady-state and transient heat-conduction problems.The numerical results indicated that the 3D-NMM is effective for handling 3D both steadystate and transient heat conduction problems with high solution accuracy.
文摘A class of two-level explicit difference schemes are presented for solving three-dimensional heat conduction equation. When the order of truncation error is 0(Deltat + (Deltax)(2)), the stability condition is mesh ratio r = Deltat/(Deltax)(2) = Deltat/(Deltay)(2) = Deltat/(Deltaz)(2) less than or equal to 1/2, which is better than that of all the other explicit difference schemes. And when the order of truncation error is 0((Deltat)(2) + (Deltax)(4)), the stability condition is r less than or equal to 1/6, which contains the known results.
基金supported by the National Natural Science Foundation of China (Grant No. 51176203)the Natural Science Foundation of Naval University of Engineering (Grant No. HGDYDJJ10011)the Natural Science Foundation for Youngsters of Naval University of Engineering (Grant No. HGDQNJJ10017)
文摘Based on constructal theory,the constructs of three "volume-point" heat conduction models with three-dimensional cylindrical element and rectangular and triangular elements on microscale and nanoscale are optimized by taking minimum entransy dissipation rate as optimization objective.The optimal constructs of the three "volume-point" heat conduction models with minimum dimensionless equivalent thermal resistance are obtained.The results show that the optimal constructs of the three-dimensional cylindrical assembly based on the minimizations of dimensionless equivalent thermal resistance and dimensionless maximum thermal resistance are different,which is obviously different from the comparison between those of the corresponding two-dimensional rectangular assembly based on the minimizations of these two objectives.The optimal constructs based on rectangular and triangular elements on microscale and nanoscale when the size effect takes effect are obviously different from those when the size effect does not take effect.Because the thermal current density in the high conductivity channel of the rectangular and triangular second order assemblies are not linear with the length,the optimal constructs of these assemblies based on the minimization of entransy dissipation rate are different from those based on the minimization of maximum temperature difference.The dimensionless equivalent thermal resistance defined based on entransy dissipation rate reflects the average heat transfer performance of the construct.The studies on "volume-point" heat conduction constructal problems at three-dimensional conditions and microscale and nanoscale by taking minimum entransy dissipation rate as optimization objective extend the application range of the entransy dissipation extremum principle.
文摘The mathematical model of the semiconductor device of heat conduction has been described by a system of four equations. The optimal order estimates in L2 norm are derived for the error in the approximates solution, putting fotward a kind of characteristic finite difference fractional step methods.
文摘The dynamics of unsteady magnetohydrodynamic convective fluid flow with radiation and thermophoresis of particles past a vertical porous plate moving through a binary mixture in an optically thin environment is investigated. The approximate form of the radiative heat flux is considered as the fourth power of temperature. Chemical reaction that occurs as the chemically reacting fluid flow through binary mixture is accounted for in energy and species concentration equations. Exponential space dependent heat source is introduced to generate additional heat energy across the fluid domain. The corresponding influence of heat energy is properly accounted for. It is assumed that viscosity and thermal conductivity vary as a linear function of temperature. The governing boundary layer equations are converted to nonlinear ordinary differential equations using similarity variables. A novel method of obtaining root finding starting with three guesses in shooting techniques is presented. The corresponding nonlinear coupled ordinary differential equations is solved numerically by shooting technique along with quadratic interpolation scheme. Graphical results of the dimensionless velocity, temperature and concentration distributions are shown for certain pertinent parameters controlling the fluid flow. The quadratic interpolation method is found to produce better estimated values of , which satisfy the degree of accuracy and proportional to the physical quantities.
基金supported by the National Natural Science Foundation of China(No.51375237)the Natural Science Foundation of Jiangsu Province(No.BK2012796)the Scientific Research Start Project of Talent Introduction of NUAA(No.1005-56YAH)
文摘The formula of the thickness of the heat-insulating layer is deduced via heat transfer analysis,according to the principle of heat transfer in limited space.Polishing experiments are carried out using the same technological parameters.Compared with the polishing experimental results,the heat transfer model is proved to be correct.As validated by the experimental results,polyurethane heat-insulating layer can effectively improve the service life of the ice fixed abrasive pad and alleviate the melting rate in the polishing process to improve the polishing quality proposed.The heat transfer model provides theoretical basis for research of temperature field of ice fixed abrasive polishing.
基金The support of the National Natural Science Foundation of China (Grant No. 50136030) the Shanghai Leading Acad. Discipline Project (No. Y0103) is gratefully appreciated.
文摘The exact variational formulation of the extended unsteady heat conduction equation with finite propagation speed (the 2nd sound speed) of hyperbolic type is derived herein via a systematic and natural way. Moreover, the boundary- and the physically acceptable initial-value conditions are accommodated in the variational principle by a novel method suggested just recently. In this way a perfect justification of the variational theory of transient heat conduction and a rigorous theoretical basis for the finite element analysis of heat conduction are provided.
基金supported the Natural Science Foundation of Shandong Province(ZR2016AM08)Natural Science Foundation of Hunan Province(2018JJ2028)National Natural Science Foundation of China(11871312).
文摘The numerical simulation of a three-dimensional semiconductor device is a fundamental problem in information science. The mathematical model is defined by an initialboundary nonlinear system of four partial differential equations: an elliptic equation for electric potential, two convection-diffusion equations for electron concentration and hole concentration, and a heat conduction equation for temperature. The first equation is solved by the conservative block-centered method. The concentrations and temperature are computed by the block-centered upwind difference method on a changing mesh, where the block-centered method and upwind approximation are used to discretize the diffusion and convection, respectively. The computations on a changing mesh show very well the local special properties nearby the P-N junction. The upwind scheme is applied to approximate the convection, and numerical dispersion and nonphysical oscillation are avoided. The block-centered difference computes concentrations, temperature, and their adjoint vector functions simultaneously.The local conservation of mass, an important rule in the numerical simulation of a semiconductor device, is preserved during the computations. An optimal order convergence is obtained. Numerical examples are provided to show efficiency and application.
文摘This new work aims to develop a full coupled thermomechanical method including both the temperature profile and displacements as primary unknowns of the model.This generic full coupled 3D exact shell model permits the thermal stress investigation of laminated isotropic,composite and sandwich structures.Cylindrical and spherical panels,cylinders and plates are analyzed in orthogonal mixed curved reference coordinates.The 3D equilibrium relations and the 3D Fourier heat conduction equation for spherical shells are coupled and they trivially can be simplified in those for plates and cylindrical panels.The exponential matrix methodology is used to find the solutions of a full coupled model based on coupled differential relations with respect to the thickness coordinate.The analytical solution is based on theories of simply supported edges and harmonic relations for displacement components and sovra-temperature.The sovra-temperature magnitudes are directly applied at the outer faces through static state hypotheses.As a consequence,the sovra-temperature description is assumed to be an unknown variable of themodel and it is calculated in the sameway as the three displacements.The final systemis based on a set of coupled homogeneous differential relations of second order in the thickness coordinate.This system is reduced in a first order differential relation system by redoubling the number of unknowns.Therefore,the exponential matrix methodology is applied to calculate the solution.The temperature field effects are evaluated in the static investigation of shells and plates in terms of displacement and stress components.After an appropriate preliminary validation,new benchmarks are discussed for several thickness ratios,geometrical data,lamination sequences,materials and sovra-temperature values imposed at the outer faces.Results make evident the accordance between the uncoupled thermo-mechanical model and this new full coupled thermo-mechanical model without the need to separately solve the Fourier heat conduction relation.Both effects connected with the thickness layer and the related embedded materials are included in the conducted thermal stress analysis.